Sony NWZ-S515 Service Manual page 52

NWZ-S515/S516/S615F/S616F/S618F
2. DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Parts face side: Parts on the parts face side seen from
(SIDE A) the pattern face are indicated.
Pattern face side: Parts on the pattern face side seen from
(SIDE B) the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layers have not
been included in diagrams.
• Indication of transistor.
C
Q
These are omitted.
B E
• Lead layouts
surface
Lead layout of conventional IC CSP (Chip Size Package)
NWZ-S515/S516/S615F/S616F/S618F
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specifi ed.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3.7 V and fed with regulated dc pow-
er supply from CN901 pin 1 and pin 2 on the MAIN
board.
• Voltages and waveform are dc with respect to ground un-
der no-signal conditions.
no mark : PLAY BACK
• Voltages are taken with a VOM (Input impedance 10
MΩ).
• Voltage variations may be noted due to normal production
tolerances.
• Signal path.
F : AUDIO
L
: VIDEO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
• Abbreviation
FR : French model
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