Page 1 Detailed Service Manual Detailed Test Procedures Digital Multi-Service, Data-Capable Portable...
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Page 3 Digital Multi-Service, Data-Capable Portable Detailed Service Manual Detailed Test Procedures APRIL 2010 6880401P59-O...
Page 4 The Motorola products described in this manual may include Motorola computer programs stored in semiconductor memories or other media that are copyrighted with all rights reserved worldwide to Motorola. Laws in the United States and other countries preserve for Motorola, Inc. certain exclusive rights to the copyrighted computer programs, including the exclusive right to copy, reproduce, modify, decompile, disassemble, and reverse-engineer the Motorola computer programs in any manner or form without Motorola’s prior written consent.
Page 5: Safety And General Information
If you wear a radio product on your body when transmitting, always place the radio Your phone contains a transmiter and receiver. When it is ON, it receives and product in a Motorola approved clip, holder, holster, case or body harness. If you transmits RF energy. When you communicate with your phone, the system...
Page 6: Approved Accessories
S A F E T Y A N D G E N E R A L I N F O R M A T I O N Approved Accessories Operational Warnings For a list of approved Motorola accessories call 1 -800-453-0920, or visit our Obey all posted signs when using mobile devices in public areas. website at www.motorola.com/iden.
Page 7: Choking Hazards
If you have experienced seizures or blackouts, or if you have a family history of customer care options. You can also contact the Motorola Customer Support such occurrences, please consult with your physician before playing video...
Page 8 If your battery or mobile device has • Remove the battery and inspect it to confirm that it been subjected to such damage, take it to a Motorola bears a Motorola “Original Equipment” hologram; Authorized Service Center before using. Do not •...
Page 9: Model Information
M O D E L I N F O R M A T I O N MODEL INFORMATION This manual applies to the following iDEN i897 Digital Portable models: H75XAH6JS5AN 806-940 MHz, Multi-Service, Data-Capable Portable MODEL NUMBERING SYSTEM H 7 5 X A H 6 J S 5 A N...
Page 10: Model Specifications
MODEL SPECIFICATIONS MODEL SPECIFICATIONS TRANMITTER GENERAL RECEIVER Direct Conversion Receiver Type Transmitter Type Single Conversion FCC Designation: IHDT56KQ1 Frequency Range 851-870 MHz Frequency Range 806-825 MHz Operational Modes Phone 935-940 MHz 896-901 MHz Private Group Circuit Data Packet Data Temperature Range Channel Spacing: Emission Designator 18K3D7W...
Page 11: Preface
The i897 is Digital Multi-Service, Data-Capable Portable Field Service Manual contains the information necessary to identify and fix problems in the Motorola i897 is Digital Portable. This unit is based on digital technology and is designed to operate on iDEN systems.
Page 12: Conventions Used In This Manual
Used for sample input and output c o d e Related Publications The following publications are available separately: R-2660 Digital Communications System Analyzer Operator’s Manual 68P80386B72 iDEN i897 Digital Multi-Service Data-Capable Phone User’s Guide: Motorola User Guides Carrier User Guide Mexico NTN2603A...
Page 13: Table Of Contents
CONTENTS SAFETY AND GENERAL INFORMATION ..........v MODEL INFORMATION ................ix MODEL SPECIFICATIONS ..............x PREFACE ....................xi CONTENTS ....................xiii Chapter 1 ....................17 SYSTEM OVERVIEW ..................17 iDEN Digital Modulation Technology..................17 iDEN Voice Compression Technology ..................19 1.2.1 RF Transmission Bursts......................... 19 1.2.2 Calling Area Coverage........................... 20 1.2.3 Service Area............................
Page 14 2.1.3 Strong-Signal Environments........................49 2.1.4 Protecting Static-Sensitive Devices......................49 Using RSS ............................50 Connecting an i897 Unit to the R-2660 ..................50 Operating the R-2660 ........................51 Dis-Assembly and Assembly of i897 Unit ................... 52 Disassembly Procedure ........................ 52 2.6.1 Disassembly Sequence Pane chart......................52 2.6.2...
Page 15 LO Output Test..........................74 RX Main VCO Test ........................75 Keypad Failure Test........................77 SLEDGEHAMMER Test......................78 RX Analysis Test........................... 80 TX Power Test..........................83 Tx Janus Module Test ........................84 SLEDGEHAMMER Tx Test ....................... 86 3.10 Earpiece Speaker Test ......................89 3.11 High Audio Speaker Test......................
Page 16 KEYPAD B2B CONNECTOR ....................123 ROADRUNNER DC........................124 4.10 ROADRUNNER INTERFACE ..................... 125 4.11 ROADRUNNER AUDIO ....................... 126 4.12 ROADRUNNER RF INTERFACE - EMU ................127 4.13 BLUETOOTH ......................... 128 4.14 EMU BLOCK.......................... 129 4.15 EMU IC............................ 130 4.16 TRANSCEIVER........................131 4.17 Component Locations ......................
Page 17: Chapter 1
Chapter 1 SYSTEM OVERVIEW To achieve a high spectrum efficiency, the i897 digital multi-service, data-capable portable unit uses a unique modulation technology and sophisticated voice-compression algorithm. The voice of the person speaking into the microphone is converted into a digital bit stream consisting of zeros (0) and ones (1).
Page 18 OVERVIEW: iDEN Digital Modulation Technology Frequency from Desired Channel Center (kHz) Figure 1-1: Spectrum of iDEN Quad 16QAM Quadrature Phase Shift Keying (QPSK) is one of the most common modulation techniques for satellite communications. In QPSK, a digital data stream is taken two bits at a time to generate four possible phase states of the transmitted carrier.
Page 19: Iden Voice Compression Technology
OVERVIEW: iDEN Digital Modulation Technology Portable Unit When turned on, scans for control station, then transmits one slot every six slots. Figure 1 iD E N T D M A F o r m a t iDEN Voice Compression Technology Voice is converted into a digital bit stream by sampling the voice signal at a high rate and converting the samples into numbers, which are represented by bits.
Page 20: Calling Area Coverage
An iDEN channel is created by grouping bursts so that their slot numbers differ by a number referred to as the repetition rate. The i897 unit uses two repetition rates for interconnect voice calls: 6:1 and 3:1. A single frequency can handle six calls using a 6:1 repetition rate with the 4.2 Kbps coder.
Page 21: Service Area
OVERVIEW: iDEN Digital Modulation Technology The units are capable of operation on any channel in the system. This enables them to operate in any cell. Due to the low power requirements for communications between radio telephones in a particular cell and cell site, operating channels may be repeated in cells that are outside the coverage area of each other.
Page 22: Radio Architecture Overview
OVERVIEW: iDEN Digital Modulation Technology Radio Architecture Overview The digital section consists of ZEUS Dual Core Baseband Processor, Host memories (flash and DDR), and the iDEN power management (See Figure 1- 4 below i897 Block Diagram). Design Review – Block Diagram MEMORY...
Page 23: Roadrunner Circuitry
(previously part of TOMAHAWK). ROADRUNNER also includes circuitry to support additional features such as GPS AD, USB, RS232, LEDs, etc. Finally, the baseband processor utilized by i897 is the Zeus Processor. Roadrunner Circuitry The Roadrunner integrated circuit (IC) provides the following: •...
Page 24 The unit operates with a low-level battery voltage of 3.0 Vdc, nominal-level voltage of 3.7 Vdc, and high-level voltage of 4.2 Vdc. Figure 1-5 illustrates the DC power distribution in the i897 unit. The Roadrunner IC has the following features: •...
Page 25: Audio Section
A pair of dynamic high audio 8-ohm speakers 1.5.2 Audio Amplifiers The i897 uses seven audio amplifiers, five from the Roadrunner and 2 from an external class D amplifier, as shown and further described in the Figure 1-6, Figure 1-7 and Figure 1-1.
Page 26 OVERVIEW: iDEN Digital Modulation Technology 6880401P59-O...
Page 27: Audio Modes
It can also drive the two high audio speakers in mono if the speakerphone feature is enabled. In standard dispatch mode, the i897 uses Roadrunner's internal amplifiers to directly drive the two high audio speakers in mono. It can also drive the dynamic earpiece speaker.
Page 28: Transmit Paths
OVERVIEW: Digital Section 1.5.5 Transmit Paths The average human voice signal has an audible frequency band of approximately 300 - 3400 Hz. Low pass filters are utilized to provide the optimum voice signal response on the mic signal line by filtering out unnecessary and potentially disruptive higher frequencies.
Page 29: Zeus Processor
OVERVIEW: Digital Section 1.6.1 Zeus Processor Zeus is a dual core (P2002 Starcore DSP and an ARM-11 Application Processor) processor with a shared memory system (see Figure 1-9). The following is a summary of the ZEUS key features: The following is a list of ARM11 core features in the ARM1136JF-S AP subsystem: •...
Page 30: Mcu Digital Phase Locked Loop (Dpll)
OVERVIEW: Digital Section Zeus performs the following tasks: • Assists RoadRunner in the control of the power-up and power-down sequence of the unit. • USB communication with the factory Automated Test Equipment. • Accesses to the external NAND flash memory and DDR memory. •...
Page 31: Zeus Digital Signal Processor
OVERVIEW: Digital Section 1.6.5 ZEUS Digital Signal Processor The Zeus digital signal processor contains the DSP Engine SC140e: The following is a list of SC140e features that make this core ideal for a single core modem: • StarCore™ SC1000 architecture foundation •...
Page 32: System Memory
Both memories are external to the processor and are stacked in the same package. 1.6.9 USB2.0 I897 supports USB2.0 High Speed rate of 480Mbps. The file transfer throughout rate is about 2MB/s for high speed transfers. The phone also supports USB1.1 Full Speed host.
Page 33: Battery Id
The battery is equipped with a Dallas 2502 EPROM. A two-wire serial bus allows the i897 unit or the battery charger to communicate with the battery and identify whether or not the battery is compatible. If the battery is determined to be incompatible, the charger does not enter charging mode.
Page 34: Lcd Circuit
OVERVIEW: Digital Section 1.6.12 LCD Circuit The LCD circuit consists of a full-graphics, liquid-crystal display module that has a resolution of pixels, colors. The data lines for the display module are 240RGBx320 262K connected to RGB 6:6:6 (18 bits) and control interface from the IPU section of the Zeus processor.
Page 35: Transmitter Path Section
CODEC, where it is amplified and digitized by the A/D converter in the CODEC. Digital voice is then sent from the CODEC to the DSP for processing. (See i897 Block Diagram Below). Figure 1-10 Figure 1-10.
Page 36: Roadrunner
OVERVIEW: Transmitter Path Section The JANUS transmitter module includes the following: • Center tapped RF balun for RFPA differential input • High Power Linear RFPA • RFPA Load line switch selection mode. • Reduced quiescent current selection mode. • Directional coupler. •...
Page 37: Sledgehammer Ic (Tx Path)
OVERVIEW: Transmitter Path Section ROADRUNNER Transmit Operation. The transmitter implemented a Direct Conversion Transmitter (DCT), where base band data is up-converted into RF with only one stage. The ICs that perform the transmit operations are ROADRUNNER and SLEDGEHAMMER. Power cutback control is shared between both ICs, the fine cutback step (1-> 4dB) is performed by ROADRUNNER and the coarse cutback step (5 dB steps up to 35 dB) is performed by SLEDGEHAMMER.
Page 38: Power Amplifier
OVERVIEW: Transmitter Path Section 1.7.3.1 TX BALUN The TX BALUN transforms the RFPA 50ohms single ended input impedance into 200ohms differential (SLEDGEHAMMER's output impedance is 200 ohms differential). The BALUN also feeds RAW_B+ to the TX modulator portion of the RFIC that drives Janus through the TX_IN and TX_INB pins.
Page 39: Cartesian Feedback
This is a closed loop system and the loop cannot be opened (See i897 Block Diagram Figure 1-13 Below). without drastic consequences. (TX interface between SLEDGEHAMMER and JANUS). Figure 1-13. i897 Block Diagram 6880401P59-O...
Page 40: Level Set And Phase Training
OVERVIEW: Transmitter Path Section The forward path includes the following: • SLEDGEHAMMER • JANUS (Balun, Power amplifier, Coupler) The feedback path includes the following: • Coupler • Feedback attenuation network. • SLEDGEHAMMER 1.7.5 Level Set and Phase Training Level set training is performed to ensure that the RF PA is not driven into clip, which would result in excess splatter and out-of-band spurious emissions.
Page 41 OVERVIEW: Transmitter Path Section Negative feedback is required to maintain system stability. Phase training is done to ensure that º the feedback is negative (180 ). The phase shift of the loop consists of the sum of the delays of several modules and components. Operation of the Sledgehammer in a closed loop system requires the phase of the feedback path to be adjusted with respect to the forward path such that the demodulated feedback signal is the correct phase at the summing junction.
Page 42: Receiver Path Section
The receiver has automatic gain control (AGC) to maintain good linearity over a wide range of incoming signals. The AGC circuitry also prevents clipping of high-level signals. Janus block, which is a receiver circuitry path for TAOS (See i897 Block Diagram Figure 1-14 Below).
Page 43: Janus Module (Rxpath)
OVERVIEW: Receiver Path Section 1.8.1 JANUS Module (RXPath) The Janus Front End module (U500) contains the antenna switch, the passive SAW filters and the associated switches, along with the active LNA and the balun circuit. The antenna switch routes the received signal from the antenna pin input to the receiver block of Janus. During transmit mode, this switch disconnects the receiver path and connects the antenna to the transmit path within Janus.
Page 44: Frequency Generator (Rf) Section
Main/RX Voltage Controlled Oscillator (VCO - U300). Note Main/RX VCO output used as source to Main Prescaler input of SLEDGEHAMMER main synthesizer PLL. All frequencies in the i897 originate from the 33.6 MHz reference frequency provided by SLEDGEHAMMER synthesizer and the TCXO based reference oscillator circuit. The Y002 TCXO generates the 33.6 MHz signal, which is temperature compensated.
Page 45: Global Positioning System (Gps) Section
These digital inputs are processed and converted into position information. 1.10.1 GPS Receiver A block diagram of the receiver for the i897 is shown in Figure 1-19. The GPS receiver is based on the SiRF SiRFStarIII GPS chipset. 6880401P59-O...
Page 46: Gps Antenna
OVERVIEW: Global Positioning System (GPS) Section 1.10.2 GPS Antenna The GPS antenna is common part of the tri-band antenna common to the iDEN antenna 1.10.3 JANUS IC The JANUS IC is a multi-purpose IC that host 4 critical parts of the GPS line up. 1.10.3.1 DIPLEXER This diplexer is used to isolate the GPS signal from the iDEN signal.
Page 47: Bluetooth® Wireless System
OVERVIEW: Bluetooth® Wireless System 1.11 Bluetooth® Wireless System Bluetooth technology is used for short range wireless communications that do not require high data rates. The original usage models included telephone, headsets, low-data rate access point, file transfer, and automatic synchronization. The newer usage models have added human interface devices, remote control, print capability, cable replacements and personal area networks.
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Page 49: Chapter 2
3 for information on the displays, errors, alert tones, and messages associated with this unit. Preparing Equipment for Testing To ensure accurate testing of an i897 unit, it is important that the test equipment function properly. 2.1.1 Calibrating Equipment Test equipment should be internally calibrated before being used for testing. Note that the internal calibration does not substitute for a factory calibration.
Page 50: Using Rss
RSS to program an i897 unit for Full Rate operation. Use the 6:1 Interconnect softkey for all interconnect testing. If you are using the R-2660B or later, which is 3:1 capable, use RSS to program an i897 unit for Half Rate operation. Use the 3:1 Interconnect softkey for all interconnect testing.
Page 51: Operating The R-2660
PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing Figure: 7-1. Typical R-2660 Setup To connect the unit to the R-2660: 1. Ensure the unit is powered off, and then turn on the R-2660. 2. Remove the battery cover and battery from the unit, and insert the reference SIM card. 3.
Page 52: Dis-Assembly And Assembly Of I897 Unit
In some cases, the technician may not need to remove certain components to reach others. Disassembly Procedure NOTE: Screws used to assemble the i897 main housing are: 1 antenna screw, T-4 drive; 4 housing assembly screws, T-6 drive. 2.6.1 Disassembly Sequence Pane chart Note: i897 flip components include a Flex Connector ribbon which can be easily torn or damaged if not handled properly.
Page 53: Battery Cover And Battery Removal
Battery Cover and Battery Removal PREPARING FOR FIELD LEVEL TESTING: Battery Cover, 2.6.2 Battery Cover and Battery Removal Tools Required: None Required 1. Push the battery door toward the bottom of the Unit. 2. Lift and remove the Battery Dor from the housing. 3.
Page 54: Sim Card And Sd Card Removal
PREPARING FOR FIELD LEVEL TESTING: SIM Card and SD Card Removal 2.6.3 SIM Card and SD Card Removal Tools Required: None Required Push the SIM card toward the top of the unit. Remove the SIM Card Being careful not to touch the contacts. Lift the SD card lock.
Page 55: Back Housing Removal
PREPARING FOR FIELD LEVEL TESTING: Back Housing Removal 2.6.4 Back Housing Removal Tools Required: T-5 Torx Bit and Torx Driver Remove the six T-5 screw from the back housing of the unit. Remove the Back Housing from the unit by lifting from the top and disengaging the snaps on both sides.
Page 56: Main Board Removal
PREPARING FOR FIELD LEVEL TESTING: Main Board Removal 2.6.5 Main Board Removal Tools Required: None Required Remove the Bluetooth antenna from the Main Board. Remove the main board from the Front housing and disconnect the flex. Remove the Main Antenna and Bluetooth antenna from the Unit. Remove the USB Cover from the front Housing.
Page 57: Flip Assembly Access
PREPARING FOR FIELD LEVEL TESTING: Flip Assembly access 2.6.6 Flip Assembly Access Tools Required: None Required Separate the Flip Flex from the front housing. Unfold the flex of the front housing. Lift the Hinge out of the front housing. Carefully remove the flip assembly from the front housing using care not to damage the flex.
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Page 59: Assembly Procedure
PREPARING FOR FIELD LEVEL TESTING: Assembly Sequence Flowchart Assembly Procedure 2.7.1 Assembly Sequence Pane Chart Front Housing Flip Assembly USB Cover Back Housing Antennas Main Board Battery Frame SD Card Battery Cover SIM Card Battery 6880401P59-O...
Page 60: Main Board Preparation
Preparation PREPARING FOR FIELD LEVEL TESTING: Main Board 2.7.2 Main Board Preparation Inspect the Main Board and verify that the following parts are not damaged, bent or defective. Tools Required: None Required Lift the left of MB label and apply the Kapton Tape to the Top of the Main Board. Apply the Main Board label.
Page 61 PREPARING FOR FIELD LEVEL TESTING: Main Board Preparation (Continued) Main Board Preparation (Continued) Tools Required: None Required Apply the Kapton tape to the SIM Strap on the main board. Assemble USB strap to the Main Board. Assemble the SIM card strap and Contact EMI shield to the main board and press it to activate the adhesive.
Page 62: Flip To Front Housing Assembly
PREPARING FOR FIELD LEVEL TESTING: Flip to Front Housing Assembly 2.7.3 Flip to Front Housing Assembly Tools Required: None Required 1. Apply the battery label in the battery cavity. 2. Apply 3 poron pads onto the front housing. 3. Apply a poron pad to the keypad Hinge Flex on the tip of the flex in the front housing. 4.
Page 63 PREPARING FOR FIELD LEVEL TESTING: Flip to Front Housing Assembly (Continued) Flip to Front Housing Assembly (Continued) Tools Required: None Required 5. Assemble the ring in the FH. 6. Use the bottom of the tweezers to press the ring (Ensure the ridge of the ring is in the slot of Front Housing correctly.
Page 64 PREPARING FOR FIELD LEVEL TESTING: Flip to Front Housing Assembly (Continued) Flip to Front Housing Assembly (Continued) Tools Required: None Required 9. Align the Flip with the ring in the Front Housing. 10. Align the hole on the hinge collar against the anchor point on the front housing, then close the flip slowly.
Page 65: Main Board Assembly
PREPARING FOR FIELD LEVEL TESTING: Main Board Assembly 2.7.4 Main Board Assembly Tools Required: None Required 1. Assemble the USB seal to the front housing. 2. Assemble the Main Antenna into the front housing. 3. Connect the connector in Front Housing to Main Board Connector. 4.
Page 66 PREPARING FOR FIELD LEVEL TESTING: Main Board Assembly (Continued) Main Board Assembly (Continued) Tools Required: Screw nest D310-40 5. Assemble the Bluetooth Antenna into the Front Housing. 6. Apply the conductive poron pad to the Battery Frame. Ensure the right end of the frame in the proper location.
Page 67: Back Housing Assembly
PREPARING FOR FIELD LEVEL TESTING: Back Housing Assembly 2.7.5 Back Housing Assembly Tools Required: None Required 1. Apply the battery pad using tweezers to the Back Housing. 2. Apply the Back Housing Label to the Back Housing using tweezers. 3. Assemble the SD card seal to back housing and ensure the inverse side is up. 4.
Page 68: Closing The Unit
PREPARING FOR FIELD LEVEL TESTING: Front Housing Screw Insertion 2.7.6 Closing the Unit Tools Required: Screw nest D310-40 1. Place the unit into the Screw Nest Fixture D318-41. 2. Insert the Six T-5 Screws and fasten in the order shown. 6880401P59-O...
Page 69: Sim Card And Sd Card Installation
PREPARING FOR FIELD LEVEL TESTING: SIM Card and SD Card Installation 2.7.7 SIM Card and SD Card Installation Tools Required: None Required 1. Lift the SD card lock. 2. Slide SD Card inward. Being careful not to touch the contacts. 3.
Page 70: Battery And Battery Door Installation
PREPARING FOR FIELD LEVEL TESTING: Battery and Battery Door Installation 2.7.8 Battery and Battery Door Installation Tools Required: None Required 1. Tilt the back of the battery at approximately a 45 degree angle and insert into the Back Housing. 2. Push the battery toward the bottom of the unit and push the back of the battery down 3.
Page 71: Chapter 3
TROUBLESHOOTING: Digital Analysis Test Chapter 3 TROUBLESHOOTING Digital Analysis Test Check supplies on board. Refer Power-Up & DC Distribution Tests Check baseband clocks, CKIL (probe TP) & CKIH (probe C735_DNP) Check Roadrunner CKIL = 32kHz? IC, U700B7 & 32kHz CKIH = 16.8MHz? crystal, Y700 Disconnect power supply.
Page 72 TROUBLESHOOTING: Digital Analysis Test Digital Analysis Test (Continued) USB Failure Analysis Connect USB data cable from PC to phone USB2.0 is USB enumerated working successfully? Using flash cable, “comm check” with XFlash Check micro-USB EMU, USB switch Comm Check connector, J900 &...
Page 73 TROUBLESHOOTING: Digital Analysis Test Digital Analysis Test (Continued) Replace USB Check crystal, switch, Y1000 freq U1001B9 XTALIN Replace Comm Check 24MHz? Y1000 Pass? Replace FX2, Replace EMU FX2 replaced? U1000B6 IC, U900 Possible failures: FX2 Comm Check firmware corruption (try Pass? re-flash phone), I2C bus, Zeus...
Page 74: Lo Output Test
TROUBLESHOOTING: LO Output Test LO Output Test 6880401P59-O...
Page 75: Rx Main Vco Test
TROUBLESHOOTING: LO Output Test RX Main VCO Test Use this test on a unit with the following symptom: no RX. Note: Run the RX BER 851.0125 Test before Using a high impedance probe on LO Frequency Range: 2x RX Freq. the spectrum analyzer, check the LO beginning this test.
Page 76 TROUBLESHOOTING: LO Output Test RX Main VCO Test (Continued) Continued from previous Page Check that the voltage at C321 (pin 9) is between 0.5 and 2.1 Vdc. There is no issue with ‘ the control voltage. Is the the voltage voltage between the voltage railed railed low...
Page 77: Keypad Failure Test
TROUBLESHOOTING: Keypad Failure Test Keypad Failure Test. 6880401P59-O...
Page 78: Sledgehammer Test
TROUBLESHOOTING: SLEDGEHAMMER Test SLEDGEHAMMER Test Use this test to check the SLEDGEHAMMER circuitry. Check L653 for 2.775 Vdc (V2_RX). Go to the the voltage test flowcharts for at L653 voltage regulator correct verification. Is the Go to the voltage at R660 test flowcharts for 2.775 Vdc voltage regulator...
Page 79 TROUBLESHOOTING: SLEDGEHAMMER Test SLEDGEHAMMER Test (Continued) 1. In BERBUG, type the following: >rx static >mode rx (Ignore the message returned). 2. Check the voltage on C332 and C331. Is the Remove U200, voltage at C332 and check ~ 0 Vdc and voltage at the voltage again.
Page 80: Rx Analysis Test
TROUBLESHOOTING: RX Analysis Test RX Analysis Test Use this test on a unit to perform a RX analysis in iDEN mode. Set up the R-2660 as follows: Mode: iDEN Test, Meter: RF DISPLAY, RF Control: GENERATE, FREQ: (See Table) MHz, Gen: OUT6/6, Gen: -60 dBm, RF I/O. Set the spectrum analyzer to Center Freq: 851.000 MHz (935.01875 MHz for 900), Span: 100 kHz, Amplitude: -30 dBm reference level.
Page 81 TROUBLESHOOTING: RX Analysis Test RX Analysis Test (Continued) Abbreviations: US = Unsoldered components or connections MP = Missing parts DFP = Defective parts Check C781, R660, C217, C219, C222, C224, C228, C229, C230, C231, C303, C501, C676, Are voltages C677, E601 for S, US, MP, DFP. 1.4 V 10%? Check DC section, then if no fault...
Page 82 TROUBLESHOOTING: RX Analysis Test RX Analysis Test (Continued) Abbreviations: US = Unsoldered components or connections MP = Missing parts DFP = Defective parts With Hi impedance RF Probe (Hi- Z) check the RF level on either pad Is voltage on Check DC and ZEUS section, of C215.
Page 83: Tx Power Test
TROUBLESHOOTING: TX Power Test TX Power Test Use this test to check the transmit power circuitry. Set the unit to the Open LoopPower Test at 813.5125 MHz or 898.51875 MHz. Is the power level With the unit in the Open Loop Power Test, between 15 and measure the RF level at the JANUS TX input (which is 24 dBm...
Page 84: Tx Janus Module Test
TROUBLESHOOTING: RF PA Module Test Tx Janus Module Test Use this test to check the JANUS Module TX circuitry (TX lineup from BALUN to RX/TX switch included). Note: Perform the Transmit Power Test before beginning this test. Set the unit to the Open Loop Power Test at 813.5125 MHz or 898.51875 MHz.
Page 85 TROUBLESHOOTING: RF PA Module Test Tx Janus Module Test (Continued) Continued Continued from previous from previous Page Page Do the following: Check JANUS U 500 at C504 1 . Set the unit to the TX R708 (Raw B+ voltage) Power Tune T t es .
Page 86: Sledgehammer Tx Test
TROUBLESHOOTING: SLEDGEHAMMER TX Test SLEDGEHAMMER Tx Test Use this test to check the SLEDGEHAMMER circuitry. Do the following: 1. Set the unit to the Open Loop Power Test at 813.5125 MHz. 2. Measure the RF level at the JANUS TX input (which is the input to the TX BALUN) (L503 at the TX_IN side) Do the following:...
Page 87 TROUBLESHOOTING: SLEDGEHAMMER TX Test SLEDGEHAMMER Tx Test (Continued) Continued Continued from previous from previous Page Page Do the following: Do the following: 1. Monitor the RF waveform at the antenna 1. Remove the SLDGEHAMMER shield. port. 2. Visually check all components and 2.
Page 88 TROUBLESHOOTING: SLEDGEHAMMER TX Test SLEDGEHAMMER Tx Test (Continued) Continued Continued from previous from previous Page Page With the oscilloscope measure REFCLK_IN to SLEDGEHAMMER at Using the oscilloscope, TP_REFCLK_IN_SL test point on the verify DMCS (TP_DMCS) Is high keypad side of the board (33.6 MHz clock during the TX slot.
Page 89: Earpiece Speaker Test
TROUBLESHOOTING: Earpiece Speaker Test 3.10 Earpiece Speaker Test 6880401P59-O...
Page 90 TROUBLESHOOTING: Earpiece Speaker Test Earpiece Speaker Test (Continued) 6880401P59-O...
Page 91: High Audio Speaker Test
TROUBLESHOOTING: High Audio Speaker Test 3.11 High Audio Speaker Test 6880401P59-O...
Page 92 TROUBLESHOOTING: High Audio Speaker Test (Continued) High Audio Speaker Test (Continued) Continued from previous Page Measure the output of SPKR+ to ground and SPKR- to ground(C795,C740,C771,C728) Output should be 210mVrms Correct Voltage Check if input Check the circuit around from both Plus and signals from C788 Audio PA circuit( U700) Minus outputs?
Page 93: Audio Loopback Level Test
TROUBLESHOOTING: Audio Loopback Level Test 3.12 Audio Loopback Level Test 6880401P59-O...
Page 94: Reference Oscillator Test
TROUBLESHOOTING: Reference Oscillator Test 3.13 Reference Oscillator Test 6880401P59-O...
Page 95 TROUBLESHOOTING: Reference Oscillator Test Reference Oscillator Test (Continued) 6880401P59-O...
Page 96: Dc Distribution (V1) Test
TROUBLESHOOTING: DC Distribution (V1) Test 3.14 DC Distribution (V1) Test Check C721 for 2.775Vdc Check FILT_B+ Go to 2.775 Vdc Fail Fail 3.6 Vdc (3.6 Vdc) FILT_B+ present at present the parts at C900 or C901. flowchart. Pass Pass Check for US, DFP, etc. Replace U700B7 Repair, as necessary.
Page 97: Dc Distribution (V2) Test
TROUBLESHOOTING: DC Distribution (V2) Test 3.15 DC Distribution (V2) Test Use this test on a unit with the following symptom: no V2 (2.775 Vdc). Check C725, C727, C755, C757 Go to Check FILT_B+ 2.775 Vdc FILT_B+ 3.6 Vdc (3.6 Vdc) at C726, at the parts flow present...
Page 98: Dc Distribution (V3) Test
TROUBLESHOOTING: DC Distribution (V3) Test 3.16 DC Distribution (V3) Test Use this test on a unit with the following symptom: no V3 (1.875 Vdc). Check C719, E601 and R661 for 1.875 Vdc. Check FILT_B+ Go to (3.6Vdc) at 3.6 Vdc 1.875 Vdc FILT_B+ R707, C900 &...
Page 99: Dc Distribution (V4) Test
TROUBLESHOOTING: DC Distribution (V4) Test 3.17 DC Distribution (V4) Test 6880401P59-O...
Page 100: Dc Distribution (V_Vib) Test
TROUBLESHOOTING: DC Distribution (V_VIB) Test 3.18 DC Distribution (V_VIB) Test 6880401P59-O...
Page 101: Dc Distribution (Sw1) Test
TROUBLESHOOTING: DC Distribution (SW1) Test 3.19 DC Distribution (SW1) Test Use this test on a unit with the following symptom: no SW1 (1.2 Vdc). Check for SW1 after L702 from U701. Check C715 for 1.2 Vdc. Check L700, D700, 1.2 Vdc Check the Q701 and R706 present at the specified...
Page 102: Dc Distribution (Sw2) Test
TROUBLESHOOTING: DC Distribution (SW2) Test 3.20 DC Distribution (SW2) Test Use this test on a unit with the following symptom: no SW2 (1.875 Vdc). Check C705 & C707 for 1.875 Vdc. Is 1.875 Vdc Check FILT_B+ Go to FILT_B+ Is 3.6 Vdc present at (3.6 Vdc) at flowchart.
Page 103: Dc Distribution (Sw3) Test
TROUBLESHOOTING: DC Distribution (SW3) Test 3.21 DC Distribution (SW3) Test 6880401P59-O...
Page 104: Dc Distribution (Vusb) Test
TROUBLESHOOTING: DC Distribution (SW1) Test 3.22 DC Distribution (VUSB) Test Use this test on a unit with the following symptom: no VUSB (3.3 Vdc). Check C717 for 3.3 Vdc. 3.3 Vdc Check FILT_B+ Go to 3.6 Vdc present at (3.6 Vdc) FILT_B+ present the parts...
Page 105: Dc Distribution (Vsim) Test
TROUBLESHOOTING: DC Distribution (VSIM) Test 3.23 DC Distribution (VSIM) Test 6880401P59-O...
Page 106: Dc Distribution (Vhold) Test
TROUBLESHOOTING: DC Distribution (VHOLD) Test 3.24 DC Distribution (VHOLD) Test 6880401P59-O...
Page 107: Gps Receiver Test
TROUBLESHOOTING: GPS Receiver Test 3.25 GPS Receiver Test The Conducted signal testing described below can be performed to analyze or root cause an issue along the GPS RF subsystem, using a CW signal. The following tests are implemented in Factory Test Mode (BERBUG Mode).
Page 108 TROUBLESHOOTING: GPS Receiver Test GPS Receiver Test (Continued) 6880401P59-O...
Page 109 TROUBLESHOOTING: GPS Receiver Test GPS Receiver Test (Continued) Continued from previous Page Probe Test Point AN_GPS_CLK Is clock signal Check L601B10, 49.107 MHz ≥ -10 dBm? C678B10 End GPS testing 6880401P59-O...
Page 110: Mototalk
• Model Assembly Test Mode is an embedded series of operational tests of the unit's user interface and functional features. • Motorola iDEN recommends MA Test Mode be performed after any servicing of the unit. • An Audio Test Cable is required to complete test mode correctly. See the Required Tools section or contact Motorola’s Aftermarket Accessories Division.
Page 111 TROUBLESHOOTING: Model Assembly (MA) Test Mode Test Model Assembly (MA) Test Mode Test (cont.) LCD Information Test VPT IST5205 Size 240 x 320 Next The LCD Here we test the Ellipses are The gray scale test Flicker test screen manufacturer and LCD display with displayed on the image is from total...
Page 112 TROUBLESHOOTING: Model Assembly (MA) Test Mode Test Model Assembly (MA) Test Mode Test (cont.) Flicker test screen to Color bar pattern is Ellipses are The gray scale test Test the LCD with check for flicker. image is from total displayed on the displayed on the Checkerboard test.
Page 113 TROUBLESHOOTING: Model Assembly (MA) Test Mode Test Model Assembly (MA) Test Mode Test (cont.) Insert formatted SD card SIM absent Remove SD Power Off Next Cover the Insert SD card SDread/writes/erase The radio will .If the photosensor photosensor from when see “insert test pass,instruct detect if a SIM has fail to function or...
Page 114 This Page Left Blank Intentionally 6880401P59-O...
Page 115: Chapter 4
Schematic Diagrams and COMPONENT LOCATION Chapter 4 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION When ordering component parts, the part number and reference designator should be included. If the correct numbers cannot be located, call Motorola Parts Identification at 1-847-538-0021. 6880401P59-O...
Page 116: Main Board Component Layout
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Main Board Component Layout Do not place Emphasis on inspection Polarity mark Hand placed 6880401P59-O...
Page 117: Hierarchy - Top Sheet
MOTOROLA CONFIDENTIAL RESTRICTED PROJECT NAME THE DRAWING ON THIS PRINT AND INFORMATION 84009289002.cpm RIGHT_SPK_NEG_FILT RIGHT_SPK_NEG_FILT THEREWITH ARE PROPRIETARY TO MOTOROLA AND SHALL NOT BE USED OR DISCUSSED WHOLE CAD FILE NAME: RIGHT_SPK_POS_FILT OR IN PART WITHOUT MOTOROLA'S CONSENT. RIGHT_SPK_POS_FILT COPYRIGHT, MOTOROLA.
Page 118: Zeus Digital Interface
Schematic Diagrams and COMPONENT LOCATION ZEUS DIGITAL INTERFACE SW2_FLTR DISCRETE DISCRETE R804 R805B6 100K MOD_USB_NEG_IN U800B6 1SS390 TXS03121 D828 MOD_USB_ID_GATED POS_IN MOD_USB_ID R828B6 NEG_IN BMOD0 BMOD1 E_FUSE_REGULATOR_CONTROL R803 BMOD2 5175249A04 SPI1_CLK EF_PGM R807B6 R809B6 R810B6 U801B6 U804B6 FILT_BPLUS 100K 100K 100K SPI1_MOSI LP5900...
Page 119: Zeus Memory Interface
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ZEUS MEMORY INTERFACE SW2_FLTR R852B6 R851B6 0613952Y66 0613952Y66 PLACE BY PIN C8 AND C4 PLACE BY PIN DDR_VDD_1 DDR_VDD C897B6 C862B6 C863B6 .1UF C857B6 C856B6 C859B6 .01UF C867B6 SDRAM_ADD(13:0) .1UF 2113946U01 2187893N01 .01UF 2113945F07 .01UF 2187893N01 2113946U01 2113945F07...
Page 120: Zeus Power
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ZEUS POWER CURRENT SENSE AND DECOUPLING CAPACITORS 2.775 SW1_FB Z_VDD_CORE C825B6 SW2_FLTR V1_FLTR Z_VDD_KPP Legacy location .1UF 2113946U01 Placed before 0 ohms R878B6 $NET_PHYSICAL_TYPE=? C812B6 C813B6 C830B6 82PF .1UF .1UF 1.875V VMMC SW2_FLTR Z_VDD_SD1 SW2_FLTR SW2_FLTR R874B6 $NET_PHYSICAL_TYPE=?
Page 121: Display And Camera Interface
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION DISPLAY AND CAMERA INTERFACE FILT_BPLUS VMMC V1_FLTR U790B6 LP5990 VOUT C790B6 C791B6 C792B6 C793B6 100K R856B6 82PF 4.7UF 4.7UF 82PF KP_ROW6_SW KEYPAD_ROW6_EMU_PU ONE_WIRE NOTE: KEYPAD ROW 7 IS USED KEYPAD_ROW6 VMMC Q801B6 4885316E03 EMC5 V1_FLTR 3971730C02 J802B6 CONN_J...
Page 122: Zeus
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ZEUS SW2_FLTR USB_3_3V E1001B6 C1004B6 Y1000B6 2.2UF CSTCE24M0XK2 24MHZ C1005B6 E1000B6 XTALOUT .1UF C1002B6 C1006B6 HS_USB_ANALOG_VCC .47UF 33PF C1003B6 HS_USB_VDDIO 82PF U1000B6 R1003B6 CY7C68053 C1007B6 .1UF USB_HS_RESET I2CLK RESET IFCLK XTALIN XTALIN CLKOUT TP_FX2_CLKB6 USB_INTB6 USB_HS_INT PA2_SLOE PA1_INT1...
Page 123: Keypad B2B Connector
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION KEYPAD B2B CONNECTOR SPI1_MOSI SPI1_CLK FLIP_RST_B_F SPI1_SS1_DISPLAY_CS FL810B6 NUF8001MU FLIP_OPEN_DET_F FLIP_RST_B FLTR1 FLTR1 FLIP_INT_F FLIP_OPEN_DET E6008 FLIP_INT FLTR2 FLTR2 FL_INT/AJ_PTT FLTR3 FLTR3 PTT_F FLTR4 FLTR4 FLTR5 FLTR5 IPU_SPI_CS_F E6009 FLTR6 FLTR6 PTT_DET E6018 FLTR7 FLTR7 IPU_SPI_CLK_F SPI1_MISO_SW FLTR8...
Page 124: Roadrunner Dc
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ROADRUNNER DC RR_BATTI USE FOR 750MA CURRENT LIMITED RR_BATTI FILT_BATTI FILT_BATTI USE FOR HIGH POWER E701B7 AUDIO AMPLIFIERS AND ALERT_VCC SCHEMATIC SHEET #3) 7688697V04 E702B7 BATTI V1_FLTR 7685268E01 C713B7 56PF R703B7 R708B7 2113944E20 5.6K 0688044N02 FILT_BPLUS BATTERY_ID COMMENT :...
Page 125: Roadrunner Interface
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.10 ROADRUNNER INTERFACE RR PGM[1:0] VOLTAGE SETTINGS MUSCARDINI=01 1.55 1.20 5175771A73 RR_SW1 1.55 1.20 U700B7 SEC_INTB7 PRI_INTB7 TP_SEC_CEB7 SC55112VH LEDB CI_BLUE 1.875 1.875 RR_SW2 1.875 1.875 LEDG CI_GREEN CI_RED PRI_DIG_VCC LEDR PRI_CE PRI_CE RR_SW3 PRI_SPI_MISO PRI_MISO LED1_DRV DISP_LED_PWM...
Page 126: Roadrunner Audio
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.11 ROADRUNNER AUDIO EAR_MINB7 TEST_POINT E768B7 EAR_M_R R752B7 EAR_PLUSB7 EARPIECE_MINUS TEST_POINT 2475316C05 E767B7 R753B7 EAR_P_R EARPIECE_PLUS 2475316C05 C767B7 FILT_BATTI C768B7 82PF 82PF PLACE CLOSE TO CONNECTOR C794 C792 4.7UF PLACE CLOSE TO 2187906N01 CONNECTOR C785 TP_RIGHT_P 5175771A73 TEST_POINT...
Page 127: Roadrunner Rf Interface - Emu
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.12 ROADRUNNER RF INTERFACE - EMU AGC_DAC_SL_JN RX_ATTEN_SL_JN MAIN_VCO_BAND_SEL_1 MAIN_VCO_BAND_SEL_2 C781B7 18PF SDM_VDAC_SL C703B7 SDM_VAG_SL .1UF SDM_BIAS_SL 5175771A73 U700B7 SC55112VH TEST_POINT SDM_VDAC SELECT2 RXACQB7 SDM_VDAC0 SELECT1 SDM_VAG RFSTEPA SDM_BIAS AGC_DAC RXACQ RX_EN_STROB RX_EN_STROBE RXACQ R757B7 SCLK_OUT SCLK_OUT1 RXI_AD_IN...
Page 128: Bluetooth
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.13 BLUETOOTH BT_V2_7_Pwr_In C403 SW2_FLTR .01UF C402 1.875V 2.2UF 2171410C01 C401 L403 .01UF 2113945F07 5109522E94 2113944E10 C406 560NH BB_CPU_Clk_RqN Main_Clk_RqN 6.8PF 2170282F34 U402 C409 10PF NC7SZ02L6X R404 C407 74LVC1G08YZP BT_NFC_Clk_RqN NFC_Clk_Rq .01UF U401 0613952R66 C405 C415 .1UF 10PF...
Page 129: Emu Block
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.14 EMU BLOCK EMU_USB_POWER PCB rev10, phone Pilot2 USB_3_3V EMU_USB_POWER SW2_FLTR USB_3_3V D1000 RB521ZS U1002B9 LP5900 D1001B9 RB521ZS R1002 VOUT HS_USB_VCC_DIODE_OR D1003 RB521ZS VR1003 RB521ZS CDZ3_6B C1009B9 D1002 3.845V 2.2UF COMMENT: PLACE THESE FOR HS-USB U1001B9 FSUSB30UMX HSD1_POS...
Page 130: Emu Ic
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.15 EMU IC 5109773F18 U900B9 MC13883 SPICLK_I2CSCL BG_BYP SPICLK_12CSCL BG_BYP USB_TXENB ICHRG TXENB ICHRG USB_EN EMU_INT USB_EN EMU_INT SPICS_I2CADRO USB_VP SPICS_12CADR0 RESET_B USB_VM RESET_B USB_ID SPKR_RIGHT VREG SPKR_R VREG SPKR_LEFT SPKR_L REG_5V_IN CHRG_CTRL REG_5V_IN CHRGCTRL BOOT_MODE PWR_ON BOOTMODE...
Page 131: Transceiver
PKG_GND9 PKG_GND10 NC10 APPROVALS PKG_GND11 NC11 PKG_GND12 NC12 MOBILE DEVICES ENGINEER: FAISAL ABDULLAH BLOCK TITLE: LAST MODIFIED FAISAL ABDULLAH transceiver Mon May 03 15:27:44 2010 MOTOROLA CONFIDENTIAL RESTRICTED PROJECT NAME THE DRAWING ON THIS PRINT AND INFORMATION 84009289002.cpm < 6880401P59-O...
Page 132: Component Locations
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.17 Component Locations Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description C1002B6 2113946U05 CAPACITOR,FIXED,.47UF,+10%,-10 C231B10 2113944E13 CAPACITOR,CHIP,12PF,+5%,-5%,25 C402 2171410C01 CAPACITOR,CERAMIC,2.2UF,+20%,- C1003B6 2113944E22 CAPACITOR,CHIP,82PF,+5%,-5%,25 C233B10 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C403 2113945F07 CAPACITOR,FIXED,.01UF,+10%,-10 C1004B6 2175511A01...
Page 133 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description C510 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C700B7 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C727B7 2113946F08 CAPACITOR,CHIP,22UF,+20%,-20%, C514B10 2113945B04 CAPACITOR,FIXED,.022UF,+10%,-1 C701B7 2113944E22 CAPACITOR,CHIP,82PF,+5%,-5%,25 C730 2360567A11 CAPACITOR,TANTALUM,100UF,+20%, C515B10 2113945B04...
Page 134 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description C756B7 2113956B54 CAPACITOR,FIXED,10UF,+20%,-20% C792B6 2113956B55 CAPACITOR,FIXED,4.7UF,+10%,-10 C825B6 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C757B7 2113944E22 CAPACITOR,CHIP,82PF,+5%,-5%,25 C793 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C826B6 2187893N01 CAPACITOR,CERAMIC,1UF,+20%,-20 C758B7 2113944E22...
Page 135 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description C852B6 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C887B6 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C916B9 2187893N01 CAPACITOR,CERAMIC,1UF,+20%,-20 C853B6 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C888B6 2113946U01 CAPACITOR,FIXED,.1UF,+10%,-10% C917B9 2187893N01 CAPACITOR,CERAMIC,1UF,+20%,-20 C854B6 2113946U01...
Page 136 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description E703 2475316C68 FILTER,COILS (AIR OR FORMED), L402 7688697V04 FILTER,EMI/RFI,1.5A,SM,0402,PB Q904B9 4809807C45 TRANSISTOR,FET GEN PURPOSE POW E7040 7685268E01 FILTER,FERRITE BEAD,650MA,SM,0 L501B10 0613952R66...
Page 137 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description R630B10 0613952Y66 RESISTOR,METAL FILM,0OHM,5%,GW R725B7 0613952Y66 RESISTOR,METAL FILM,0OHM,5%,GW R810B6 0613952Y25 RESISTOR,METAL FILM,100KOHM,5% R632B10 2470327G27 INDUCTOR,CHIP,8.2NH,3%,CERAMIC R727B7 0613952Y66 RESISTOR,METAL FILM,0OHM,5%,GW R812B6 0613952Y66...
Page 138 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. Des. Part No. Description Ref. Des. Part No. Description Ref. Des. Part No. Description R888B6 0613952Y66 RESISTOR,METAL FILM,0OHM,5%,GW U1001B9 5188160Y03 IC,SWITCH,HIGH SPEED,QFN,DUAL VR852B6 4809788E25 DIODE,ZENER,CDZ7.5B,SM,7.6V,.1 R890 0613952X25 RESISTOR,METAL FILM,10OHM,5%,G U1002B9 5175771A37 IC,LINEAR VOLTAGE REGULATOR,FI VR900B9 4870359A02...
Page 139 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION This Page Left Blank Intentionally 6880401P59-O...
Page 140 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION This Page Left Blank Intentionally 6880401P59-O...
Page 141: Customer Service
APPENDIX A ORDERING REPLACEMENT PARTS AND KITS Parts should be replaced with identical replacement parts. Replacement parts and kits for i897 units can be ordered directly from the Motorola Accessories and Aftermarket Division (AAD) at 1-800-422-4210 and listen to the prompts; or FAX 800-622-6210.
Page 142: Replacement Kits
A.5 Replacement Kits When ordering replacement kits, the complete kit number should be included. If the correct number cannot be located, call Motorola Parts Identification at 1-800-422-4210. Refer to the exploded view and parts list in Chapter 7. MobileME Description...
Page 143 ORDERING REPLACEMENT PARTS AND KITS: Replacement Kits Replacement Kits (Continued) Music & Entertainment Wired MonoHeadset (mUSB) SYN1472 Music & Entertainment microUSB Stereo Headset SYN1458 Music & Entertainment microUSB Stereo Headset-FM Optimized SYN2357 Music & Entertainment microUSB Stereo Headset-FM Optimized (Cost reduced) SYN2809 Music &...
Page 144 ORDERING REPLACEMENT PARTS AND KITS: Replacement Kits Replacement Kits (Continued) Travel Charger MicroUSB Fast Rate Fixed Blade- ARG SPN5370 Power Travel Charger MicroUSB Fast Rate Fixed Blade- Brazil US Blades- MADE IN CHINA - PORTUGUESE LABEL SPN5403 Power Travel Charger MicroUSB Fast Rate Fixed Blade- EURO SPN5383 Power Travel Charger MicroUSB Fast Rate Fixed Blade- INDIA...
Page 145: Recommended Test Equipment And Tools
ORDERING REPLACEMENT PARTS AND KITS: Recommended Test Equipment A.6 Recommended Test Equipment and Tools The following table lists the standard test equipment recommended for troubleshooting i897 units at the field level of service. Table: A-2. Recommended Test Tools Part Number...
Page 146: Recommended Programming Equipment
ORDERING REPLACEMENT PARTS AND KITS: Recommended Programming Equipment A.7 Recommended Programming Equipment The following tables list the programming equipment and software recommended for troubleshooting i897 units at the field level of service. Table: A-3. Recommended Programming Equipment Name Part Number...
Page 147 6880401P59-O...

Motorola i897 Detailed Service Manual

Chapter 1

Chapter 2

Chapter 3

Chapter 4

Appendix A

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