Samsung MH026FPEA Training Manual page 141

PCB Diagram
I
Parts List (Top)(cont.)
Location No.
R806,R807
R808
R901,R902,R903,R904,R905
R906,R907
R908,R909,R910
RY01
RY31
VA01,VA02,VA03,VA04,VA05
XTAL01
XTAL51
ZD21,ZD22,ZD72
IC50
FUSE CLIP
140
Description
R-CHIP
R-CHIP
R-CHIP
R-CHIP
RELAY-POWER
RELAY-MINIATURE
VARISTOR
RESONATOR
RESONATOR
DIODE-ZENER
IC-MICOM
Specification
20ohm,5%,1/4W,TP,3216
470ohm,5%,1/8W,TP,2012
1Kohm,5%,1/4W,DA,TP,3216
8.2Kohm,1%,1/10W,TP,1608
12VDC,0.9W,20000MA,SPST,20MS,10MS
12V,11.7MA,DPDT,4MS,4MS
560V,2500A,17.5x7.5mm,TP
6.25MHz,+/-0.5%,YP,8.5x6.5x4.0
4MHz,0.5%,BK,8X3X5.5MM
MMBZ5232B,5%,225mW,SOT-23,TP
MB90F823,80P,5V,24MHz,SMT-0458-OA
Q'TY Remark
2
1
7
3
1
1
5
1
1
3
1
1
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