Telemark 880 Manuals

Telemark 880 Manuals

Manuals and User Guides for Telemark 880. We have 1 Telemark 880 manual available for free PDF download: User Manual

Telemark 880 User Manual

Telemark 880 User Manual (278 pages)

Thin Film Deposition Controller

Brand: Telemark | Category: Controller | Size: 2 MB

Table of Contents

Title Page

2
Warranty

3
Introduction [1.XX]

4
Section 1.3 Table of Contents

6
- STC-Spare Parts (Included W/Model 880)
  12
- STC-Optional Parts
  12
- STC-Optional Crystal Sensor Parts
  12
- Contact Information
  13
- Section 1.4
  14
  - Product Specifications
    14
- Section 1.5
  15
  - Programmable Parameter Lists
    15
  - Programmable Parameter Dependency Lists
    18
- Section 1.9
  20
  - Sensor Specifications
    21
Simple Quick Generalized Overview [2.XX]

22
Menu Programming and Operation Details [3.XX]

50
- Section 3.0
  50
  - LCD Touch Panel Overlay
    50
  - Front Panel Definitions
    51
- Section 3.1
  57
  - Navigating through Model 880 Menus
    57
  - Menu Tree
    57
- Section 3.2
  59
  - Runtime Screen Description
    59
- Section 3.3
  61
  - Main Menu Description
    61
- Section 3.4
  64
  - Films and Processes
    64
- Section 3.5
  64
- Section 3.6
  84
  - Editing Processes
    84
    
    Process Lock Code
    94
    
    Factory Restoration Vs. Purged Settings
    94
    
    Changing Memory Settings
    94
- Section 3.7
  94
  - Set Active Process
    94
- Section 3.8
  95
  - Non-Sequencing Differences
    95
- Section 3.9
  97
  - Software Controlled Runtime Screen Keys
    97
    
    L/Q Key (Crystal Quality)
    97
    
    SMPL Key (Sample and Hold)
    97
- Section 3.10
  98
  - Manual Power Control
    98
    
    Using Pendent
    98
    
    Using LCD Keys
    99
- Section 3.11
  100
  - Model 880 Shutter Delay
    100
- Section 3.12
  100
  - Deposition Source Control Loop Description
    100
- Section 3.13
  102
  - Film Phases and Parameter Groups
    102
- Section 3.14
  103
  - System Configuration
    103
- Section 3.15
  103
  - Detailed System Configuration Related Parameters
    104
  - Communications Configuration Related Parameters
    106
    
    Detailed Communications Configuration Related Parameters
    107
- Section 3.17
  109
  - Model 880 Crystal Failure Processing
    109
- Section 3.18
  113
  - Process Accounting
    113
- Section 3.19
  115
  - Options/Info
    115
  - Checksum Validation
    116
  - Checksums and Parameters after Purge
    117
- Section 3.20
  119
  - Memory Module Programming & Usage
    119
    
    Memory Module Data Transfer
    121
    
    Memory Module Placement
    122
- Section 3.21
  123
  - Programming Example
    123
    
    Entering the TEST Mode
    123
- Section 3.22
  131
  - Product Programming Summary
    131
Electrical Connections and Descriptions [4.XX]

136
- Section 4.0
  136
  - Sensor Head Installation
    136
- Section 4.1
  139
  - Electrical Connections and Descriptions
    139
- Section 4.2
  139
  - Line Power
    139
- Section 4.3
  139
  - Rack Mounting
    139
- Section 4.4
  139
  - Vacuum System Grounding
    139
- Section 4.5
  141
  - Sensor Connections
    141
- Section 4.6
  141
  - Analog Control Voltage Connections
    141
  - Control Voltage Output Connection
    141
- Section 4.7
  142
  - Analog Recorder Output Connection
    142
  - Analog Recorder Output Specifications
    142
- Section 4.8
  142
  - I/O Interface
    144
  - I/O Program
    144
  - Relay Outputs (Factory I/O Program)
    147
- Section 4.11
  147
- Section 4.10
  148
  - Remote Inputs (Factory I/O Program)
    148
  - RS-232 Serial Communications Interface
    148
- Section 4.12
  149
  - Communications Options
    149
I/O Programming [5.XX]

150
- Section 5.1
  150
  - I/O Programming Introduction
    150
- Section 5.2
  150
  - Boolean Definitions
    154
  - Relay Ladder Notation
    154
- Section 5.3
  155
  - States and Events
    155
  - Truth Table
    155
  - Event and State ID List
    159
  - Steady State Vs. Edges
    160
  - Input Functions
    160
- Section 5.6
  161
  - Output Functions
    161
- Section 5.7
  161
  - Softnodes and Sync Events
    161
  - Internal Operations
    162
- Section 5.9
  163
  - Operate Menu
    163
- Section 5.10
  163
  - Memory Menu
    163
- Section 5.11
  164
  - Editing an I/O Program
    164
  - I/O Programming Tree
    166
- Section 5.12
  169
  - I/O Setup Edit Menu
    169
- Section 5.13
  170
  - Edit/Change Menu
    170
Computer Interfacing [6.XX]

192
- Section 6.0
  192
  - Host Port Interface
    192
  - Making an RS232 Cable
    192
  - Communications Setup Mode
    194
  - Response Character Table
    195
  - Program
    196
  - Parameters
    197
  - Memory
    234
  - Program
    244
  - I/O Program
    246
Theory and Calibration [7.XX]

262
- Equation 1
  262
- Section 7.1 Calibration
  263
  - Thickness
    263
  - Density Determination
    263
  - Z-Factor Determination
    263
  - Tooling Dtermination
    263
  - Material Reference Table
    265
    
    Aluminum through Indium
    265
    
    Indium Intimonide through Terium
    266
    
    Thallium through Zirconium Oxide
    267
Maintenance/Problem Solutions [8.XX]

268
- Section 8.0
  268
  - Warnings/Cautions
    268
  - User Correctable System Problems
    268
- Section 8.1 Replacinga Sensor Crystal
  269
  - Cautions/Procedural Steps
    269
- Section 8.2 Persistent Crystal Fail Indication
  269
  - Discussion
    269
  - Hardware Issues
    270
- Section 8.3 Faq S
  271
- Section 8.4 System Battery and Memory Considerations
  271
  - Procedure to Change Battery
    271
Glossary

272

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