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TA-F501ES
QQ
3 7 63 1515 0
Output (Digital)
DIGITAL 4
S/N: 96 dB
(A, 20 kHz LPF)
TONE
±10 dB, 1 dB step
TREBLE
±10 dB, 1 dB step
BASS
General
Power requirements 230 V AC, 50/60 Hz
P
ower consumption
60 W
Dimensions (w/h/d) (Approx.) 280 × 111 ×
286 mm
including projecting parts
and controls
Mass
(Approx.) 4.6 kg
Supplied accessories
Operating Instructions
Optimizer microphone ECM-AC1 (1)
AC power cord (mains lead) (1)
Remote commander RM-AAU012 (1)
Design and specifications are subject to
change without notice.
TE
L 13942296513
www
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
.
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
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Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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