Eico HF 12 Instruction Manual page 23

12 watt integrated high fidelity amplifier
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TOP CHASSIS WIRING
1.
( ) Fig
.
5
.
Strip the outer insulation of one end of the 4 conductor cable
back 1
3/4" .
Unwrap the outer shield and twist shield
stronds.
Cut the outer
shield to 1/2 " , the brown lead to
3/4",
the red lead to 1" and the yellow lead
to 1 1/4" . Connect the shield wire to SI-78 (C), the brown lead to SI-6AB (S),
the red lead toSI-5AB(S), the orange lead to SI
-11B
(S) and the yellow lead
to SI-8B (S). Push the remainder of the shielded lead through the rectangular
hole unde
r
the switch to the bottom of the chassis.
2. ( ) Fig. 5
.
Strip the outer insulation of one end of a 3
1/2"
piece of
single conductor shielded wire back 1".
Unwrap the outer shield and twist
shield strands. Cut the outer shield to 1/2 " . Connect the shield wire to S1-7B
(C) and the inner conductor to S1-lOB (S). Push the remainder of the shielded
lead through the rectangularhole under the switch to the bottom of the chassis.
3. ( ) Fig. 5. Connect a 2" piece of bare wire covered with 1
1/2"
of spa-
ghetti fram SI-78 (S) to SI-2B (S).
10. ( ) Fig
.
5
. Connect
a 90KQ(white, black, orange, gold)5% resistor, R9,
and on 850mmf disc ceramic copacitor, C4, from Sl - 2A (S) to TB8-2 (C)
.
Cut
a II
I
eods to 1".
11. ( ) Fig. 5. Connect a lMQ (brown,black, green, silver) 10% resistor, R8,
and a 3000mmf disc ceramic capacitor, C3, from SI-9A(S) to TB8-2(S). Cut
all leads to 1"
.
12. ( )Fig
.
5. Connectoneendofa21
/2"pieceofgreenwiretoRII-2(S).
Push the remainder of the wire through hole"X" near Rll to the bottom of the
chassis.
13. ( ) Fig. 5. Connect one end of a 4" piece of green wire to TB7 (C). Push
the remainder of the wire through hoi e "Y" near R12 to the bottom of the chassis.
14. ( ) Fig. 5. Connect one end of a 5" piece of yellow wire to R13-
' 1
(C).
Push the remainder of the wire through hole "Y" near R12 to the bottom of the
chassis.
15.
( ) Fig. 5.
Connect the black lead that passes through hole llyn to
R13-3
(C).
16. ( ) Fig. 5. Cut and connect the leads on the printed circuit board PC1,
in the prescribed sequence as follows. Put 21/4" of spaghetti on lead 1; 1 1/2"
of spaghetti on lead 4; 1" of spaghetti on lead 5 and 2" of spaghetti on lead 7.
4
.
( ) Fig
.
5. 5trip the outer insulation of one endofa 41/2" pieceofsingle
conductor shielded wire back 1/2 " . Unwrap the shield and cut off. St;ip the
insulation of the inner conductor back 1/4" and connect to S1-8A (S).
Strip
:: the outer insulation on the other end back
3/4"
.
Unwrap the outer shield and
n
twist shield strands. Strip the insulation of the inner conductor back 1/4" and
connect to TB12 (C)
.
Cut the shield strands to 1/2" and connect to R11-3 (C)
.
5. ( ) Fig. 5. Connect a 3" piece of black wire to RII-3 (S). Push the re-
mainder through hole
"X".
6. ( ) Fig. 5. Connect one end of a 2" piece of green wire to S1-4AB (5).
Push the rest of the lead through the rectangular cutout under the switch to the
bottom of the chassis.
#6 (1/2") to R12-3 (S)
#3 (3/4") to R12-2 (S)
'2 (1/2") to R12-1 (5)
#1 (2 1/2") to R13-3 (S)
#7 (2 1/4") to R13-1 (5)
#4 (1 3/4") to R13-2 (5)
#5 (1 1/4") to TB7
(S)
7
.
( ) Fig. 5
.
Connect one end of a
'4"
piece of yellow wire to SI-1A
(5)
.
Running lead as shown, push the restof the lead through the rectangular cutout
under the switch to the bottom of the chassis.
8.
( ) Fig. 5.
Connect a 850mmf disc ceramic capacitor, C6, from S1-3A
(S) to TB8-1 (C). Cut both leads to I".
9.
( ) Fig
.
5
.
Connect a 68KQ (blue, grey, orange, gold) 5% resistor, R33,
fromSI-12A(S) toT88-1 (S). Cut both leads to l"and cover each with a
3/4"
piece of spaghetti.
17. ( )
Fig.
5. Connect the
.
03mfd molded capacitor, C16, from S2-1 (C)
to ground lug "I" (S).
Cut both leads to 1 1/2".
Cover the lead going to
S2-1 with 1 1/4" spaghetti.
18. ( )
Fig. 5.
Cut both leads on a 56KQ (green, blue, orange, silver)
resistor,
R34, to 1/2" . Connect from TB12 (S) to Rll-1 (S).

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