3 • Installation and Power-Up
3.1 Installation
Publication No. SBC330-0HH/3
SBC330 boards should only be installed into 3U VPX backplanes. With the VPX
connector standard, great care should be exercised in installation and removal of
all daughter boards into the backplanes. The insertion forces are significant.
CAUTION
The SBC330 has been specifically designed for use with 3U VPX backplanes and is not compatible
with 6U backplanes. Plugging the SBC330 into a 6U backplane may cause permanent component
damage.
The SBC330 is normally supplied with round‐hole VPX guides that allow it to be
plugged into any VPX backplane slot.
Many new‐generation backplanes have some tracking within the backplane PCB
for fast I/O and so may also have tracking for external I/O, which operates at high
voltages. Ensure that the slot into which the SBC330 board is plugged is intended
for use by the SBC330 and does not have any high voltage I/O inputs on the VPX
connectors.
TIP
GEIP supply universal backplanes that allow modules to be plugged into any slot . All I/O
connections are made with Rear Transition Modules and high specification cabling.
The SBC330 is electrically compatible with the pin listings in Chapter 9 •
out all installation with the power and data cables fully disconnected.
NOTE
Only plug SBC330 boards into compatible system backplane slots.
Air‐cooled versions of the SBC330 have an injector/ejector handle to ensure that
the backplane connectors mate properly with the backplane. The best way to
install a build level 1 to 3 SBC330 into a convection cooled rack is to use the
leverage of the purpose‐designed handle. The captive screws at the top and
bottom of the front panel allow the board to be tightly secured in position, which
provides continuity with the chassis ground of the system.
Build level 4 and 5 boards need to be inserted with the wedge‐locks wound back
only so far as not to contact the sides. When tightening the wedge‐locks, take care
that the contacting beams have not rotated by 90 degrees. This possibility has
been virtually eliminated on later designed heatsinks, but may still be possible
(rotated wedge‐locks wedge against the wrong surface and can crack when
tightened.) Correct adjustment requires a calibrated torque wrench with a
hexagonal head of size 3/32" (2.38 mm), set to between 0.6 and 0.8 Nm.
In an air‐cooled development enclosure, when taking I/O connections from the
backplane connectors, use of the GEIP SBC330RTM ensures optimum operation
of the SBC330 with regard to EMI.
. Carry
Installation and Power-Up 15