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Q Q
3 7 6 3 1 5 1 5 0
6-5. CIRCUIT BOARDS LOCATION
SUB board
SENSOR board
LOAD board
T E
L
1 3 9 4 2 2 9 6 5 1 3
JOG board
CONTROL board
w w w
TR board
LIMIT board
CD board
SERVO board
MAIN board
x
a o
y
.
i
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THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Through hole.
a
•
: internal component.
f
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
%
: indicates tolerance.
•
: internal component.
f
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• U : B+ Line.
Q
Q
• H : adjustment for repair.
3
7
6
3
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
E
: TAPE (PB)
J
: CD
u 1 6 3
.
32
32
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4
9
9
8
• Semiconductor
Location
(SERVO Board)
Ref. No.
IC1
IC2
IC3
Q1
Q2
Q11
Q12
Q13
1
5
1
5
0
8
9
2
4
m
c o
2
9
9
Location
D-2
D-5
B-2
F-4
F-5
E-4
F-3
F-1
9
8
2
9
9
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