Optical Transceivers
Design Reference Guide
INTRODUCTION
This design guide provides the information needed to incorporate OptixCom's fiber optics transceiver products in
the customer's system. The XFP series of transceiver products are compliant with the XFP mutli-source agreement
(MSA) INF-8077i (Rev. 4.5, 2005) and IEEE 802.3 Section 4 on "52. Physical Medium Dependent (PMD) sublayer and
baseband medium, type 10GBASE-S (short wavelength serial), 10GBASE-L (long wavelength serial), and 10GBASE-
E (extra long wavelength serial)". For more detail information, please refer to the URL http://www.xfpmsa.org or
visit OptixCom web site: http://www.OptixCom.com for the official documentation.
The reference guide covers the following topics:
A. PIN ASSIGNMENT & DESCRIPTION
B. RECOMMENDED INTERFACE CIRCUIT
C. PACKAGE OUTLINE
D. SFP TRANSCEIVER HOST BOARD MECHANICAL LAYOUT
E. ELECTRICAL CONNECTOR MECHANICAL LAYOUT
F. CONNECTOR INSERTION, EXTRACTION, AND RETENTION FORCE
G. TIMING REQUIREMENTS
A. PIN ASSIGNMENT & DESCRIPTION
The XFP transceiver contains a printed circuit board that mates with the electrical connector. The pads are
designed for a sequenced mating in the following order: ground contacts, power contacts, and signal contacts.
Host Board Connector Pad Layout
16
17
18
19
20
21
22
T
OWARD
23
ASIC
24
25
26
27
28
29
30
Phone: (949) 679-5712
Fax: (949) 420-2134
17901 Von Karman Avenue, Suite 600,
Irvine, CA 92614, USA
Email: Support@OptixCom.com
XFP 10G Dual LC Optical Transceivers
GND
15
GND
14
RX_LOS
RD-
13
M
_N R
OD
RD+
12
M
_ABS
OD
GND
11
SDA
VCC2
10
SCL
P_D
/RST
OWN
9
VCC3
VCC2
8
VCC3
T
OWARD
GND
B
EZEL
7
GND
R
CLK+
EF
6
VCC5
R
CLK-
EF
TX_DIS
5
GND
I
4
NTERRUPT
GND
M
_D
S
3
OD
E
EL
TD-
VEE5
2
TD+
1
GND
GND
© 2015 Optix Communications, Inc.
http://www.OpticalTransceiver.com
XFP Transceiver Pad Layout
http://www.OptixCom.com
Page 1
10/2014
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