Optoma EP756 Service Manual page 66

Color projector
Hide thumbs Also See for EP756:
Table of Contents

Advertisement

Introduction
Fundamental Principle
Troubleshooting
Function Test and Alignment Procedure
Note 1 : Tilt Angle Tolerances
Limits on variability of mirror tilt half angle are critical in the design of the accompanying optical system. Variations in tilt
angle within a device may result in apparent non-uniformities, such as line pairing and image mottling, acress the pro-
jected image. Variations in the average tilt angle between devices may result in colorimetry and system contrast variations.
The specified limits represent the tolerances of the tilt angles within a device.
Note 2 : Active Area Reflectivity
The DMD specular reflectivity is defined as the ratio of the light incident upon the mirror array to the light specularly
reflected from it. The measurement is made with all mirrors in the full on state without electronic duty cycle effects (i.e.
measure using 100% duty cycle). The specified specular reflectivity applies to any arbitrary point on the DMD active area.
Note 3 : Window Transmittance
Angle of incidence 0
Note 4 : Thermal Performance
The DMD is designed to conduct absorbed and dissipated heat to the back of the package where it can be removed by an
appropriate heat sink. The heat sink and cooling system must be capable of maintaining the package within the specified
operational temperatures. The total heat load on the DMD is largely driven by the incident light absorbed by the active
area although other contributions include light energy absorbed by the window aperture and electrical power dissipation
of the array. Optical systems should be designed to minimize the light energy falling outside the window clear aperture
since any additional thermal load in this area can significantly degrade the reliability of the device. For more information
on thermal characteristics and applications of the 0.7XGA DMD, refer to Texas Instruments DMD Thermal Guide for 0.
7XGA Type A.
Mechanical Construction
Procedure of Disassembly
Firmware Upgrading Procedure
o
- 45
o
at 42-680nm. Double pass system. Two AR coating surfaces at 0.5% reflectivity per AR coating.
Function of Boards
Specifications
DDC Key-In Procedure
Appendix
6-3
EP757
SERVICE MANUAL

Advertisement

Table of Contents
loading

Table of Contents