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LG B2000 Service Manual

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Service Manual
B2000
P/N : MMBD0047201
Date : March 2005 / Issue 1.0

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Summary of Contents for LG B2000

  • Page 1 Service Manual B2000 P/N : MMBD0047201 Date : March 2005 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION......2 5. DOWNLOAD AND CALIBRATION .......88 1.1 Purpose ...........2 1.2 Regulatory Information ....2 5.1 Download ........88 1.3 Abbreviations ........4 5.2 Calibration ........93 2. PERFORMANCE ......6 6. BLOCK DIAGRAM .....96 2.1 H/W Feature ........6 7. CIRCUIT DIAGRAM ....99 2.2 Technical Specification ....8 3.

  • Page 3: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system byan unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecom- munications services.
  • Page 4 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 5: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
  • Page 6 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...

  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 780 mAh Standard Battery Battery Size: 105.5(W) x 44(H) x 15.8(T) [mm] Battery Weight: TBD Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.
  • Page 8 2. PERFORMANCE Item Feature Comment Speaker / Receiver One way dual speaker Travel Adapter MIDI 40 Poly (Mono SPK) MP3/AAC Options Data Cable - 7 -...

  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification I I tem Description Specification EGSM TX : 890 + (n-1024) × 0.2 MHz RX : 935 + (n-1024) × 0.2 MHz (n=975~1024) Frequency Band TX : 1710 + (n -512) × 0.2 M z RX : 1805 + (n –512) x 0.2 MHz (n=512~885) TX : 1810 + (n-512) ×...
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 –30 –33 –60 600 ~ <1,200 –60 1,200 ~ <1,800 –60 1,800 ~ <3,000 –63 3,000 ~ <6,000 –65 Output RF Spectrum 6,000 –71 (due to modulation) DCS, PCS, Offset from Carrier (kHz).
  • Page 11 2. PERFORMANCE Item Description Specification DCS, PCS Offset from Carrier (kHz). Max. dBm Output RF Spectrum –22 (due to switching transient) –24 1,200 –24 1,800 –27 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @–102 dBm Bit Error Ratio , EGSM BER (Class II) <...
  • Page 12 2. PERFORMANCE Item Description Specification Frequency (Hz) Max. (dB) Min. (dB) –12 – – –7 –5 Receiving Respons 1,000 –5 3,000 –5 3,400 –10 4,000 Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. 5 dB STMR Stability Margin...
  • Page 13 2. PERFORMANCE Item Description Specification Fast Charge : < 430 mA Charge Current Slow Charge : < 160 mA Antenna Bar Number Power –85 dBm ~ –90 dBm ~ –86 dBm Antenna Display –95 dBm ~ –91 dBm –100 dBm ~ –96 dBm –105 dBm ~ –101 dBm ~ –105 dBm Battery Bar Number...

  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4205-BM, U500) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltagesup- ply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellularhand- sets and wireless data modems.
  • Page 15 3. TECHNICAL BRIEF (1) Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the onchip integration of the channel selection filters, eliminating the external RF imagereject filters and the IF SAW filter required in conventional super-heterodynearchitectures. A.
  • Page 16 3. TECHNICAL BRIEF Figure 3-2 SI4205 RECEIVER PART B. Intermediatefrequency (IF) and Demodulation A quadratureimage-reject mixer downconvertsthe RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes. The mixer out- put is amplified with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2).
  • Page 17 3. TECHNICAL BRIEF (2) Transmitter Part The transmit (Tx) section consists of an I/Q basebandupconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external poweramplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
  • Page 18 3. TECHNICAL BRIEF B. OPLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz.
  • Page 19 3. TECHNICAL BRIEF (3) Frequency Synthesizer Figure 3-4 SI4205 FREQUENCY SYNTHESIZER PART SynthesizerThe Aero I transceiver integrates two complete PLLsincluding VCOs, varactors, res- onators, loop filters, reference and VCO dividers, and phase detectors. The RFPLL uses two multi- plexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode.

  • Page 20: Power Amplifier Module

    3. TECHNICAL BRIEF 3.2 Power Amplifier Module (RF3166, U501 The RF3166 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The device is a self-contained 6mmx6mm module with 50•ÿ input and output terminals. The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands.

  • Page 21: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.3 13 MHz Clock (VCTCXO, X500) The 13 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U101, AD6537B), digital base band chipset (U100, AD6527). 2V75_VVCXO X500 R516...
  • Page 22 3. TECHNICAL BRIEF RF2VBS VBAT U702 MIC5255-85BM5 CLKON C533 C734 C534 0.01u (1608) Table 3-7 RF LDO CIRCUIT DIAGRAM - 21 -...

  • Page 23: Digital Main Processor

    3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6527, U100) AD6527/AD6527B GSM-PROCESSOR KEYPADCOL[7:0] Keypad JTAGEN TCK, TMS Matrix KEYPADROW[7:0] JTAG TDI, TDO BACKLIGHT[3.0] Backlight/ JTAG, HSL, GPIO Service Light Servicelight Universal USCTX/RX/CLK System Connector Enhaoced Generic serial port A (USC) Generic serial port B Generic serial port D ROMCS[1:0] Flash...
  • Page 24 3. TECHNICAL BRIEF • AD6527 is an ADI designed processor • AD6527 consists of 1. Control Processor Subsystem • 32-bit ARM7TDMI Control Processor • 58.5 MHz operation at 1.7V • On-board 16KB instruction/Data Cache • 1 Mbitsof on-chip System SRAM 2.
  • Page 25 3. TECHNICAL BRIEF 3.5.1 Interconnection with external devices A. RTC block interfaceCountered by external X-TALThe X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by AD6527(U100),DBB.In operating mode, the AD6527(U100) controls the LCD module through _LCD_CS, LCD_DIM_CTRL, LCD_RESET, _WR, 2V8_VMEM, LCD_ID, LCD_BL_EN.
  • Page 26 3. TECHNICAL BRIEF The backlight of LCD module is controlled by DBB via TPS60230RGTR , U400. The control signals related to Backlight LED are given bellow. Signals Description LCD_DIM_CTL Control LCD backlight level in 16 steps (GPO 5) LCD_LED_CTL Control LCD LED LCD_LED_GND LCD_BL_EN It Controls back-light of LCD module.
  • Page 27 3. TECHNICAL BRIEF D. SIM interface The AD6527 provides SIM Interface Module. The AD6527 checks status periodically duringestablished call mode whether SIM card is inserted or not, but it doesn't check during deepSleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,SIM_RST(GPIO_23) are required.
  • Page 28 3. TECHNICAL BRIEF AD6527/AD6527B AD6535 Serial Link Audio Baseband Subsystem and Power Management DSP BUS EBUS PBUS DMA and BUS RBUS IM ARBITRATION SBUS SRAM Peripheral FLASH Subsystem Subsystem ® (ARM7TDMI RF-Control Figure 3-10 AD6527 ARCHITECTURE The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three mainsubsys- tems connected together through a dynamic and flexible communication bus network.

  • Page 29: Analog Main & Power Management Processor

    3. TECHNICAL BRIEF 3.6 Analog Main & Power Management Processor (AD6537B, U101) AD6525 AD6537B LEDs Light Othello Controllers AD6526 Crystal & Varactor GMSK Filter Filter Tone Filter Headphones or Headset Filter Battery 8 Voltage Regulators Charger VCORE: 1.8 V, 80mA VABB VMEM: 1.8 or 2.8V, 150mA VMIC: 2.5V, 1mA...
  • Page 30 3. TECHNICAL BRIEF • AD6537B is an ADI designed Analog Basebandprocessor. AD6537B covers the processing GMSKmodulation interface, Aux ADC, Voice signal processing and Power Management. • AD6537B consists of 1. BB Transmit section •GMSK Modulation •I-channel & Q-channel Transmit DACsand Filters •Power Ramping DAC 2.
  • Page 31 3. TECHNICAL BRIEF 3.6.1 BasebandTransmit Section 1. The AD6537B BasebandTransmit Section is designed to support GMSK for both single-slotand multi-slot application. 2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACsanda matched pair of reconstruction filter. AD6537B BSIFS Active...
  • Page 32 3. TECHNICAL BRIEF 3.6.3 Auxiliary Section 1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers,an Auxiliary ADC, and light controllers.•AFC DAC: 13 bits 2. This section also contains AUX ADC and Voltage Reference • IDAC: 10 bits •...
  • Page 33 4. It interconnects with external devices like main microphone, main receiver, and headset. The descriptions of audio port used in B2000 are given bellow in detail. <Up Link> - AIN1P,AIN1N : Main microphone positive/negative terminal...

  • Page 34: Power Management

    3. TECHNICAL BRIEF 3.6.5 Power Management AD6537B CSFS VABB Baseband Analog Control CSDI LDO Regulator Serial CSDO Port Microphone VMIC 2.5V, 1mA LDO Regulator Didital Core 1.8V, 80mA LDO Regulator VCORE VCXO VVCXO 2.75V, 10mA LDO Regulator Memory Interface 1.8 or 2.8V, 150mA LDO Regulator VMEM VEXT...
  • Page 35 3. TECHNICAL BRIEF AD6537B VCORE Enable Digital Core LDO Regulator Mode Enable VMEM Memory Interface THERM Thermal LDO Regulator Shutdown Mode Enable DDLO VEXT External Interface VEXT mode UVLO LDO Regulator Control Bit Mode CHGDET VSIMEn Enable VBAT VSIM SIM Interface Control Bit LDO Regulator KEYON...
  • Page 36 3. TECHNICAL BRIEF 3. Battery Charging Block 1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process -Check charger is inserted or not -If AD6537B detects that Charger is inserted, the CC-CV charging starts.
  • Page 37 3. TECHNICAL BRIEF From Headset Microphone To Headset Speaker Figure 3-19 B2000 HEADSET SPEAKER/MIC CIRCUIT (AD6537B) From Main Microphone To Main Receiver Figure 3-20 B2000 MAIN SPEAKER/MIC CIRCUIT (AD6537B) - 36 -...
  • Page 38 3. TECHNICAL BRIEF NORMAL CHARGING Trickle- CHARGING Figure 3-21 CIRCUIT FOR BATTERY CHARGING AT AD6537B In order to reduce time for trickle charging, additional circuit(Pre-charge circuit) was included.This circuit has supplied Max 160mA current into the battery additionally. So call it, it reduce trickle charging time - 37 -...

  • Page 39: Display And Interface

    3. TECHNICAL BRIEF 3.7 Display and Interface Properties Spec. Unit Active Screen Size 28.022(H) X 28.022(V) Color Depth 65,000 colors Resolution 128 X RGB X 128 dots Pixel Size 0.063(H) X 0.209(V) Controlled by _LCD_CS, LCD_RESET, _WR, DATA[00:15], LCD_ID, •_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin •LCD_RESET : This pin resets LCD module.
  • Page 40 3. TECHNICAL BRIEF R401 R400 Figure 3-23 LCD INTERFACE CIRCUIT - 39 -...

  • Page 41: Radio Interface

    3. TECHNICAL BRIEF 3.8 Radio Interface B2000 has a built-inFM Radio.FM Radio Uses Ear Micas the Antenna. IC for FM Radio is Niigata NS953. B2000 can produce FM Radio Sound Both through Speakerand Ear Mic. 6 1 ( ) 8 0 u 1 .

  • Page 42: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.9 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on thekeypad layer of the PCB when pressed. There are 21 switches (Normal Key 21EA, No sidekey), connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 3-27, except for the power switch, which is connected independently.

  • Page 43: Microphone

    Figure 3-28 Connection between Microphone and AD6537B 3.11 Main Speaker In the case of B2000, The main speaker is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain is controlled by the PGA in an AD6537B. - 42 -...

  • Page 44: Headset Interface

    3. TECHNICAL BRIEF 3.12 Headset Interface This phone chooses a 5 pin type headset which has 6 electrodessuch as HEADSET_SPK_OUT_P, HEADSET_MIC_P, JACK_DETECT, HEADSET_SPK_OUT_N, RADIO_ANT. This type supports stereo sound Switching from Receiver to Headset Jack If jack is inserted, JACK_DETECT goes from high to low. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.

  • Page 45: Key Back-Light Illumination

    3. TECHNICAL BRIEF 3.13 Key Back-light Illumination In key back-light illumination, there are 6 Blue LEDsin Main Board, which are driven byMIDI_KEY_BL1 and MIDI_KEY_BL2 signal from ML2871HB. Figure 3-30 KEY BACK-LIGHT ILLUMINTION - 44 -...

  • Page 46: Vibrator

    3. TECHNICAL BRIEF 3.14 VIBRATOR The vibrator is placed in the folder cover and contacted toLCD MODULE. The vibrator isdriven from MIDI_VIBRATOR from ML2871HB. Figure 3-32 MOTOR - 45 -...

  • Page 47: Trouble Shooting

    4 . TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RX Trouble TEST POINT Mobile SW TRANCEIVER 13Mhz OSCILLATOR Figure 4-1(a) - 46 -...
  • Page 48 4 . TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check regulator circuit Check VCTCXO Check FEM & Mobile SW Check RX IQ Redownload SW or Do calibration again - 47 -...
  • Page 49 4 . TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT Figure 4-2 CIRCUIT RF2V85 VBAT U702 MIC5255-85BM5 CLKON C533 C734 C534 0.01u (1608) Checking Flow Level at Voltage at Change main board Pin3 of U702 Pin5 of U702 Is high? Is 2.8V? Regulator Circuit is OK Replace U702...
  • Page 50 4 . TROUBLE SHOOTING (2) Checking VCTCXO Circuit Checking Flow TEST POINT VCTCXO Circuit is OK Check Pin 3. 13 MHz O.K? See next Page to check Refer to Graph 4-1 (b) ANT SW & Mobile SW 2.7V OK? Changing X500 Check Pin 4.
  • Page 51 4 . TROUBLE SHOOTING (3) Checking FEM & Mobile SW TEST POINT CIRCUIT Figure 4-5 Waveform FEM Control GSM & DCS Graph 4-3(a) FEM Control PCS Graph 4-3(b) - 50 -...
  • Page 52 4 . TROUBLE SHOOTING Checking Flow For these 2 No Call connection is needed Check SW501 Pin ANT,RF Changing SW500 Open with RF Cable connected . Check SW500 Pin ANT,RF Short Changing SW500 with No RF Cable Connected Check R512, R515, R517 VC1 :Low or HIGH Check whether FEM Changing the board...
  • Page 53 4 . TROUBLE SHOOTING (4) Checking RX IQ TEST POINT CIRCUIT Waveform Graph 4-4 Checking Flow Che ck C514, C516. Similar? Replace U500 Check if there is Any Major Difference Refer to Graph 4-4 Redownload software and calibration againg - 52 -...

  • Page 54: Tx Trouble

    4 . TROUBLE SHOOTING 4.2 TX Trouble TEST POINT Mobile SW TRANCEIVER 13Mhz OSCILLATOR - 53 -...
  • Page 55 4 . TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check regulator circuit Check VCTCXO Check FEM & Mobile SW Check PAM contral signal Check TX IQ Redownload SW or...
  • Page 56 4 . TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT CIRCUIT RF2V85 VBAT U702 MIC5255-85BM5 CLKON C533 C734 C534 0.01u (1608) Checking Flow Level at Voltage at Change main board Pin3 of U702 Pin5 of U702 Is high? Is 2.8V? Replace U702 Regulator Circuit is OK See next Page to check...
  • Page 57 4 . TROUBLE SHOOTING (2) Checking VCTCXO Circuit Checking Flow TEST POINT VCTCXO Circuit is OK 13 MHz O.K? See next Page to check Check Pin 3. ANT SW & Mobile SW Refer to Graph 4-1 (b) 2.7V OK? Changing X500 Check Pin 4.
  • Page 58 4 . TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW TEST POINT Figure 4-5 CIRCUIT Waveform VC1 LOW VC2 LOW VC3 HIGH FEM Control EGSM Graph 4-6(a) VC1 LOW VC2 HIGH VC3 LOW FEM Control DCS & PCS Graph 4-6(b) - 57 -...
  • Page 59 4 . TROUBLE SHOOTING Checking Flow For the test, TX Stand alone Mode is needed. Refer to chapter 11 (PL=7 for GSM, PL=2 for DCS) Check R512, R515, R517 Check whether FEM Check VC1, VC2, VC3 Changing board Set as TX mode Refer to Graph4-6(a), 4-6(b) Refer to Table 4-3 Go to 4.3.5 Checking PAM...
  • Page 60 4 . TROUBLE SHOOTING (4) Checking PAM Control Signal TEST POINT CIRCUIT Waveform TX_RAMP Band Select (R501) GSM TX_Low DCS/PCS TX_High PAM_EN Graph 4-7 Checking Flow Check TX_RAMP and PA_EN Similar? Download S/W Check if there is Any Major Difference or not Refer to Graph 4-7 Go to Next Step - 59 -...
  • Page 61 4 . TROUBLE SHOOTING (6) Checking TX IQt Waveform TEST POINT Graph 4-8 CIRCUIT Checking Flow Check if there is Similar? Replace U500 Any Major Difference Refer to Graph 4-8 Redownload the Software And calibrate - 60 -...

  • Page 62: Power On Trouble

    4 . TROUBLE SHOOTING 4.3 Power On Trouble TEST POINT CIRCUIT - 61 -...
  • Page 63 4 . TROUBLE SHOOTING Checking Flow START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power key And check the level change Or dome-switch of PWRKEY Check the voltage of Replace U101 The LDO outputs at U101 VCORE=1.8V WCXO=2.75V...

  • Page 64: Charging Trouble

    4 . TROUBLE SHOOTING 4.4 Charging Trouble TEST POINT R108 Q100 D100 CIRCUIT - 63 -...
  • Page 65 4 . TROUBLE SHOOTING Checking Flow Resolder the CN300 I/O Connector (CN300) Pin 4,5 : VCHARGE is well-solderd? Pin 12,26.30 : GND The TA is out of order Voltage at anode of Change the TA D100 = 5.2 V? Resoler the Q100, D100, R108 Q100, D100, R108 are well-soldered?

  • Page 66: Vibrator Trouble

    4 . TROUBLE SHOOTING 4.5 Vibrator Trouble TEST POINT CIRCUIT . 2 - - 65 -...
  • Page 67 4 . TROUBLE SHOOTING Checking Flow SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu START Is the voltage at pin 3 Check the soldering of U401 high? of R315, R399 Resolder R315, R399 Is the voltage at pin 1 Check the soldering of U401 high?

  • Page 68: Lcd Trouble

    4 . TROUBLE SHOOTING 4.6 LCD Trouble TEST POINT - 67 -...
  • Page 69 4 . TROUBLE SHOOTING Checking Flow START Check the soldering of Resoldering CN400 CN400 ? Is the connection of Reassemble FPCB with CN400 connector FPCB with connector on PCB(CN400) ok ? Check the soldering of Resoldering EMI filter (FL400~FL403) EMI filter ? Does LCD work Replace LCD module properly ?

  • Page 70: Radio Trouble

    4 . TROUBLE SHOOTING 4.7 Radio Trouble TEST POINT U U 7 7 0 0 0 0 X X 2 2 0 0 0 0 U U 7 7 0 0 1 1 CIRCUIT - 69 -...
  • Page 71 4 . TROUBLE SHOOTING Checking Flow START Insert Earmic to earjack Level of Resolder R421 RADIO_DETECT Is high? Earphone will work Set the audio part of the test properly Equipment to echo mode Check Level Level 1,2,8,9 pin U205 works Can you hear your 2,8,1,9 pin of U701 Of U700 is...

  • Page 72: Speaker Trouble

    4 . TROUBLE SHOOTING 4.8 Speaker Trouble TEST POINT - 71 -...

  • Page 73: Circuit Diagram

    4 . TROUBLE SHOOTING CIRCUIT DIAGRAM - 72 -...
  • Page 74 4 . TROUBLE SHOOTING Checking Flow START Check the state of Reassemble speaker contact of dual mode speaker Check Re-solder U202 U202 works properly Check Re-solder U206 U206 works properly Check Voltage level of Re-solder the components 4,5 pin of U206 Replace U203 Speaker Change main board...

  • Page 75: Sim Card Interface Trouble

    4 . TROUBLE SHOOTING 4.9 SIM Card Interface Trouble TEST POINT CIRCUIT DIAGRAM - 74 -...
  • Page 76 4 . TROUBLE SHOOTING Checking Flow START Change the SIM Card. Our Phone Does the SIM cards supports only 3V SIM card supports 3V? Voltage Replace J300 or check Voltage at pin1 of at VSIM of U101 soldering of components J300 is 3V? Is 3V? Change the SIM Card...

  • Page 77: Earphone Trouble

    4 . TROUBLE SHOOTING 4.10 Earphone Trouble TEST POINT J200 U205 U200 U201 CIRCUIT DIAGRAM - 76 -...
  • Page 78 4 . TROUBLE SHOOTING Checking Flow START Resolder J200 Does the audio Level at profile of the phone Resolder R123, R216 JACK_DETECT signal change to the or Replace J200 is low earphone mode? Set the audio part of the test Equipment Change the earphone to echo mode and try again...

  • Page 79: Key Backlight Trouble

    4 . TROUBLE SHOOTING 4.11 KEY backlight Trouble TEST POINT - 78 -...
  • Page 80 4 . TROUBLE SHOOTING CIRCUIT DIAGRAM Checking Flow START Is the voltage level VBAT Charge battery 3.6~4.2V? Are all LEDs Check the soldering Working? each R and LED Replace or resoldering Backlight will work properly component - 79 -...

  • Page 81: Receiver Trouble

    4 . TROUBLE SHOOTING 4.12 Receiver Trouble TEST POINT CIRCUIT DIAGRAM - 80 -...
  • Page 82 4 . TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Check the state of Reassemble receiver contact of dual mode speaker (receiver) U202 works...

  • Page 83: Microphone Trouble

    4 . TROUBLE SHOOTING 4.13 Microphone Trouble TEST POINT CIRCUIT DIAGRAM - 82 -...
  • Page 84 4 . TROUBLE SHOOTING Checking Flow SETTING : After intialize Agilent 8960, Test EGSM, DCS mode START Voltage across R200 Voltage VMIC of U101 Replace U101 = DC 2.5V? = DC 2.5V? Resolder R200 & R203 Check the signal Replace microphone Level at each side of MIC200 mV AC?

  • Page 85: Rtc Trouble

    4 . TROUBLE SHOOTING 4.14 RTC Trouble TEST POINT CIRCUIT DIAGRAM - 84 -...
  • Page 86 4 . TROUBLE SHOOTING Checking Flow START Is the voltage Charge or change BAT100 level of BAT100 > 1.2V? Check Soldering of Resolder R104. C112, C149 R104, C112, C149 Check the voltage at Resolder R110, C130 or 1,4 of X100 Replace X100 Change main board - 85 -...

  • Page 87: Indication Led Trouble

    4 . TROUBLE SHOOTING 4.15 Indication LED Troublet TEST POINT Q301 Q401 CIRCUIT DIAGRAM - 86 -...
  • Page 88 4 . TROUBLE SHOOTING Checking Flow Indication LED only operates in trickle charging mode. START Voltage level Voltage level at 3pin of Q401 at 2pin of Q401 Is about 40mV Is about 680mV Resolder Q401 Resolder Q301 Voltage level Check soldering of Resolder R350 at 2pin of Q301 R350...

  • Page 89: Download And Calibration

    5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 5-1 describes Download setup UART Figure 5-1 DOWNLOAD SETUP - 88 -...
  • Page 90 5. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase(Don’t check OWCD). 1. Select 2. Select Port Rate 3. Select Hermes 4. Select Erase 5. Insert FDI region . Donʼt Check OWUD 2. Press Start and Wait until Erase is completed. 2.
  • Page 91 5. DOWNLOAD AND CALIBRATION 3. Press Write to start Download and press key to choose software (AlchemyDate.mot) 1. Select Port 2. Check 3. Check - 90 -...
  • Page 92 5. DOWNLOAD AND CALIBRATION 4. Choose software 4. Choose software 1. Select File 2. Press Open 5. Wait until coverting from MOT to BIF is completed (Don’t check OWUD) 5. Wait until coverting from MOT to BIF is completed (Donʼt check OWUD) 3.
  • Page 93 5. DOWNLOAD AND CALIBRATION 6. Press Start and Pover on the phone using JIG remote Power on (Switch 1) - 92 -...

  • Page 94: Calibration

    5. DOWNLOAD AND CALIBRATION 5.2 Calibration A. Equipment List Equipment for Calibration Type/Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIO interface card HP-GPIB Agilent Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium II class above 300MHz...
  • Page 95 5. DOWNLOAD AND CALIBRATION Figure 5-3 THE TOP VIEW OF TEST JIG C. Test Jig Operation Power Source Description Power Supply Usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 5-2 JIG POWER Switch Number Name Description Switch 1 ADI-REMOTE In ON state, phone is awaked.
  • Page 96 5. DOWNLOAD AND CALIBRATION 1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3rd, 4thof DIP SW ON state always 4.

  • Page 97: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM - Base Band SIM_RST/ CLK/DATA VSIM USC(0:5) DEBUG BAT_TEMP VBAT VCHG VCHG - 96 -...
  • Page 98 6. BLOCK DIAGRAM 6. BLOCK DIAGRAM - RF - 97 -...

  • Page 100: Circuit Diagram

    7. CIRCUIT DIAGRAM & - 99 -...
  • Page 101 7. CIRCUIT DIAGRAM & - 100 -...
  • Page 102 7. CIRCUIT DIAGRAM & - 101 -...
  • Page 103 7. CIRCUIT DIAGRAM T L I & - 102 -...
  • Page 104 7. CIRCUIT DIAGRAM & - 103 -...

  • Page 105: Pcb Layout

    8. PCB LAYOUT - 104 -...
  • Page 106 8. PCB LAYOUT - 105 -...

  • Page 108: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.

  • Page 109: Bb Test [Menu 1]

    9. ENGINEERING MODE 9.1 BB Test [MENU 1] 9.1.1 FM Radio 1) Listen Radio : This menu is to used for listening FM Radio.(It must be connected Earphone.) 2) Test ON 3) Test OFF 9.1.2 LCD 1) Contrast value : This menu is to input Contrast Value of the LCD. 2) Test ON 3) Test OFF 9.1.3 Backlight...

  • Page 110: Rf Test [Menu 2]

    9. ENGINEERING MODE 9.1.6 ADC (Analog to Digital Converter) This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC 9.1.7 BATTERY 1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT,BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT...

  • Page 111: Mf Mode [Menu 3]

    9. ENGINEERING MODE 9.3 MF mode [MENU 3] This manufacturing mode is designed to do the basebandtest automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test. 9.3.1 All auto test LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker, 9.3.2 Backlight LCD Backlight is on for about 1.5 seconds at the same time, thenoff.

  • Page 112: Trace Option [Menu 4]

    9. ENGINEERING MODE 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call timer [MENU 5] This menu is to set the Digital Audio Interface Mode for Speech Transcoderand Acoustic testing. 1) All calls : This displays total conversation time.

  • Page 113: Stand Alone Test

    10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx TestTX test -this is to see if the transmitter of the phones is activating normally. B.

  • Page 114: Means Of Test

    10. STAND ALONE TEST 10.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure 10-1.
  • Page 115 10. STAND ALONE TEST Figure 10-2. HW test setting Figure 10-3. Ramping profile - 114 -...

  • Page 116: Auto Calibration

    11. AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 Overview Autocal(Auto Calibration) is the PC side Calibration tool that performTx,Rx and BatteryCalibration with Agilent8960(GSM call setting instrument) and Tektronix PS2521G(ProgrammablePower supply).Autocalgenerate calibration data by communicating with phone and measuring equipment thenwrite it into calibration data block of flash memory in GSM phone.
  • Page 117 11. AUTO CALIBRATION Figure 11-1 Auto Calibration Program Screen Cable loss : Enter the RF cable loss GSM and DCS Screen GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address Screen ADC Channel : Default ADC Calibration Channel Screen Auto Calibration Item : Default Calibration Settings about Tx, Rx, ADC and write BIN file - 116 -...

  • Page 118: Agc

    11. AUTO CALIBRATION 11.4 AGC This procedure is for Rx calibration.In this procedure, We can get RSSI correction value. Set band EGSM and press Start button theresult window will show correction values per every power level and gain code and the samemeasure is performed per every frequency. 11.5 APC This procedure is for Txcalibration.In this procedure you can get proper scale factor value and measured power level.

  • Page 120: Exploded View & Replacement Part List

    12. EXPLODED VIEW && REPLACEMENT PART LIST 12.1 Exploded View - 119 -...

  • Page 122: Replacement Parts

    Specification Color Remark GSM,BAR/FILP TGSM0030301 FG101 RUSSV,bar Silver AAAY00 ADDITION AAAY0067401 MCJA00 COVER,BATTERY MCJA0013801 Black APEY00 PHONE APEY0177301 B2000 RUSSV Silver ACGK00 COVER ASSY,FRONT ACGK0044601 Silver AWAB00 WINDOW ASSY,LCD AWAB0016501 Silver BFAA00 FILM,INMOLD BFAA0024301 Russia MWAC WINDOW,LCD MWAC0046801 MCCC00 CAP,EARPHONE JACK...

  • Page 123: Main Component

    3 V,.85 A,4*12.5 ,6.6T,L3100,SILINDER SAFY00 PCB ASSY,MAIN SAFY0119701 SAFA00 PCB ASSY,MAIN,AUTO SAFA0047601 B2000 BAR PCB ASSY,MAIN,SMT SAFC00 SAFC0047301 B2000 PCB MAIN SMT BOTTOM BOTTOM C100 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C101 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C102...
  • Page 124 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C129 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C132 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C133 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C134 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C135 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 125 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C231 CAP,CERAMIC,CHIP ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP C232 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C233 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C234 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C235 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP...
  • Page 126 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C503 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C504 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C505 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP C507 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C508 CAP,CERAMIC,CHIP ECCH0000104...
  • Page 127 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C701 CAP,CERAMIC,CHIP ECCH0000106 5 pF,50V,C,NP0,TC,1005,R/TP C702 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C703 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C704 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C705 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 128 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark D300 DIODE,SWITCHING EDSY0012301 1-1E1A ,85 V,1 A,R/TP ,P=200mW, IFM=200mA UFP ,25 pF,R/TP ,diode D700 DIODE,VARIABLE CAP EDVY0001202 capacitance:C1:25~28.5pF/C4:4.8~6.8pF UFP ,25 pF,R/TP ,diode D701 DIODE,VARIABLE CAP EDVY0001202 capacitance:C1:25~28.5pF/C4:4.8~6.8pF FL400...
  • Page 129 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R111 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R112 RES,CHIP ERHY0000278 82K ohm,1/16W,J,1005,R/TP R113 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R114 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R117 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R118 RES,CHIP ERHY0000261...
  • Page 130 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R304 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R305 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R306 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R307 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R308 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R309 RES,CHIP ERHY0000237...
  • Page 131 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R357 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R358 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R359 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP R370 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R399 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP R404 RES,CHIP ERHY0000262...
  • Page 132 12. EXPLODED VIEW && REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R713 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP SW500 CONN,RF SWITCH ENWY0003001 STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T CSP BGA ,204 PIN,R/TP ,GSM/GPRS DIGITAL U100 EUSY0181502 BASEBAND PROCESSOR / ART7TDMI DSP 148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG U101 EUSY0169301...
  • Page 133 X200 X-TAL EXXY0015601 13 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.2 ,SV 2.85V, AFC X500 VCTCXO EXSK0006501 0.8V SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0046001 B2000 MAIN SMT TOP C201 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C202 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C209 CAP,CERAMIC,CHIP...
  • Page 134 ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR SPFY PCB,MAIN SPFY0095301 FR-4 ,1.0 mm,BUILD-UP 8 , SAFB00 PCB ASSY,MAIN,INSERT SAFB0040301 B2000/B2050 MAIN INSERT ADCA00 DOME ASSY,METAL ADCA0030501 SBCL00 BATTERY,CELL,LITHIUM SBCL0001303 2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY SUMY00 MICROPHONE SUMY0003802 FPCB ,-42 dB,4*1.5 ,...

  • Page 135: Accessory

    SBPL00 BATTERY PACK,LI-ION SBPL0077901 RUSSV423450, Innerpack EAR PHONE/EAR MIKE SGEY00 SGEY0003503 FG101 ,STERO,Y TYPE 16OHM SRCY00 CDROM SRCY0001347 S/W ,NONE ,B2000 CD ,650 MB, 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,EU SSAD00 ADAPTOR,AC-DC SSAD0007828 PLUG(24P),STD WSAY00 SOFTWARE,APPLICATION WSAY0008701 050216_B2000 WSYY00 SOFTWARE...

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