Samsung MH026FPEA Training Manual page 135

PCB Diagram
I
Parts List (cont.)
Location No.
R503
C108
C103,C105,C107,C201
C211,C212,C302,C401
C402,C502,C511
C801~803,C806~808
C901~904
C301,C503
C202,C203,C501
C704
C702,C703
XC72
CR71
XC71
C104
C106
C701
C601
C102
X301
BZ61
SW01
SS71
F701_1
F702
F701
CN71
CN72
CN44
CN63
CN91
CN45
CN41
CN61
IC04
ST11
FT71
134
Description
R-CHIP
C-CERAMIC,DISC
C-CER,CHIP
C-CER,CHIP
C-FILM,LEAD-PEF
C-FILM,LEAD-PEF
C-FILM,MPPF
C-FILM,MPPF
C-FILM,PCF
C-AL
C-AL
C-AL
C-AL
C-AL
RESONATOR-CERAMIC
BUZZER-PIEZO
SWITCH-DIP
SSR
FUSE-CARTRIDGE
FUSE-RADIAL LEAD
FUSE-BLOCK
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
IC MICOM
TRANS SWITCHING
COIL,CHOKE
Specification
6.8Kohm,5%,1/8W,TP,2012
2.2nF,20%,400V,Y5U,BK,12.5x6mm,10
C-CER,CHIP;100nF,+80-20%,50V,Y5V,TP,2012
1nF,10%,50V,X7R,TP,2012,-
10nF,+80-20%,50V,Y5V,TP,2012
10nF,10%,630V,TP,16x11x7.5mm,5
4.7nF,10%,100V,TP,10x8.5x5.0mm
100nF,10%,275V,BK,18x6x12,15
1.2uF,10%,450Vac,BK,38x18x30,3
220nF,10%,275V,BK,18x10x6,18
1000uF,20%,25V,GP,TP,10x20,5
470uF,20%,16V,GP,TP,10x12.5,5
47uF,20%,50V,GP,TP,6.3x11,2.5
47uF,20%,50V,GP,TP,6.3x11,5
15uF,20%,450V,GP,TP,12.5x20mm,5
10MHz,0.5%,BK,8x3x5.5mm
85DB,-,-,2KHz,-
24V,300mA,SLIDE,-
12Vdc,-,2A,1mS,1mS
250V,3.15A,TIME-LAG,GLASS,5x20mm
250V,1A,TIME-LAG,-,8.5x8mm
500V,-,100M
1WALL,3P,1R,7.92mm,STRAIGHT,SN,BL
1WALL,3P,1R,7.92mm,STRAIGHT,SN,WH
BOX,3P,1R,2.5mm,STRAIGHT,SN
BOX,5P,1R,2.5mm,STRAIGHT,SN
BOX,14P,1R,2mm,STRAIGHT,SN
BOX,3P,1R,2mm,STRAIGHT,SN
BOX,4P,1R,2mm,STRAIGHT,SN
BOX,5P,1R,2mm,STRAIGHT,SN
MB89538APF-101,MB89538APF-101,64P,+5V,10M
TRANS SWITCHING;-,JT1916-09,-,310V,FERRITE,-,EI191
LS404190M,AS-S660,19mH,+50,-30%,-,300Mohm,2A,-,-,-
Q'TY Remark
1
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1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
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