M-430
5-2. PRINTED WIRING BOARD
1
2
A
B
C
D
E
F
G
H
• Semiconductor
Location
Ref. No.
Location
D102
G-3
IC101
D-6
IC601
E-9
3
4
5
(
)
REC/PB/ERASE
HD+
HD–
HE+
HE–
Note:
• X : parts extracted from the component side.
• b : Pattern from the side which enables seeing.
– 11 –
6
7
8
HRPE901
HEAD
(REC/PB)
(ERASE)
9
10
11
12
– 12 –
13