Printed Wiring Board - Sony MZ-E800 Service Manual

6-4.

PRINTED WIRING BOARD

1 2 3 4
A
MAIN BOARD (COMPONENT SIDE)
S808
HOLD
HOLD T OFF 1
X601
C522
4
B
+
C606
R620
TAP801
(TEST)
155 156 143 33 30 29 22 21 20 17 14 9 8 7 5 148 149
157 158 35 34 31 27 23 24 153 19 16 13 10 6 4 150 151
39 38 147 36 32 28 26 25 154 18 15 12 11 1 152 2 3
41 40 144 140 141 142
43 42 37 136 138 139 58 57 56 54 51
C
60 59 55 53 50
44 45 46 134 135 137
49 48 47 131 132 133 63 62 61 52 49
52 51 50 128 129 130 64 65 66
*
54 55 53 125 127 126 69 68 67
IC601
72 71 70
58 57 56 122 123 124
61 60 59 119 120 121 74 75 73
62 63 64 115 117 118 78 77 76
81 80 79
65 66 68 113 114 116
83 84 82
69 67 146 108 111 112
D
71 70 159 73 76 78 82 85 88 92 96 97 100 103 164 109 110 86 85 91 94 97
160 161 72 74 77 80 83 86 89 91 95 98 102 104 106 165 166 87 89 92 95 98
88 90 93 96 99
162 163 145 75 79 81 84 97 90 93 94 99 101 105 107 167 168
+
C610
R609 C519
C618
C612
E
R504 C509
4
44 23
C529 +
IC552
C
IC501 Q501
B E
5
F R519
1 22
G
OPTICAL
PICK-UP BLOCK
(LCX-2E)
H
C925 + +
C913
D902
R939
A K
I
3 1
L901
IC903
4 5
L902
J
L903
K
05
Note on Printed Wiring Board:
• Y : parts extracted from the conductor side.
• : internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
5 6 7
(HEADPHONE)
COM
R205
C201
8
C101
IC802
R105 C104
5
S G
Q803
X801
D
RY901
1 8
L
48 44 42 39 36 33 31 30 2 7
47 45 41 38 35 32 28 29
C102 +
46 43 40 37 34 27 26 25
22 23 24 3 6
–2 –1
19 21 20
16 17 18
*
S809
IC801 13 14 15
4 5
(OPEN/CLOSE)
10 11 12
7 8 9
4 6 5
+
100 103 106 111 112 115 2 3 C556
101 104 107 110 114 116 118 1
102 105 108 109 113 117 119 120
+ C555
R904 E C
12 1
C809
Q902
13 48 R903
1
R907
R913
IC551
C907
L551
C557
24 37
C558
8 1
8 25 36
C552
IC901
RB552 RB551 5 4
RB553
C903 R910 R908 R912
Q904
1
5
CN551
CN501 10
8 1
15
2 1
C909
IC905
3
20
IC902
R922
R924
Q907
+ C512
E C B
R921
L501
Q908
G
C914
3 1
IC904
R918
4 5
R927
S
G
Q905
D
R935
R938
D R936
E B
Q912
R929
C918 Q914
R930 G S
Q911
C
3 1
S G R933
C R902
C920 +
Q910 IC907
R901
Q913
D 4 5 C902
B E
1-678-524-
(CHASSIS)
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
* Replacement of IC601 and IC801 used in this set requires
a special tool. Therefore, it cannnot be replaced.
– 27 –
8 9 10 11
J301
i
MAIN BOARD
C351
R
19
R203
24
C203
(CHASSIS)
LCD901
LIQUID
CRYSTAL
DISPLAY
Q903
Q901
E C B
TP902
B (BATT–)
MOTOR FLEXIBLE
BOARD
11
1-678-525-
1
2
M901
(SPINDLE)
3
C901
4
5
M
M902
6
(SLED)
7
8
D
TP918
Q906
(VC)
RECHARGEABLE
G S
BATTERY
(NICKEL-METAL)
D
NH-14WM
1.2V 1400mAh
S
Q909
3
1 2
IC906
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
1PC. 1.5V
DC IN 3V
– +
11
BATTERY
(11)
(CHASSIS)
STAND
BATTERY
CASE
• Lead Layouts
Lead layout of conventional IC CSP (chip size package)
12 13 14 15
(CONDUCTOR SIDE)
Q301
B C E
R101
R106
C306
18 13
S806
R305
DIGITAL SOUND PRESET
C851
12
D855
OFF t 1 t 2
E B
K A K
IC301
R836
Q802
7 K K C
C307 R826 R829
R832
1 6
C302
C103
C802
R831
R852
CN801
R814
R853
1
5
R854 S801
x
10 R807
S804 S805
R806
– VOL +
C803
TP919
(VR)
TP903
(2V IN)
• Semiconductor Location
Ref. No. Location Ref. No. Location
D101 C-11 IC504 B-16
surface
D201 B-11 IC505 B-17
D601 E-3 IC551 E-5
D855 B-14 IC552 E-4
D902 H-3 IC601 C-2
D903 I-5 IC801 D-4
D904 K-4 IC802 B-4
D905 C-13 IC901 F-8
D906 D-8 IC902 H-7
IC903 I-4
IC301 B-12 IC904 I-5
IC501 F-2 IC905 H-8
– 28 –
MZ-E800
16 17 18
8 5
8 5
IC504
IC505
1 4 S807
1 4
AVLS
NORM t LIMIT
C806
R838
C601
C604
C608
R604
S803 S802
. > N
C808 R827
R605
TP904
(SET GND)
TP901
(BATT+)
11
1-678-524-
(11)
Ref. No. Location Ref. No. Location
IC906 J-8 Q906 H-8
IC907 K-6 Q907 H-8
Q908 I-8
Q301 A-13 Q909 I-8
Q501 F-3 Q910 K-5
Q802 B-14 Q911 K-6
Q803 B-5 Q912 J-7
Q901 D-11 Q913 K-7
Q902 E-8 Q914 J-7
Q903 D-12 Q915 J-8
Q904 F-7
Q905 J-5