Electrical Parts List - Sony HCD-HP7 Service Manual

NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
• -XX, -X mean standardized parts, so they may
have some difference from the original one.
• Items marked "*" are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering these
items.
• CAPACITORS:
uF: µF
• COILS
uH: µH
• Accessories are given in the last of this parts
list.
Ref. No. Part No. Description
A-4747-707-A BD BOARD, COMPLETE
*******************
< CAPACITOR >
C701 1-164-156-11 CERAMIC CHIP
C702 1-126-392-11 ELECT CHIP
C703 1-164-156-11 CERAMIC CHIP
C704 1-126-391-11 ELECT CHIP
C705 1-162-964-11 CERAMIC CHIP
C706 1-164-156-11 CERAMIC CHIP
C707 1-126-392-11 ELECT CHIP
C708 1-164-156-11 CERAMIC CHIP
C709 1-126-392-11 ELECT CHIP
C710 1-165-176-11 CERAMIC CHIP
C711 1-164-156-11 CERAMIC CHIP
C712 1-162-949-11 CERAMIC CHIP
C713 1-162-968-11 CERAMIC CHIP
C714 1-164-156-11 CERAMIC CHIP
C715 1-126-401-21 ELECT CHIP
C716 1-162-964-11 CERAMIC CHIP
C717 1-162-968-11 CERAMIC CHIP
C718 1-115-156-11 CERAMIC CHIP
C719 1-162-968-11 CERAMIC CHIP
C720 1-162-953-11 CERAMIC CHIP
C721 1-164-156-11 CERAMIC CHIP
C722 1-164-156-11 CERAMIC CHIP
C723 1-126-392-11 ELECT CHIP
C729 1-128-360-11 ELECT CHIP
C731 1-164-156-11 CERAMIC CHIP
C732 1-162-970-11 CERAMIC CHIP
C733 1-162-970-11 CERAMIC CHIP
C734 1-162-917-11 CERAMIC CHIP
C735 1-162-918-11 CERAMIC CHIP
C741 1-164-156-11 CERAMIC CHIP
C742 1-164-156-11 CERAMIC CHIP
C743 1-165-176-11 CERAMIC CHIP
C744 1-125-837-11 CERAMIC CHIP
C746 1-164-156-11 CERAMIC CHIP
C747 1-164-156-11 CERAMIC CHIP
C748 1-128-360-11 ELECT CHIP
C753 1-162-949-11 CERAMIC CHIP
C754 1-162-949-11 CERAMIC CHIP
C756 1-162-949-11 CERAMIC CHIP
C761 1-162-941-11 CERAMIC CHIP
SECTION 10

ELECTRICAL PARTS LIST

• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
• Abbreviation
AUS : Australian model.
CND: Canadian model.
E2 : 120 V AC area in E model.
E3 : 220-240 V AC area in E model.
KR : Korean model.
Remarks Ref. No.
0.1uF 25V
100uF 20% 6.3V
0.1uF 25V
47uF 20% 6.3V
0.001uF 10% 50V
0.1uF 25V
100uF 20% 6.3V
0.1uF 25V
100uF 20% 6.3V
0.047uF 10% 16V
0.1uF 25V
47PF 5% 50V
0.0047uF 10% 50V
0.1uF 25V
1uF 20% 50V
0.001uF 10% 50V
0.0047uF 10% 50V
1uF 10V
0.0047uF 10% 50V
100PF 5% 50V
0.1uF 25V
0.1uF 25V
100uF 20% 6.3V
220uF 20% 10V
0.1uF 25V
0.01uF 10% 25V
0.01uF 10% 25V
15PF 5% 50V
18PF 5% 50V
0.1uF 25V
0.1uF 25V
0.047uF 10% 16V
1uF 10% 6.3V
0.1uF 25V
0.1uF 25V
220uF 20% 10V
47PF 5% 50V
47PF 5% 50V
47PF 5% 50V
10PF 0.5PF 50V
MX : Mexican model.
RU : Russian model.
TH : Thai model.
TW : Taiwan model.
When indicating parts by reference number,
please include the board name.
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piè c e portant
le numéro spécifié.
Part No. Description
C802 1-164-156-11 CERAMIC CHIP
C803 1-162-970-11 CERAMIC CHIP
C804 1-162-945-11 CERAMIC CHIP
C805 1-126-392-11 ELECT CHIP
C806 1-164-156-11 CERAMIC CHIP
C807 1-126-392-11 ELECT CHIP
C810 1-164-156-11 CERAMIC CHIP
C811 1-164-156-11 CERAMIC CHIP
C812 1-115-156-11 CERAMIC CHIP
C813 1-164-156-11 CERAMIC CHIP
C814 1-126-392-11 ELECT CHIP
C815 1-128-360-11 ELECT CHIP
C816 1-164-156-11 CERAMIC CHIP
C817 1-164-156-11 CERAMIC CHIP
C823 1-162-949-11 CERAMIC CHIP
C824 1-162-949-11 CERAMIC CHIP
C825 1-162-949-11 CERAMIC CHIP
C829 1-162-949-11 CERAMIC CHIP
C830 1-162-945-11 CERAMIC CHIP
C831 1-162-945-11 CERAMIC CHIP
C834 1-128-360-11 ELECT CHIP
C835 1-164-156-11 CERAMIC CHIP
C837 1-164-156-11 CERAMIC CHIP
C843 1-164-156-11 CERAMIC CHIP
C844 1-164-156-11 CERAMIC CHIP
C856 1-115-156-11 CERAMIC CHIP
C857 1-162-945-11 CERAMIC CHIP
C858 1-162-945-11 CERAMIC CHIP
C859 1-162-945-11 CERAMIC CHIP
C860 1-162-953-11 CERAMIC CHIP
< CONNECTOR >
CN708 1-817-244-11 CONNECTOR, FFC 16P
CN710 1-778-874-11 CONNECTOR, FFC (LIF(NON-ZIF)) 19P
< FERRITE BEAD >
FB701 1-550-907-21 BEAD, FERRITE (CHIP)
FB707 1-550-907-21 BEAD, FERRITE (CHIP)
FB708 1-550-907-21 BEAD, FERRITE (CHIP)
FB761 1-550-907-21 BEAD, FERRITE (CHIP)
FB801 1-550-907-21 BEAD, FERRITE (CHIP)
FB802 1-550-907-21 BEAD, FERRITE (CHIP)
FB803 1-550-907-21 BEAD, FERRITE (CHIP)
FB804 1-550-907-21 BEAD, FERRITE (CHIP)
HCD-HP7
Ver 1.1 2003.11
BD
Remarks
0.1uF 25V
0.01uF 10% 25V
22PF 5% 50V
100uF 20% 6.3V
0.1uF 25V
100uF 20% 6.3V
0.1uF 25V
0.1uF 25V
1uF 10V
0.1uF 25V
100uF 20% 6.3V
220uF 20% 10V
0.1uF 25V
0.1uF 25V
47PF 5% 50V
47PF 5% 50V
47PF 5% 50V
47PF 5% 50V
22PF 5% 50V
22PF 5% 50V
220uF 20% 10V
0.1uF 25V
0.1uF 25V
0.1uF 25V
0.1uF 25V
1uF 10V
22PF 5% 50V
22PF 5% 50V
22PF 5% 50V
100PF 5% 50V
55