JVC GZ-MG330HEK Service Manual page 42

CCD,SENSOR,OPE AND MONITOR CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB10120-001B
FOIL SIDE(B)
<03>SENSOR
LYB10121-001C
FOIL SIDE(B)
COMPONENT SIDE(A)
R5002
R5001
C5002
L5001
C5001
C5003
L5002
R5003
D301
D302
D303
TL2
C301
D305
TL1
TL4
TL3
TL5
D304
D306
12 7
13 6
IC301
18 1
19 24
C302
COMPONENT SIDE(A)
(No.YF227<Rev.001>)2-35
<04>OPE
LYB10121-001C
COMPONENT SIDE(A)
<05>MONITOR
LYB10121-001C
FOIL SIDE(B)
2-36(No.YF227<Rev.001>)
FOIL SIDE(B)
S404
S403 S406 S405
R402
S402
COMPONENT SIDE(A)
D7601
R7604
23 1
R7704
R7607
Q7701 C7608 R7602
CN7601
R7605
C7609
R7706 R7603
22 2
Q7704
R7606
C7611
C7612
C7613
C7616
C7618
R7610
C7620
C7623
L7602
C7606 L7601
L7604
L7603 C7604
R7506
C7624
R7508 R7507
R7504
R7501
1 8
Q7501
CN7501