Table Of Contents - Sony DP-RF6000 Service Manual

Digital surround processor sony dp-rf6000
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DP-RF6000
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• Repaier DP-RF6000 with MDR-RF6000.
2

TABLE OF CONTENTS

Specifications ............................................................................ 1
1.
................................................................... 3
2.
................................................................. 4
2-1. Block Diagrams ............................................................... 5
- FUNCTION, CHARGE Boards Section - ................... 8
2-10. IC Pin Function Descriptions .......................................... 15
3.
3-1. Processor Section ............................................................ 20
4.
.................................. 21

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