Diagrams; Note For Printed Wiring Boards And Schematic Diagrams - Sony CDP-CE275 Service Manual

6-1.

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
Q
B C E
These are omitted.
Q
B C E
These are omitted.
SECTION 6

DIAGRAMS

Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• : internal component.
f
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
une marque 0 sont critiques
fied by mark 0 or dotted
line with mark 0 are criti- pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
spécifié.
number specified.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
c : DIGITAL OUT
• A: B+ Line
• B: B– Line
• Circuit Boards Location
LOADING MOTOR board
POWER SW board
KEY board
DISPLAY board
15 15
CDP-CE275/CE375
SENSOR board
BD board
JUNCTION board
MAIN board
HEADPHONE board