Page 1: Table Of Contents
OPEN/ 9. Electrical Parts List POWER CLOSE CLOSE 24bit 96kHz AUDIO D/A CONVERTER SPATIALIZER N-2-2 DIGITAL VIDEO 10. Block Diagram 11. PCB Diagrams 12. Wiring Diagram 13. Schematic Diagrams © Samsung Electronics Co., Ltd. JUN. 1999 Printed in Korea AH68-00180A...
Page 2: Precautions
Melal Part cal return path to the chassis. Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the out- ohmmeter let and repeat the test. See Fig. 1-1. Fig. 1-2 Insulation Resistance Test Samsung Electronics...
Page 3 (5) antenna wiring. Always inspect in all areas tinuously and new instructions are issued whenev- for pinched, out-of-place, or frayed wiring, Do not er appropriate. change spacing between a component and the printed-circuit board. Check the AC power cord for damage. Samsung Electronics...
Page 4: Servicing Precautions
Components i-enti- fied by shading, by( ) or by ( ) in the circuit dia- gram are important for safety or for the characteris- tics of the unit. Always replace them with the exact replacement components. Samsung Electronics...
Page 5 (6) Do not remove a replacement ESD device from its protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically short- ed together by conductive foam, aluminum foil or comparable conductive materials). Samsung Electronics...
Page 6 3 Be sure to put on a wrist strap grounded to the sheet. 3 Be sure to lay a conductive sheet made of copper etc. Which is grounded to the table. Samsung Electronics...
Page 7 4) Switch LD SW3 on Deck PCB to ÒONÓ and insert 4) Disassemble the deck PCB. FPC into Main PCB CN6 (See Fig 1-4). Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged. Fig. 1-4 Samsung Electronics...
Page 8: Reference Information
"L":normal speed, "H":double speed DEM0 De-emphasis frequency select pin DZFR Rch zero input detect pin De-emphasis frequency select pin DZFL Lch zero input detect pin DEM1 Note : Allinput pins except internal pull-down pins should not be left floating. Samsung Electronics...
Page 9 DDVD1 ENV_SEL(02H) 58 BCA ACD1 GAIN_FE(03H) MIRR OFSTHOLD BCD1 ABCD_OFST(O6H) CCD1 56 DPDVCC FE_0FST(05H) DCD1 55 DFCT2 AVCC CDRSEL(00H) 54 DFCT1 LDONB(00H) TESEL(OOH) ANALOG VREFA VC AMP 53 DFCTTH1 ENVELOPE DEFECT 52 DFCTTH2 ALPC FOFST FOFST 51 DVCC Samsung Electronics...
Page 10 Reference Information Samsung Electronics...
Page 11 Reference Information 2-1-3 SIC1 (KS1452 ; Digital Servo) DIRC SSTOP /PSO SMON LOCK DFCT FOKB MIRR TZCA PHI1 XOUT TEST RSTB TILTO TILTI Samsung Electronics...
Page 12 Reference Information Samsung Electronics...
Page 13 Reference Information 2-1-4 DIC1 (KS1453 ; DVD Data Processor) Samsung Electronics...
Page 14 Reference Information Samsung Electronics...
Page 15 D a t a O u t p u t E n a b l e P o w e r ( + 5 V ) P o w e r ( + 3 . 3 V ) N . C No Connection Samsung Electronics...
Page 16 D V D - D A T A 7 / C D G - S C L K Global VREQUEST I n t e r f a c e VSTROBE A_VSS Signals ERROR A_VDD P10[10:0] V-DACK/ASTROBE AREQUEST R E S E T A-DACK ZiVA Decoder Samsung Electronics...
Page 17 Raster Contral 1 for video port. This pin receives/provides a VS/FS/FSEQ signal. RCV1 Raster Contral 2 for video port. This pin provides an HS pulse of programmable length or receives I / O RCV2 an HS pulse. 2-10 Samsung Electronics...
Page 18 The 12C-bus receiver waits for the START condition. S C L 12C serial clock input S D A I / O 12C serial data input/output TTXRQ Teletext Request output, indicating when text bits are requested T T X Teletext bit stream input Samsung Electronics 2-11...
Page 19 P30(RD) P31(WR) 8BIT PWM (T03)P73 P32(HWR) (TIMER 3) P33(WAIT) PORT 3 P34(BUSRQ) (INT4/T14)P80 P35(BUSAK) (INT5/T15)P81 16BIT TIMER P36(R/W) (T04)P82 (TIMER 4) P37(RAS) (T05)P83 16BIT TIMER (INT6/T16)P84 CS/WAIT P40(CS0/CAS0) (TIMER 5) (INT7/T17)P85 CONTROLLER P41(CS1/CAS1) (T06)P86 (3-BLOCK) P42(CX2/CAS2) (INTO)P87 2-12 Samsung Electronics...
Page 20 Reference Information Samsung Electronics 2-13...
Page 21 Chip Enable and Output Buffers Prog Logic Gating Decoder A0-A19 Address 2,097,152-Bit Inputs Cell Matrix Decoder TOP VIEW NAME FUNCTION A0-A19 Address Inputs Chip Enable Input Data Input/Outputs DQ0-DQ7 Output Enable Input Vcc Syply Voltage OE/VPP Ground 2-14 Samsung Electronics...
Page 22 Reference Information 2-1-10 FIC2 (LC866232 ; Front Micom) Samsung Electronics 2-15...
Page 23 Reference Information MEMO 2-16 Samsung Electronics...
Page 24: Product Specification
Digital : 0.50Vp-p 48KHz Sampling : 4Hz to 22 KHz Audio Output * Frequency Response 96KHz Sampling : 4Hz to 44KHz * S/N Ratio 110dB * Dynamic Range 96dB * Total Harmonic Distortion 0.003% * : Nominal specification Samsung Electronics...
Page 25 Product Specification MEMO Samsung Electronics...
Page 26: Operating Instructions
4. Operating Instructions Samsung Electronics...
Page 27 Operating Instructions Samsung Electronics...
Page 28 Operating Instructions Samsung Electronics...
Page 29 Operating Instructions MEMO Samsung Electronics...
Page 30: Disassembly And Reassembly
Note : If Tray Œ doesnÕt open, insert a Screw driver ¨ into the Emergency hole ˇ(as shown in detailed draw- ing) and then turn it in the direction of arrow ÒBÓ. Open Tray manually. Œ TRAY ´ DOOR-TRAY "A" ˇ EMERGENCY HOLE "B" ¨ SCREW DRIVER <Bottom View> Fig. 5-1 Door-Tray Removal Samsung Electronics...
Page 31 1) Remove 3 Screws Œ on the back Top Cabinet. 2) Remove 2 Screws ´, ˇ on the left and right side. 3) Lift up the Top Cabinet in direction of arrow. Œ 3 SCREWS ´ 1 SCREW ˇ 1 SCREW Fig. 5-2 Top Cabinet Removal Samsung Electronics...
Page 32 2) Remove 2 Screws ˇ and Power PCB ¨. 3) Remove 3 Screws ˆ and Play PCB Ø. Œ 2 SCREWS ˇ 2 SCREWS ¨ POWER PCB ˆ 3 SCREWS Ø PLAY PCB ´ ASS'Y FRONT-PANEL Fig. 5-3 Ass’y Front-Panel, Power PCB, Play PCB Removal Samsung Electronics...
Page 33 2) Lift up the Jack PCB ˇ. 3) Remove 3 Screws ¨ and lift up the Main PCB ˆ. Œ 4 SCREWS ˇ JACK PCB ¨ 3 SCREWS ˆ MAIN PCB ´ 1 SCREW Fig. 5-4 Main PCB, Jack PCB Removal Samsung Electronics...
Page 34 Disassembly/Reaasembly 5-1-5 Ass’y Deck Removal 1) Remove 4 Screws Œ from the AssÕy Deck and lift it up. Œ 4 SCREWS Fig. 5-5 Ass’y Deck Removal Samsung Electronics...
Page 35: Pcb Location
Disassembly/Reaasembly 5-2 PCB Location JACK PCB POWER PCB MAIN PCB PLAY PCB Fig. 5-6 PCB Location Samsung Electronics...
Page 36 ˆ CN12 JACK PCB MAIN PCB Ø MAIN PCB JACK PCB CN12 ∏ CN11 JACK PCB MAIN PCB ” MAIN PCB JACK PCB CN11 ’ DECK PCB MAIN PCB ˝ MAIN PCB DECK PCB Fig. 5-7 Connector Diagram Samsung Electronics...
Page 37 3) Pull the Tray Ø to disassemble, while simultaneously pushing the Hook ∏, ” in direction of arrow ÒAÓ, ÒBÓ. Œ 2 SCREWS ´ COVER SHEET ˇ ASS'Y - DECK CLAMPER ∏ HOOK "C" "B" "D" ” HOOK Ø TRAY ˆ SCREW DRIVER "A" ¨ EMERGENCY HOLE <Bottom View> Fig. 5-8 Tray Removal Samsung Electronics...
Page 38 2) Disassemble the AssÕy-Deck Sub ¨ in direction of arrow ÒBÓ, while simultaneously pushing the Hook ˇ in direction of arrow ÒAÓ. ¨ ASS'Y - DECK SUB "B" "A" ˇ HOOK ´ ASS'Y - PCB DECK Œ 2 SCREWS Fig. 5-9 Ass’y-Deck Sub Removal Samsung Electronics...
Page 39 ALIGN TWO ARROWS ’ GEAR - CAM SUB Æ GEAR - SYNCRO Ú SHAFT - SYNCRO Æ GEAR - SYNCRO Ò LEVER - OPEN S/W 1 SCREW Ô ASS'Y - MOTOR LOAD Fig. 5-10 Chassis-Main Parts Removal 5-10 Samsung Electronics...
Page 40 Disassembly/Reaasembly 5-4-4 Ass’y-Brkt Deck Removal 1) Remove 4 Screws Œ. 2) Lift up the AssÕy-Brkt Deck ´. Œ 4 SCREWS ´ ASS'Y - BRKT DECK Fig. 5-11 Ass’y-Brkt Deck Removal Samsung Electronics 5-11...
Page 41 GEAR - FEED B Ô WASHER - PLAIN Ø ASS'Y - PICK UP Ú ASS'Y GEAR - FEED CU/CL ˇ SHAFT - P/U Ò WASHER - PLAIN ˆ RACK - SLIDE ¨ 2 SCREWS Fig. 5-12 Ass’y- Deck Parts Removal 5-12 Samsung Electronics...
Page 42: Circuit Descriptions
Input : Common power to transformer (Vp). Fig. 6-2 The output Vs of transformer is determined by the ratio of 1st Np and 2nd Ns. Vs = (Ns/Np) x Vp Fig. 6-3 Vout Vout is output (DC) by diode and condensor. Fig. 6-4 Samsung Electronics...
Page 43 Fig. 6-6 3 Terms 1) 1st : Common power input to 1st winding. 2) 2nd : Circuit followings output winding of transformer. 3) f (Frequency) : Switching frequency (T : Switching cycle) 4) Duty : (Ton/T) x 100 Samsung Electronics...
Page 44 ´ Rectify to PD12 and smooth to PE6. ˇ Use the output of transformer as PIC1 Vcc : The loads are different before and after PIC1 driving. (Vcc of PIC1 decreases below OFF voltage, using only the resistance due to load increase after PIC1 driving.) Samsung Electronics...
Page 45 Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedback to maintains 5.8V). Œ PR35, PR36 : Reduce 5.8V overshoot ´ PR37, PC44 : Prevent PIC3 oscillation(for phase correction) ˇ PC09 : Adjust feedback response rate Samsung Electronics...
Page 46 Fig. 6-9 6-1-3 (b) PIC1 (STR-G6153T) Internal Block Diagram V c c Voltage Sync. 6.3V UVLO Ref. OSC. Drain Feedback 2.5R Source Voffset Sense Rsense Reset Sense 7.5V Reset Thermal Protection Control IC O C P Fig. 6-10 Samsung Electronics...
Page 47 RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWM signal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency. EQout terminal is connected with EQin (Pin 86). Samsung Electronics...
Page 48 Œ EQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal, output from KS1453, into DC via low-pass filter. ´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output from KS1453, into DVD via low-pass filter. Samsung Electronics...
Page 49: System Control
KS1461 KS1452 KS1453 ZIVA-3 SAA7128/7120 AK4324 FIC1 MIC1 MIC2 FRONT MICOM MAIN MICOM ADDR LATCH LC86P6232 TMP93CM41F 74AC573 MIC7 ADDR DECODER DATA BUS 74HC00 MIC5 MIC8 EEPROM EPROM KS24C020 AT27C080 MICOM BLOCK LOW ADDRESS HIGH ADDRESS Fig. 6-13 Samsung Electronics...
Page 50 • CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT) • CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT) • CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT) • CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL) • CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL) Samsung Electronics...
Page 51 • CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT) • CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT) • CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT) • CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL) • CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL) 6-10 Samsung Electronics...
Page 52 6-4-2 Block Diagram DISC SLED M/T SPINDLE M/T HALL MIC1 TMP 93CS41F › HA1+ HA1– SIC8 HA2– NJM2903 RIC1 HA2+ KS1461 SLED+ SLED– SIC1 KS1452 & DRIC2 FOCUSING F– KA3010D TRACKING T– SPINDLE DRIC1 KA3011D “ Fig. 6-17 Samsung Electronics 6-11...
Page 53 Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speed from disc is faster than data output speed on screen). ´ For CD, VCD Receive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD. 6-12 Samsung Electronics...
Page 54 If the existing track count is within fine seek range, tracking begins using fine seek. 4) CLV SERVO(DISC MOTOR CONTROL SERVO) Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to SIC1 pin 55 for constant linear velocity. Samsung Electronics 6-13...
Page 55 177, 178 SDATA[7..0] DVD-D[7..0] VIC1 EFMI PLCK CSTROBE VSTROBE (ZiVA-3) PLCK DATREQ REQUEST DIC1 DATACK DACK (KS1453) HDATA[7..0] DTER *ERR HADDR[3..0] MDAT[7:0] MRZA(3) ZCS(2) /INT MWR(128) MRD(127) ZIRQZD(126) AD[7..0] INTO(ZIRQZD) HA[23..8] INT4(/INT) *RD(72) *WR(73) MIC1 TMP93CM41F Fig. 6-19 6-14 Samsung Electronics...
Page 56 It measures the timing that data processed in DIC1 at DVD playback. STROBE DACK SDATA all Fig. 6-20 • CH1 : STROBE (DIC1-69, CLOCK) • CH2 : REQ (DIC1-70, DATA REQUEST) • CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE) • CH4 : SDATA (DIC1-60~67, DATA) Samsung Electronics 6-15...
Page 57 Video signal converted into analog signal is outputted via amplifier of analog part. (Main Board) (Output Board) CVBS-1 Video VIC1 CVBS-2 VIC52 data A/V Decoder Amplifier ZiVA-3 BA7660 VIC50 SAA7128 Video encoder MIC1 VIC51 Main Micom Amplifier TMP93CM41F BA7660 Fig. 6-21 Video Output Block Diagram 6-16 Samsung Electronics...
Page 58 13). Pin9, Pin12 and Pin14 of VIC51 and VIC52 are feedback pin to SAG compensation(DC characteristic compen- sation of signal). Resistance(VR3-VR14) which is inserted to input terminal is bias resistance for input offset. The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm. Samsung Electronics 6-17...
Page 59 CVBS/Y_VCR_OUT SIC2 SIC3 SIC4 R_TV_OUT (14053) (14053) (NJM2267) G_TV_OUT Switch Switch Amplifier CVBS_VCR_OUT CVBS_S B_TV_OUT CVBS_TV_IN R/C_TV_OUT R_VCR_IN R_VCR_IN SIC1 SIC5 SIC6 G_TV_OUT (14053) (14053) (BA7660) G_VCR_IN G_VCR_IN B_TV_OUT Switch Switch Amplifier B_VCR_IN B_VCR_IN CVBS_VCR_OUT Fig. 6-23 6-18 Samsung Electronics...
Page 60 D/A CONVERTER FRONT-R FILTER VIC1 (ZiVA-3) A/V Decoder DATA2 POST AIC3 SURROUND-L FILTER AK4324 POST D/A CONVERTER SURROUND-R FILTER DATA3 POST AIC4 CENTER FILTER AK4324 POST D/A CONVERTER SUB WOOFER FILTER Fig. 6-24 Audio Output Block Diagram Samsung Electronics 6-19...
Page 61 The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted in digital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTS amplifier built in the external digital input source with IEC-958/1937 transmission format. 6-20 Samsung Electronics...
Page 62: Troubleshooting
7. Troubleshooting Samsung Electronics...
Page 63 Troubleshooting Samsung Electronics...
Page 64 Troubleshooting Samsung Electronics...
Page 65 Troubleshooting Samsung Electronics...
Page 66 Troubleshooting Samsung Electronics...
Page 67 Troubleshooting Samsung Electronics...
Page 68 Troubleshooting Samsung Electronics...
Page 69 Troubleshooting Samsung Electronics...
Page 70 Troubleshooting Samsung Electronics...
Page 71 Troubleshooting 7-10 Samsung Electronics...
Page 72 8-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Samsung Electronics...
Page 73: Exploded Views And Parts List
Exploded Views and Parts List 8-1 Cabinet Assembly Samsung Electronics...
Page 74 Exploded Views and Parts List Loc. No Parts No. Description ; Specification Remark AH95-10355E ASSY-CABINET FRONT;DVD-739,ABS94HB,XAA AH95-50369E ASSY-DOOR TRAY;DVD-739,ABS,XAA AH61-00194A HOLDER-DECK A;-,ABS 94HB,-,BLK,-,DVD-909 AH64-80001E FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD AH61-00194B HOLDER-DECK B;-,ABS 94HB,-,BLK,-,DVD-909 AH61-00194C HOLDER-DECK C;-,ABS 94HB,-,BLK,-,DVD-909 6003-000275 SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018 6003-000276 SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC AH97-00188D ASSY-CABINET TOP;DVD-739,ASSY,XAA AH92-00172A ASSY-PCB-MAIN;DVD-739,MAIN PCB...
Page 75: Deck Assembly
Exploded Views and Parts List 8-2 Deck Assembly S.N.A. S.N.A. S.N.A. S.N.A. : Service Not Available Samsung Electronics...
Page 76 AH73-10017A RUBBER-INSULATOR;RUBBER(LB-40),OD11,DP-1 3809-001123 CABLE-FLAT;30V,80C,90MM,40P,1.25MM,UL289 AH61-50323A SHAFT-SYNCRO;-,sus304,2.1,119,-,-,dvd-90 AH66-22005A GEAR-SYNCRO-A;KEPITAL F20-03,M0.8,Z9,-,P AH97-00179A ASSY-HOUSING MOTOR;DP-3,-,SOH-DP1 AH60-10151A SCREW-TAP TITE;DP,SPEC6.8 ,PH,+,CP,M2,L AC60-10051A SCREW-TAPPING;BH,-,-,M3,L8,FZY AH60-10143U SCREW-TAP TITE;DP,PH,+,SPEC,TAP1.7,L5,ZP AH60-10145A SCREW-TAP TITE;DP,PH,+,SPEC OD5.5 FP,TAP AH60-10147A SCREW-MACHINE;DP,CH,+,FP,M2,L4,ZPC,SWRCH AC60-10059A SCREW-TAPPING;BH,+,-,1.7,X5,ZPC2 AH60-00010A SCREW-MACHINE-MOTOR;-,+,SWCH18AK,M1.7,L2 AC60-10042A SCREW-TAPPING;PWH,+,-,M3,L8,- BG60-10020A SCREW-SP MOTOR;-,BHW TOOTH,-,-,M1.7,L3,- Samsung Electronics...
Page 77 Exploded Views and Parts List MEMO Samsung Electronics...
Page 78: Electrical Parts List
9. Electrical Parts List Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark ASSY-PCB-MAIN;DVD-739 DRR11 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608 DRR12 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR13 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR14 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR3 2007-007157 R-CHIP;1ohm,5%,1/4W,DA,TP,3216 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608...
Page 79 C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,1608 RR44 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 2203-001052 C-CERAMIC,CHIP;.56NF,10%,50V,X7R,TP,1608 RR45 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 2203-001640 C-CERAMIC,CHIP;390pF,10%,50V,X7R,TP,1608 RR46 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 2203-000384 C-CERAMIC,CHIP;.015NF,5%,50V,NPO,TP,1608 RR47 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608, RR48 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 0401-000008 DIODE-SWITCHING;DAN217,80V,100mA,SOT-23, RR49 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 0403-001079 DIODE-ZENER;UDZ3.9B,7%,200MW,SOD-323,TP 2007-001056 R-CHIP;6.2Kohm,5%,1/16W,DA,TP,1608 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT- RR50 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
Page 80 VC21 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, SIC8 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUAL VC22 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VC24 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VC25 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP VC26 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 VC27 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Samsung Electronics...
Page 81 IC;M74HCU04,SOP,TAPE 14P VR51 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VR52 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 VL10 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 VR54 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 VL11 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VR55 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 VL12 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VR56 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 VL13 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- VR57 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
Page 82 Electrical Parts List Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark VR58 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608 ASSY-PCB-JACK;DVD-739 VR59 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP, VR60 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608 AC10 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,- VR61 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608 AC11 2202-000806 C-CERAMIC,MLC-AXIAL;220pF,10%,50V,Y5P,TP VR62 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608...
Page 83 IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTIC PD35 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DO FIC3 0801-002166 IC-CMOS LOGIC;7SHU04,INVERTER,SSOP,5P,63 PD37 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP FIC4 AH59-60010A MODULE-REMOCON;-,GP1U281Q,38KHz,940,MESH PD38 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm PE10 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5 2701-000113 INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm PE11 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MM PE12 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 FR10 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PE13 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 Samsung Electronics...
Page 84 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MM PVA01 1405-000186 VARISTOR;470V,4500A,17x12mm,TP VR13 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MM PZD31 0403-000716 DIODE-ZENER;MTZJ4.7B,4.7V,4.55-4.8V,500m VR130 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM RC12 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,11x VR132 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM RC13 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,11x VR133 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM RL03 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400, VR14 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MM SVJ1 3722-001375 JACK-DIN;4P,-,NI,BLK,- VR146 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM Samsung Electronics...
Page 85 CONNECTOR-FPC/FC/PIC;8P,1.0MM,ANGLE,SN 3708-001084 CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SN 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216 2203-000612 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,3216, 2404-000259 C-TA,CHIP;47uF,20%,6.3V,-,TP,6032,- 2404-000259 C-TA,CHIP;47uF,20%,6.3V,-,TP,6032,- 3301-000325 CORE-FERRITE BEAD;AB,3.2x2.5x1.3mm,-,- DLED 0601-001372 LED;ROUND,GRN,3.5MM,621NM 2007-000800 R-CHIP;360ohm,5%,1/8W,DA,TP,3216 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216 AH34-30001A SWITCH-PUSH;2EA,6.65X7.5,-,DC5V 3403-001001 SWITCH-PUSH;5V,5mA,-,OFF-ON 3408-000323 SWITCH-SLIDE;SSSS712GD011/12VDC 100ma Samsung Electronics...
Page 86: Block Diagram
Disc Motor Motor Driver Driver VIC4/10 32M SDRAM DIC2 4M DRAM Coaxial DIC1 (KS1453) DVD & CD Processor AIC1 VIC1 (AK4324) (ZiVA-3) Audio DAC A/V Decoder SIC1 (KS1452) CVBS Digital Servo Yout Cout VIC50 (SAA7128) Video Encoder Samsung Electronics 10-1...
Page 87 Block Diagrams MEMO 10-2 Samsung Electronics...
Page 88: Pcb Diagrams
11-5 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-4 Samsung Electronics 11-1...
Page 89 PCB Diagrams 11-1 Main 11-2 Samsung Electronics...
Page 90 PCB Diagrams 11-2 Jack Samsung Electronics 11-3...
Page 91 PCB Diagrams 11-3 Power 11-5 Deck 11-4 Play 11-4 Samsung Electronics...
Page 92: Wiring Diagram
12. Wiring Diagram MAIN PCB JACK PCB PLAY PCB POWER PCB DECK PCB Samsung Electronics 12-1...
Page 93 Wiring Diagram MEMO 12-2 Samsung Electronics...
Page 94: Schematic Diagrams
13-17 Remote Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 13-18 Jack PCB (Conductor Side) Samsung Electronics 13-1...
Page 95 Schematic Diagrams 13-1 S.M.P.S. 13-2 Samsung Electronics...
Page 96: Main Power Supply
Schematic Diagrams 13-2 Main Power Supply Samsung Electronics 13-3...
Page 97: Main Micom
Schematic Diagrams 13-3 Main Micom 13-4 Samsung Electronics...
Page 98: Servo
Schematic Diagrams 13-4 Servo Samsung Electronics 13-5...
Page 99: Video
Schematic Diagrams 13-5 Video Y Output C Output CVBS Output 13-6 Samsung Electronics...
Page 100: Audio
Schematic Diagrams 13-6 Audio Samsung Electronics 13-7...
Page 101: Channel Audio (Dvd-929K Only)
Schematic Diagrams 13-7 5.1 Channel Audio (DVD-929K Only) KCN2 KCN1 13-8 Samsung Electronics...
Page 102 Schematic Diagrams 13-8 RF Samsung Electronics 13-9...
Page 103: Ziva
Schematic Diagrams 13-9 ZiVA 13-10 Samsung Electronics...
Page 104: Dsp
Schematic Diagrams 13-10 DSP Samsung Electronics 13-11...
Page 105: Front Micom/Vfd Display
Schematic Diagrams 13-11 Front Micom/VFD Display CN18 TO KARAOKE KCN3 CN15 TO KEY CON21 13-12 Samsung Electronics...
Page 106: Scart Jack
Schematic Diagrams 13-12 Scart Jack R Output (Scart Jack) G Output (Scart Jack) B Output (Scart Jack) Samsung Electronics 13-13...
Page 107: Mute
Schematic Diagrams 13-13 Mute 13-14 Samsung Electronics...
Page 108: Karaoke/Power
Schematic Diagrams 13-14 Karaoke/Power Samsung Electronics 13-15...
Page 109: Play
Schematic Diagrams 13-15 Play 13-16 Samsung Electronics...
Page 110: Deck
Schematic Diagrams 13-16 Deck Samsung Electronics 13-17...
Page 111: Remote Control
Schematic Diagrams 13-17 Remote Control 13-18 Samsung Electronics...

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