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LG CU500 Service Manual

LG CU500 Service Manual

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CU500_TU500
Date: June, 2006 / Issue 1.0

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Summary of Contents for LG CU500

  • Page 1 Service Manual CU500_TU500 Date: June, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......5 4.10 SIM Detect Troubleshooting ....100 4.11 Camera Troubleshooting ....101 1.1 Purpose........... 5 4.12 Keypad Backlight Troubleshooting ..102 1.2 Regulatory Information......5 4.13 Folder ON/OFF Troubleshooting ..103 2. PERFORMANCE.......7 4.14 Main LCD Troubleshooting ....104 4.15 Audio Receiver Path ......105 2.1 System Overview ........7 4.16 Headset path........107...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM850/EGSM/1800/1900 and WCDMA Slim Clamshell Size 96.5 X 49 X 19.1 mm Weight 105 g (with Battery) Power 3.7V normal, 1100 mAh Li-Polymer Over 180 min (WCDMA, Voice) Talk Time Over 180 min (GSM, Voice) Over 250 Hrs (WCDMA, DRX=1.28) Stand by Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 4.0 V(Typ), 3.50 V(Min), [Shut Down : 3.35 V] -20 ~ +60 °C Operation Temp -30 ~ +85 °C Storage Temp Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ.
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -104.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 4.4 mA Under 366 mA WCDMA (DRX=1.28) (Tx=12dBm) Under 4.4 mA (Paging=5period) Under 366 mA Under 7.0 mA (Tx=Max) (@Bluetooth Connected, Paging=9period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -7 ± 3 dB Receiving Loudness Rating (RLR) -18 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Sending Distortion (SD) Refer to Table 30.3 Receiving Distortion (RD)

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 650 mA • Normal Battery Capacity : 1100 mAh • Charging Time : Max 3.0 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The CU500 supports UMTS-850, UMTS-1900, GSM-850, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/EDGE/UMTS/HSDPA. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of CU500 is shown in Figure 3-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus two duplexers for UMTS high-band and low-band operations).

  • Page 18: Gsm Mode

    GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In CU500, a common antenna connects to one of eight paths: 1) UMTS-850 Rx/Tx, 2) UMTS-1900 Rx/Tx, 3) GSM-850 Rx, 4) GSM-900 Rx, 5) GSM-850 GSM-900 Tx, (Low Band Tx’s share the same path) 6) DCS-1800 Rx, and 7) DCS-1800,PCS-1900...
  • Page 19 3. TECHNICAL BRIEF The GSM850, GSM900, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM850, GSM900, DCS, and PCS receiver inputs are similar to the RFR6202 UMTS Rx input in that they also use differential configurations to improve commonmode rejection and second-order non-linearity performance.

  • Page 20: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (GSM850/GSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 21: Umts Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK or 8-PSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK or 8-PSK- modulated signal from IF to RF primarily for two reasons: 1.
  • Page 22 3. TECHNICAL BRIEF Figure 3.3.1-1 RFL6202 IC functional block diagram The UMTS LNA output is routed to the RFR6202 through a band selection filter that transforms a single-ended 50Ω source to a differential impedance that is matched to the RFR6202 IC. The RFR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance.
  • Page 23 3. TECHNICAL BRIEF Figure 3.3.1-2 RFR6202 IC functional block diagram The RFR6202 IC includes LO generation and distribution circuitry to reduce offchip component requirements. The UMTS Rx LO source is created using an external UMTS Rx CH VCO that is closed- loop controlled by the RTR6250 PLL2 via a discrete loop filter.
  • Page 24 The RTR6200 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in CU500 is °∞Load Insensitive PA°±- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 25: Lo Phase-Locked Loop

    AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in CU500). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6202 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
  • Page 26 3. TECHNICAL BRIEF Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.

  • Page 27: Off-Chip Rf Components

    -. Insertion loss . this component is also in the receive and transmit paths ; In the CU500 typical losses : UMTS1900_ Tx = 2.1 dB, UMTS1900_ Rx = 2.8 dB and UMTS850_ Tx =1.9 dB, UMTS850_ Rx = 2.7 dB -.
  • Page 28 Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The CU500 uses National Semiconductor LMV232TLX power detector IC. In Figure 3.5.5-1, RF input power range of the device has been optimized for use with a 20dB directional coupler, without the need for additional external componets.
  • Page 29 3. TECHNICAL BRIEF 3.5.6 GSM/GPRS/EDGE Power amplifier (U102 : AND0041) This power amplifier module is designed in a low profile (1.3 mm) and supports dual, tri and quad band applications for GMSK and 8-PSK modulation schemes using a polar architecture. There aretwo amplifier chains, one to support GSM850/900 bands, the other for DCS/PCS bands.
  • Page 30 3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (X101 : MQW5V0C869M) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 31 3. TECHNICAL BRIEF 3.5.9 GSM band Rx RF filter (FL100, FL101, FL102, FL103) FL100 - B7845 869 ~ 894MHz GSM850 Rx RF filter FL101 - B7851 1930 ~ 1990MHz PCS1900 Rx RF filter FL102- B7837 880.2~959.8MHz GSM 900 Rx RF filter FL103 - B7844 1805 ~1880MHz DCS1800 Rx RF filter The GSM mode RF filters are located before their LNAs, so their insertion losses are extremely critical (1.5 dB typical).
  • Page 32 3. TECHNICAL BRIEF 3.5.11 UMTS Rx VCO (X100 : MQW541A1G44) The UMTS dual-band Rx VCO is a key component in PLL2; VCO performance directly impacts Polar calibration accuracy and UMTS receiver performance. When the phone is not in the UMTS mode the unused VCO must be turned off by UHF_VCO_EN signal from MSM6275.
  • Page 33 3.5.12 Bluetooth (M1 : RB06A, ANT101 : ACS2450HBAM6 ) The MSM6275 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure3.5.12-1 shows the bluetooth system architecture in the CU500. Figure3.5.12-1 Bluetooth system architecture - 34 -...

  • Page 34: Digital Baseband(Dbb/Msm6275)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6275) 3.6.1 General Description A. Features(MSM6275) • Support for multimode operation - WCDMA(UMTS),GSM/GPRS,EDGE • The ARM926EJ-S microprocessor can operate at up to 225 MHz with variable rate, software controlled clocks to provide greater standby time. •...

  • Page 35: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture (Main, Sub) Camera 1.3M Micro SD 1800/1900 EDGE Q_VCO USIM PCS1900_Rx_SAW DCS1800_Rx_SAW RTR6250 GSM850_Rx_SAW GSM900_Rx_SAW Dual Speaker MSM6275 Stereo Head Phone coupler PAM TX_SAW HDET Power VCTCXO UART 1900 IO_Conn coupler PAM TX_SAW SDRAM NAND Flash RFR6202 RX_SAW...
  • Page 36 3. TECHNICAL BRIEF 3.7.1 Block Diagram(MSM6275) SDRAM NAND Flash 512M 512M (main, sub) EBI 1 EBI 2 GSM/GPRS/EDGE CAMERA DUAL MEMORY BUS processor PROCESSING (Default 8bit Interface) UMTS, WCDMA, MSM6275 Camera 1.3M processor GRAPHICS Modem QDSP 4000 BT 1.2 Open GL ES processor 3D, 2D VIDEO...

  • Page 37: Subsystem(Msm6275)

    3. TECHNICAL BRIEF 3.8 Subsystem(MSM6275) 3.8.1 ARM Microprocessor Subsystem The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6202, RFL6202, and PM6650 devices.

  • Page 38: Wideband Codec

    3. TECHNICAL BRIEF 3.8.5 Serial Bus Interface(SBI) The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6250, RFR6202, RFL6202, and PM6650 ASICs. Using the SBI, the RTR6250, RFR6202, RFL6202, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode.
  • Page 39 3. TECHNICAL BRIEF 3.8.10 General-Purpose Input/Output Interface The MSM6275 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

  • Page 40: Power Block

    3. TECHNICAL BRIEF 3.9 Power Block 3.9.1 General MSM6275, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6275, MSM memory, RF block, Bluetooth, Micro SD, USIM and TCXO. Major power components are : PM6650(U400) : Phone power supply MIC5252-2.8BML(U500) : LCD Power AAT31521WP(U501) : LCD Backlight charge pump MIC2211_LGYML (U503) : Camera power...
  • Page 41 3. TECHNICAL BRIEF Figure. PM6650 Functional Block Diagram - 42 -...
  • Page 42 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. ± ± ± ± ± 0.05V 3.77 0.05V 0.05V 0.05V 0.05V CU500 Battery Bar Display(Stand By Condition) - 43 -...
  • Page 43 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 44 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 45: External Memory Interface

    • 1-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY90009800C0GG Toshiba 50 ns 50 ns SDRAM TY90009800C0GG Toshiba 15 ns 15 ns Table#1. External memory interface for CU500 - 46 -...

  • Page 46: H/W Sub System

    3. TECHNICAL BRIEF 3.11 H/W Sub System 3.11.1 RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6275 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PA_ON0, PA_ON1 : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P: I/Q for T/Rx of RF •...

  • Page 47: Msm Sub System

    3. TECHNICAL BRIEF B. RFR6202(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX0_I/Q_M/P : I/Q for Rx of RF C. RFL6202(WCDMA_Rx_LNA) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset D. the others • UHF_BAND_SEL : WCDMA(3G) VCO Band Selection of UHF VCO •...
  • Page 48 3. TECHNICAL BRIEF 3.11.2.2. UART Interface UART signals are connected to MSM GPIO through IO connector with 115200 bps speed. GPIO_Map Name Note GPIO_96 UART_RXD Data_Rx GPIO_95 UART_TXD Data_Tx Table. UART Interface 3.11.2.3. USB The MSM6275 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC).
  • Page 49 Figure. Schematic of USB block(MSM6275 Side & PM6650 Side) CU500 have a protective circuit for booting from USB. When the phone is booting from USB_VBUS without Battery, booting current is insufficient. Sometimes that can break the USB port of a computer.
  • Page 50 3. TECHNICAL BRIEF 3.11.3 HKADC(House Keeping ADC) The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the internal HKADC.

  • Page 51: Key Pad

    3. TECHNICAL BRIEF 3.11.4 Key Pad There are 24 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650). COL0 COL1 COL2 COL3 COL4 COL5 COL6 ROW0 C/BACK MENU Side (up) (FF) ROW1 Left Side...
  • Page 52 3. TECHNICAL BRIEF SIDE KEY ON_SW KEY_ROW(2) D700 ON_SW_N CN500 RB520S-30 KEY_ROW(1) KEY_ROW(0) R888 KEY_COL(5) PM_ON_SW_N VA527 EVLC14S02050 Figure. Keypad Circuit (END KEY & Side KEY) Figure. Keypad Circuit (MOD KEY) - 53 -...

  • Page 53: Camera Interface

    3. TECHNICAL BRIEF 3.11.5 Camera Interface CU500 Installed a 1.3M Pixel CMOS VGA Camera. Below figure shows the camera board to board connector and camera I/F signal. CONNECTOR VREG_MSMP_2.7V I2C_SDA CN601 I2C_SCL EVRC14S05Q030100R CAM_DATA(7) CAM_PWDN INOUT_A1 INOUT_B1 CAM_DATA(6) INOUT_A2 INOUT_B2...
  • Page 54 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6275. The camera port supply 12MHz master clock to camera module and receive 36MHz pixel clock (11.25fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

  • Page 55: Keypad Light

    3. TECHNICAL BRIEF 3.11.6 Folder ON/OFF Operation There is a magnet to detect the Folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U504 goes to 0V. Otherwise, 2.6V. This folder signal is delivered to MSM6275 GPIO43. (For Hall Sensor) R504 VREG_MSMP_2.7V...
  • Page 56 3. TECHNICAL BRIEF 3.11.8 LCD Module (IM200CST4B : LG Innotek) - The IM200CST4B model is a Color TFT(Main & Sub) LCD supplied by LG Innotek. This main Module has a 2.0 inch diagonally measured active display area with 176(RGB)X220 resolution and sub Module has a 1.17 inch diagonally measured active display area with 96(RGB)X96 resolution.
  • Page 57 3. TECHNICAL BRIEF 3.11.9 Display & LCD FPC Interface LCD module is connected to LCD FPCB with 50-pin Zip connector (AXT450164 / Matsushita) The LCD module is controlled by 16-bit EBI2 in MSM6275 - 58 -...
  • Page 58 3. TECHNICAL BRIEF 3.11.9.1. Audio Signal Processing & Interface Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6275). This transmitted signal is reformed to fit in GSM &...
  • Page 59 3. TECHNICAL BRIEF MSM6275 CODEC pins Microphone external gain network MICFBN MICINP R100 0.1u C100 0.1u C101 MICOUTN 180K 0.015u C103 R102 470K 0.015u C104 R111 0.1u C106 0.1u C107 MICOUTP 180K MICINN MICFBP Place close to MSM under same Shield U100 UCLAMP0505A C106...
  • Page 60 3. TECHNICAL BRIEF Audio AMP C210 8200p U507 TPA2010D1YZF R202 R213 C211 HPH_R +VPWR R203 PVDD C212 R204 SPK_R- _SHDN SPK_R+ C213 C1820 8200p C214 U506 TPA2010D1YZF R206 C215 HPH_L +VPWR R207 PVDD C216 R208 SPK_L- SPK_AMP_EN _SHDN SPK_L+ C219 C1819 C288 1000p...
  • Page 61 Speaker phone Loud Mode Speaker Phone MIDI Loud Mode Speaker MIDI Bell Headset Headset MIDI Bell Loud Mode Speaker MP3 Headset Headset MP3 Table. Audio Mode Audio & Sound Main Component There are 6 main components in CU500. - 62 -...
  • Page 62 3. TECHNICAL BRIEF Component Design No. Maker Part No. Note MSM6275 U200 MSM6275 Base-Band Modem Audio amp U507,U506 TPA2010D1YZF Class-D Audio Amp Loud Speaker EMS1735AP 8 ohm Speaker Receiver EMR1107SP 32 ohm receiver U303 SP0102BE3 -42 dB microphone Ear jack CON100 KJA-PH-3-0059 Ear jack...

  • Page 63: Main Features

    3. TECHNICAL BRIEF 3.12 Main Features 1. LG-CU500 Main features - Dual Clamshell Type - WCDMA(850, 1900) + EDGE Quad(Class10) + HSDPA(1.8Mhz) - Color LCD(Main:262K TFT, 2’, Sub : 65K TFT) - 1.3M Pixel CMOS VGA Camera - dual 15 phi speaker...
  • Page 64 3. TECHNICAL BRIEF 2. CU500 Main Component Logic /Audio Logic /Audio Bluetoot Main board, Bottom Main board, Top Sub board LCD FPCB - 65 -...
  • Page 65 3. TECHNICAL BRIEF U100 U102 U105 X101 U109 U108 X100 U101 Reference Description Reference Description U100 Ant. Switch module U109 RFL6202 U102 GSM PAM U101 RTR6250 U105 WCDMA PAM U108 RFR6202 X101 GSM VCO X100 UHF VCO - 66 -...
  • Page 66 3. TECHNICAL BRIEF Audio/logic U400 U200 CON500 U302 CN501 U303 CN502 Reference Description Reference Description U400 PMIC CN502 IO connector CON500 USIM connector U200 MSM6275 BT module U302 Memory CN501 Battery connector U303 Microphone - 67 -...
  • Page 67 3. TECHNICAL BRIEF CON100 S100 BAT100 CN601 CN600 CN602 Reference Description Reference Description S100 Micro SD card slot CN600 Sub PCB connector CON100 Ear_jack connector CN601 Camera connector BAT100 Coin cell battery CN602 LCD connector - 68 -...

  • Page 68: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component Bottom Side - 69 -...
  • Page 69 4. TROUBLE SHOOTING - 70 -...

  • Page 70: Signal Path_Umts Rf

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH_UMTS RF Common TX/RX UMTS 850 T/RX UMTS 850 TX UMTS 850 RX UMTS 1900 T/RX UMTS 1900 TX UMTS 1900 RX TX I/Q RX I/Q - 71 -...
  • Page 71 4. TROUBLE SHOOTING SIGNAL PATH_GSM RF Common TX/RX DCS RX PCS RX GSM850 RX GSM900 RX DCS/PCS TX GSM850/GSM900 TX TX I/Q TX_MOD_CP - 72 -...

  • Page 72: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X102 (VCXO) is used in UMTS TX part, GSM part and BB part. Check 1. Crystal part If you already check this crystal part, you can skip check 1. TCXO 19.2MHz VREG_TCXO_2.85V...
  • Page 73 4. TROUBLE SHOOTING Check R400 of PMIC (U400) Check R223 of MSM (U200) - 74 -...

  • Page 74: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block ANT_SEL1 ANT_SEL0 ANT_SEL2 Antenna Switch Block(Bottom) 000 56p 15nH R1000 ANT_SEL2 L104 R1001 ANT_SEL1 R1002 ANT_SEL0 C1007 C1008 C1009 C1010 C1011 0.1uF GND1 GND6 TRX1 GND5 TRX2 U100 GND4 CXG1198AEQ GND2 L111 6.8nH C1023...
  • Page 75 4. TROUBLE SHOOTING ANTENNA SWITCH MODULE LOGIC IN_A IN_B IN_C GSM900/GSM850 TX HIGH HIGH DCS/PCS TX HIGH GSM 850 RX HIGH UMTS 850 HIGH HIGH DCS RX HIGH HIGH PCS RX HIGH UMTS 1900 HIGH HIGH HIGH GSM900 RX Logic Table of the Antenna Switch Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level...

  • Page 76: Checking Umts Block

    4. TROUBLE SHOOTING 4.5. Checking UMTS Block 4.5.1. Checking TX POWER of UMTS 1900MHz Test Point (RF TX POWER of UMTS1900) - 77 -...
  • Page 77 4. TROUBLE SHOOTING For testing, Max power of UMTS 1900MHz is needed. - 78 -...
  • Page 78 4. TROUBLE SHOOTING 4.5.2 Checking TX POWER of UMTS 850MHz Test Point RF TX POWER of UMTS 850 - 79 -...
  • Page 79 4. TROUBLE SHOOTING For testing, Max power of UMTS50NHz is needed. Run a FTM program set RF mode to 1900B set uplink fre. to 4135 Click TX On and WCDMA set PA range R0 and R1 on set Tx AGC to 430 Check a Check a Check TP1...
  • Page 80 4. TROUBLE SHOOTING 4. 5. 3 Checking UMTS PAM Control Block • PAM control signal 1. HDET_EN : UMTS Tx Power Detect IC(U1014:HDET) Enable 2. TX_AGC_ADJ : UMTS RTR6250 Tx Amp Gain Control 3. VREG : UMTS PAM enable UMTS 850 Coupler UMTS 1900 Couplar UMTS Dual VREG_UMTS 1900...

  • Page 81: Check Rf Rx Level

    4. TROUBLE SHOOTING 4. 5. 4 Check RF Rx Level C2001 ANT100 C1000 56p C1910 27p C1001 56nH L103 L104 0.75p KMS-507 R1002 L105 L1001 SW100 6.8nH C1007 GND1 GND6 C1014 100p WCDMA_800 TRX1 GND5 WCDMA_1900 TRX2 U100 GND4 CXG1198AEQ GND2 C1019 L117...
  • Page 82 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1/ Check vias bias1' Over block solding Check TP1 Check Signal exist? ANT100 Check TP2/TP2' Check ANT. SW Signal exist? Module U100 Check TP3/TP3' Check Duplxer Signal exist? FL106/FL107 Check Check TP4/TP4' RFL6202 and Signal exist?

  • Page 83: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6. Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & CAL. - 84 -...

  • Page 84: Checking Vco Block

    4. TROUBLE SHOOTING 4.6.1 Checking VCO Block Test Point(TXVCO Level) TX_MOD_CP C1039 C1040 VDDA12 R1010 120p 330p TX_VCO_FB C1045 C1043 5.6n ECHU1C562JX5 C1048 FL104 NFM21PC105B1A3 +VPWR TX_ON R1012 VREG_MSMP_2.7V C1503 C1054 C1055 0.01u 1000p 100p MQW5V0C869M X101 FB102 VREG_RFTX_2.85V R1014 R1015 OUT_GSM GSM_TX_VCO_1_EN_N...
  • Page 85 4. TROUBLE SHOOTING - 86 -...

  • Page 86: Checking Rf Tx Level

    4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 4.4 4.6.3 Checking RF Tx level ANT100 C1000 56p C1910 27p R1000 C1001 56nH L103 L104 R1001 0.75p KMS-507 R1002 L105 L1001 SW100 6.8nH C1007 C1008 C1009 C1010 C1011 0.1uF GND1 GND6...
  • Page 87 4. TROUBLE SHOOTING - 88 -...

  • Page 88: Checking Pam Block

    4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 1.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.
  • Page 89 4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block TP1. GSM850 Rx SAW Input TP2. DCS Rx SAW Input TP3. PCS Rx SAW Input TP4. GSM900 Rx SAW Input - 90 -...
  • Page 90 4. TROUBLE SHOOTING L100 L101 15nH VREG_RFRX_2.85V L102 4.7nH ANT_SEL2 C1004 ANT_SEL1 C1141 ANT_SEL0 C1006 C1010 C1011 1000p B7845 L108 L106 0.1uF L107 FL100 4.7nH C1911 5.6p L110 FL101 2.2nH C1444 C1015 B7851 VREG_RFTX_2.85V C1016 FB100 L111 6.8nH C1020 1000p L114 C1912 R1004...
  • Page 91 4. TROUBLE SHOOTING - 92 -...

  • Page 92: Power On Troubleshooting

    4. TROUBLE SHOOTING 4.7 Power ON Troubleshooting Power On sequence of CU500 is : PWR key press(Key PCB) → KEY_ON_SW_N go to low(D508),PM6650 KPDPWR_N pin(24) → PM6650 Power Up → VREG_MSMC_1.25V(C436), VREG_MSME_1.8V(C434), VREG_MSMP_2.7V(C425), VREG_MSMA_2.6V(C423), VREG_TCXO_2.85V(C413) power up and system reset assert to MSM → Phone booting and PS_HOLD(D505) assert to PMIC...
  • Page 93 4. TROUBLE SHOOTING D701 VREG_TCXO C1133 : 48Mhz VREG_MSMC VREG_MSME VREG_MSMA X400 : VREG_MSMP 32.768Mhz - 94 -...

  • Page 94: Charger Troubleshooting

    4. TROUBLE SHOOTING 4.8 Charger Troubleshooting Charging Current Flow Pass (ON) (4.6V) Q400 QST4 CHG_CNT_N ICHARGE R300 Route as equal length as possible !! --> ICHARGE , ICHARGEOUT ICHARGEOUT +VPWR Q401 SI3493DV-E3 Main 4.2~4.25V Battery Battery FET (ON) BATT_FET_N R301 100K Battery charging circuit !!!!! Charging Procedure...
  • Page 95 4. TROUBLE SHOOTING R300 Q401 Q400 - 96 -...
  • Page 96 4. TROUBLE SHOOTING Troubleshooting Flow Start Check the pin and battery Connect terminals of I/O connector Change I/O connector Connection OK? Is the TA voltage Change TA 4.6V? Is it charging properly After turning on Q400, Q401? Change the board - 97 -...

  • Page 97: Usb Troubleshooting

    4. TROUBLE SHOOTING 4.9 USB Troubleshooting USB Initial sequence of CU500 is : USB connected to CU500 power on → USB_VBUS(Q501) go to 5V → USB_D+ go to 3.3V 48M Crystal on → USB_VP and USB_VN is triggered → USB work. Start...
  • Page 98 4. TROUBLE SHOOTING Q501 U505 X 200 - 99 -...

  • Page 99: Sim Detect Troubleshooting

    4. TROUBLE SHOOTING 4.10 SIM Detect Troubleshooting USIM Initial sequence of CU500 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 3.0V → USIM IF work Start Re-insert the SIM card Work well? VREG_UIM_2.85V is 3.0V? Check CON500 USIM_P_CLK is run?

  • Page 100: Camera Troubleshooting

    4. TROUBLE SHOOTING 4.11 Camera Troubleshooting Camera control signals are generated by MSM6275. Start Check the camera connector and reconnect the camera Camera is OK? VREG_CAM_2.7V is 2.7V?(C413) Change the Main board VREG_CAM_1.8V is 1.8V?(R480) Check the CAM_MCLK Change the Main board (FB602) Change the camera Camera is OK...

  • Page 101: Keypad Backlight Troubleshooting

    4. TROUBLE SHOOTING 4.12 Keypad Backlight Troubleshooting Key Pad Back Light is on as below : Key pressing → KYBD_BACKLIGHT go to 0V → Main LED On Start Key press Signal +VPWR is above 3.2V? Check battery VA515 is 0V ? Change the Main board Change the Main board VA515...

  • Page 102: Folder On/Off Troubleshooting

    4. TROUBLE SHOOTING 4.13 Folder ON/OFF Troubleshooting Folder On/Off is worked as below : Folder On/Off Event -> Flip(U500 pin 1) is triggered(On : about 2.1V, Off : 0V) -> MSM6275 Sense the Folder Event Start Check the magnet in Insert the magnet Folder Assy Approach the magnet to...

  • Page 103: Main Lcd Troubleshooting

    4. TROUBLE SHOOTING 4.14 Main LCD Troubleshooting Main LCD control signals are generated by MSM6275. The signal path is : MSM6275→ C0N602 → CN2 → LCD Module Start Press END key Key LED is on? GO to power on trouble shooting Disconnect and reconnect The LCD connector(CN602) LCD display OK?

  • Page 104: Audio Receiver Path

    4. TROUBLE SHOOTING 4.15 Audio Receiver Path MSM6275 EAR1ON/EAR1OP → CN602 → CN1 → Receiver Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Can you hear the tone? The sine wave appears at Change receiver PIN33,PIN34, CN1? Check LCD FPCB.
  • Page 105 4. TROUBLE SHOOTING CN602 - 106 -...

  • Page 106: Headset Path

    4. TROUBLE SHOOTING 4.16 Headset path MSM6275 HPH_R, HPH_L → C102/C104 → R200/R201 → CON100(Earjack) Start Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset. Can you hear the tone? Sine wave appears at Change the Head_Set R200/R201? Sine wave appears...
  • Page 107 4. TROUBLE SHOOTING C102/ C104 R200/ R201 - 108 -...

  • Page 108: Speaker Phone Path

    4. TROUBLE SHOOTING 4.17 Speaker phone path MSM6275 HPH_R, HPH_L → Filter block (SPK_R: R202/C210/C211/R203/R204/C212, SPK_L: R206/C214/C215/R207/R208/C216) → Audio AMP(SPK_R:U507, SPK_L:U506) → SPK_R:SPK_RP,SPK_LP , SPK_L:SPK_LP,SPK_LN (connector) → Speaker Start Connect the phone to network equipment and setup call Setup 1KHz tone out Sine wave appears at Change the Main board R202 , R206 ?
  • Page 109 4. TROUBLE SHOOTING CN602 block SPK_LP,L N SPK_RP,RN - 110 -...

  • Page 110: Main Microphone

    4. TROUBLE SHOOTING 4.18 Main microphone U303 → C222 → MIC1P(MSM6275) Start Make a call MIC_BIAS(C217 or C218) Change main board is 1.8V Make sound to MIC Sine wave appears at Change the MIC C222 ? Change the Main board Work well? - 111 -...
  • Page 111 4. TROUBLE SHOOTING MIC(U303) - 112 -...

  • Page 112: Headset Microphone

    4. TROUBLE SHOOTING 4.19 Headset microphone Headset → C106 → MIC2P(MSM6275) Start Make a call Change the headset and retry EAR_SENSE_N Change the headset or (R109) is 0V? SUB board and retry. VREG_MSMP is biased Change MAIN board by 2.6V? (R100) Change the headset or Sine wave appears at SUB board and retry.
  • Page 113 4. TROUBLE SHOOTING Headset detect port Mic input - 114 -...

  • Page 114: Download

    LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.
  • Page 115 5. DOWNLOAD 1) Connecting to PC Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) and model name shall be different from that of the port number in the snapshot.) - 116 -...
  • Page 116 5. DOWNLOAD The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 117 -...
  • Page 117 5. DOWNLOAD The following slide describes how to use or set options in detail. (The model name shall be different from that of the model name in the snapshot.) - 118 -...
  • Page 118 5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse°¶ button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. ( This program support the automatically loading image for some models based on MSM6275) 2) Click on the Browse°¶...
  • Page 119 5. DOWNLOAD 2) Choosing image files Select the image folder, where all the image files are located, by clicking on the Browse°¶ button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) ★...
  • Page 120 5. DOWNLOAD ★ if you select the image folder, the program will automatically load images accordingly. Automatically load images - 121 -...
  • Page 121 5. DOWNLOAD If NV restore is failed, then the NV Data(*.nv2) is erased permantly. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse°¶...

  • Page 122: Download Process

    5. DOWNLOAD 3) Downloading The following flow chart is whole process for downloading images to the handset. You will see snapshots for each step in the succeeding slides. Download Start NV backup NV restore Erase MEDIA directory Download MEDIA Erase MODULE directory Reset Download MODULE EFS Erase...
  • Page 123 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 124 5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection •...
  • Page 125 5. DOWNLOAD • Downloading Media image in progress • Downloading Module image in progress • Downloading process has completed successfully - 126 -...
  • Page 126 5. DOWNLOAD 4) Tools Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. - 127 -...
  • Page 127 5. DOWNLOAD Log Extractor is designed to extract log information from handset and store log related files in the selected root path in PC. This function is very useful for debugging. Select Log Extractor from the Tools of the file menu, and connect the phone with LGMDP by clicking on the Connect button. When clicking on the Connect button, this checks if the appropriate files such as LFAPP/RecMngr.bin, err directory, Debugging_Tip.txt, or Hidden_info.bin are placed on the handset.

  • Page 128: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. → Reboot the phone as the emergency mode (keep pressing °∞2°± and °∞5°± key while the phone is being booted). and then try to download the images again. ★...
  • Page 129 5. DOWNLOAD 3) NV Restore error When you meet the °∞NV Restore error°±, - 130 -...
  • Page 130 5. DOWNLOAD → Connect to the phone. → Click on ‘Cancel’. - 131 -...
  • Page 131 5. DOWNLOAD → Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown. * The files are saved every NV Backup. The name is based on the time when NV Backup is done.) - 132 -...
  • Page 132 5. DOWNLOAD → Select the proper file and click on ‘Restore’. → If you want image download and NV backup file restore at once, use the NV Default function. - 133 -...

  • Page 133: Caution

    5. DOWNLOAD 5.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) In emergency mode, you can not download the media and module image. So if you want download media and module image, connect the phone normal mode after emergency mode download, and then you can do it.

  • Page 134: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & UMTS RF Block Fig 6.1-1.UMTS-850,1900+GSM-850/GSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 135 -...
  • Page 135 6. BLOCK DIAGRAM Table 6.1-1. RF Block Component - 136 -...

  • Page 136: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram PA_EN, Band Ant_Sel 0,1,2 PA_ramp PA_ON HDET UHF_VCO_Band TRK_LO_ADJ CU500 Interface Diagram - 137 -...
  • Page 137 6. BLOCK DIAGRAM Main RF signal GSM850 TX : GSM850 Tx RF signal GSM850 RX : GSM850 Rx RF signal GSM900 TX : GSM900 Tx RF signal GSM900 RX : GSM900 Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal...
  • Page 138 6. BLOCK DIAGRAM *Top Side - 139 -...
  • Page 139 6. BLOCK DIAGRAM *Bottom Side - 140 -...
  • Page 140 DRAWING DRAWING RF_SBST UHF_LO_BUFF RF/BT RF_SBCK C1125 NAME NAME Approved Approved R1041 C1126 VREG_MSMP_2.7V C1091 R1042 100p C1092 C1093 C1127 100p 0.1uF DRAWING DRAWING LG Electronics Inc. LG Electronics Inc. MAIN_1.2 LG Electronics Inc. LG Electronics Inc. - 141 -...
  • Page 141 Checked Checked DRAWING DRAWING MSM6275 NAME NAME C149 Place near Approved Approved 0.1u MSM pin AD26 DRAWING DRAWING (Check CAM_DATA PINOUT !!!!) MAIN_1.2 LG Electronics Inc. LG Electronics Inc. LG(42)-A-5505-10:01 LG(42)-A-5505-10:01 LG Electronics Inc. LG Electronics Inc. - 142 -...
  • Page 142 MODEL MODEL SH NAM SH NAM Designer Designer 2005 2005 Checked Checked DRAWING DRAWING AUDIO/MEMORY AUDIO/MEMORY NAME NAME Approved Approved DRAWING DRAWING LG Electronics Inc. LG Electronics Inc. MAIN_1.2 LG(42)-A-5505-10:01 LG(42)-A-5505-10:01 LG Electronics Inc. LG Electronics Inc. - 143 -...
  • Page 143 LMS Registration !! --> Power Inductor 4.7uH VREG_PA C357 C358 4.7u 1000p 1608 C328 2.2u 0.2mm 100K R307 Section Date Sign & Name Sheet/ Sheets 10/31 CU500 MODEL SH NAM Designer 2005 Checked DRAWING PMIC NAME Approved DRAWING MAIN_1.2 LG Electronics Inc. - 144 -...
  • Page 144 KEY_COL(1) KEY_COL(0) Section Date Sign & Name Sheet/ Sheets USB_VBUS USB_VBUS_IN 10/31 CU500 MODEL OJ501 OJ502 SH NAM Designer PS_HOLD 2005 OJ503 OJ504 Checked DRAWING PERIPHERAL NAME Approved DRAWING MAIN_1.2 LG Electronics Inc. LG(42)-A-5505-10:01 LG Electronics Inc. - 145 -...
  • Page 145 7. Circuit Diagram B TO B CONNECTOR CONNECTOR VREG_MSMP_2.7V CN600 I2C_SDA CN601 I2C_SCL HPH_L EVRC14S05Q030100R HPH_R CAM_DATA(7) INOUT_A1 INOUT_B1 CAM_PWDN CAM_DATA(6) INOUT_A2 INOUT_B2 CAM_MCLK MMC_CMD FB602 EVRC14S05Q030100R VREG_T-FLASH_3.0V INOUT_A3 INOUT_B3 CAM_HSYNC MMC_CLK CAM_RESET_N INOUT_A4 INOUT_B4 INOUT_A1 INOUT_B1 CAM_DATA(3) MMC_DATA(0) INOUT_A2 INOUT_B2 CAM_DATA(0) MMC_CD...
  • Page 146 TTY_ADC_DET HOOK_SENSE_N VIN+ Pull-down R103 U101 330K NCS2200SQ2T2G Section Date Sign & Name Sheet/ Sheets MODEL CU500 09/22 Designer SH NAM 2005 Checked DRAWING SUB BíD NAME Approved DRAWING SUB_1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 147 -...

  • Page 147: Pcb Layout

    8. pcb layout - 148 -...
  • Page 148 8. pcb layout - 149 -...
  • Page 149 8. pcb layout - 150 -...
  • Page 150 8. pcb layout - 151 -...
  • Page 151 - 152 -...

  • Page 152: Calibration

    9. CALIBRATION 9. CALIBRATION 9.1 HOT KIMCHI 9.1.1 Directory structure HOT KIMCHI PROJECT Auto_Model CU500 AutoSetup.xml Procedure_CU500_Ver0.99.xml Spec_CU500_Ver0.95.xml Cal_Model CU500 Main_SequenceD.dll Dll_SerialATD.dll HOT_KIMCHI CmMqDll.dll DLL_PwrControlD.dll ComLMPLib_06.dll DLL_E5515CD.DLL Hot_KimchiD.exe AT_Serial_Cmd.xml ShieldBox_DllD.dll PwrSupply_Cmd.xml RF_Auto Main_SequenceD.dll Setup_Cal_Test.xml Info_Db.txt Dll_SerialATD.dll Jay_Ver0.8A_CU500.dll DLL_PwrControlD.dll DLL_E5515CD.DLL AT_Serial_Cmd.xml : Directory PwrSupply_Cmd.xml...
  • Page 153 9. CALIBRATION 9.1.2 Setup file (Info_Db.txt) /*cal*/[Default]=[CU500] /*cal*/[CU500]=[..\\Cal_Model\\CU500\\Jay_Ver0.8A_CU500.dll] /*auto*/[CU500]=[..\\RF Auto\\Rf_AutoMain_Ver1114.dll] [ezlooks]=[off] [batcal]=[off] [svc]=[off] [standalone]=[off] [tescom]=[off] [process]=[cal] [CU500]=[..\\Auto_Model\\CU500\\Procedure_CU500_Ver0.99.xml,..\\Auto_Model\\CU500\\Spec_ CU500_Ver0.95.xml,..\\Auto_Model\\CU500\\AutoSetup.xml] 1: Indication of ‘cal process’ or ‘auto process’ 2: Model name which is displayed on Hot Kimchi program 3: Relative path of Main Sequence dll file from Hot_KimchiD.exe 4: You can change this as ‘on’...
  • Page 154 [svc]=> If you use this program in svc, turn it on. Domestic: ‘on’, Oversea:’off’ [standalone]=> Oversea factory or SVC: ‘on’, Domestic factory: ‘off’ [tescom]=> If you use TESCOM shiedbox, turn it on. [process]=> auto process or cal process [CU500]=> procedure, spec, setup file name(auto process only) - 155 -...
  • Page 155 9. CALIBRATION 9.1.4 Example for setting file CAL Process AUTO Process Ex1) Service center Ex1) Service center, Oversea factory, repair [ezlooks]=[off] [ezlooks]=[off] [batcal]=[off] [batcal]=[off] [svc]=[on] [svc]=[off] [standalone]=[off] [standalone]=[off] [tescom]=[off] [tescom]=[off] [process]=[cal] [process]=[auto] Ex2) Domestic factory Ex2) Oversea factory or repair [ezlooks]=[on] [ezlooks]=[off] [batcal]=[off]...

  • Page 156: How To Use Hot Kimchi

    9. CALIBRATION 9.2 How to use Hot Kimchi * Flow 1. Select the model name which you want 2. Click APPLY button to load the ‘cal’ or ‘auto’ lib file 3. Click START button to run the procedure which you want - 157 -...

  • Page 157: Hot Kimchi Example

    9. CALIBRATION 9.3 HOT KIMCHI Example Choose Exe_Cu500Ag_100 - 158 -...
  • Page 158 9. CALIBRATION Click APPLY button Click START button - 159 -...
  • Page 159 9. CALIBRATION Click Run button to lunch RF AUTOTEST CU500 ..\\Auto Model\\CU500\\Procedure_cu500_ver0.99.xml ..\\Auto Model\\CU500\\Spec_cu500_ver0.99.xml - 160 -...

  • Page 160: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 19 25 SNGF0013101 MTAB0103602 MHFD0012901 SVLM0013102 - 161 -...
  • Page 161 - 162 -...

  • Page 162: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0010801 AAAY00 ADDITION AAAY0143101 Black MPBZ00...
  • Page 163 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MTAA02 TAPE,DECO MTAA0100501 MTAB00 TAPE,PROTECTION MTAB0122301 COMPLEX, (empty), , , , , MTAC00 TAPE,SHIELD MTAC0036801 Gold MTAE00 TAPE,WINDOW(SUB) MTAE0025201 COMPLEX, (empty), , , , , ACGK00I COVER ASSY,FRONT ACGK0063501 Black...
  • Page 164 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MGAZ00 GASKET MGAZ0040301 COMPLEX, (empty), , , , , MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White MLAN00 LABEL,QUALCOMM MLAN0000603 White,95C Transparent MLAZ00 LABEL MLAZ0044301 PRINTING, (empty), , , , , MLEA00 LOCKER,BATTERY...

  • Page 165: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0044301 PCB ASSY, SACB00 SACB0028901...
  • Page 166 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1006 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C1007 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1008 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1009 CAP,CHIP,MAKER ECZH0000830...
  • Page 167 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1040 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C1041 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C1042 CAP,FILM,MPP ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP C1043 CAP,CHIP,MAKER ECZH0000830...
  • Page 168 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1083 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP C1084 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP C1087 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C1088 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1089 CAP,CHIP,MAKER ECZH0000816...
  • Page 169 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1127 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C113 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C1130 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C1131 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 170 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C131 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C133 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP C134 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C135 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C136 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C204 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C205 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C206 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C207 CAP,CHIP,MAKER ECZH0004402...
  • Page 172 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C318 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C319 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C320 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C321 CAP,CERAMIC,CHIP ECCH0006201...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C489 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C500 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C501 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C502 CAP,TANTAL,CHIP,MAKER ECTZ0005201...
  • Page 174 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL104 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER FL105 FILTER,SAW SFSY0020101 1880 MHz,2.0*1.6*0.8 ,SMD , 1880 MHz,1960 MHz,3.8 dB,3.5 dB,43 dB,52 FL106 DUPLEXER,PCS SDPY0002902 dB,3.8*3.8*1.4 ,SMD ,FBAR 836.5 MHz,881.5 MHz,2.0 dB,2.7 dB,49 dB,61 FL107 DUPLEXER,DCN...
  • Page 175 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L126 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP , L127 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP , L128 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP , L129 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE...
  • Page 176 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Q500 TR,BJT,NPN EQBN0003901 EM3,0.15W,R/TP Q501 TR,BJT,ARRAY EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL R100 RES,CHIP,MAKER ERHZ0000231 180 Kohm,1/16W ,F ,1005 ,R/TP R1000 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP R1001 RES,CHIP,MAKER ERHZ0000404...
  • Page 177 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R1032 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP R1033 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP R1034 RES,CHIP ERHY0005902 5.62 Kohm,1/16W ,F ,1005 ,R/TP R1035 RES,CHIP ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R208 RES,CHIP,MAKER ERHZ0000308 62 Kohm,1/16W ,F ,1005 ,R/TP R213 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R221 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R233 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 179 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R504 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R555 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP R556 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP R577 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA502 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA503 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA504 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA505 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0057501 LD506 DIODE,LED,CHIP EDLH0005901 White ,1608 ,R/TP ,White LED LD507 DIODE,LED,CHIP EDLH0005901 White ,1608 ,R/TP ,White LED LD509 DIODE,LED,CHIP EDLH0005901 White ,1608 ,R/TP ,White LED LD510 DIODE,LED,CHIP EDLH0005901...
  • Page 182 14 V, ,SMD ,50pF, 1005 VA524 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 SPFY00 PCB,MAIN SPFY0112601 FR-4 ,0.8 mm,STAGGERED-8 , WSYY00 SOFTWARE WSYY0359301 cu500-msm-v10b-jun-22-2006-cw-us@ V08b SAJY00 PCB ASSY,SUB SAJY0015801 MPBZ00 MPBZ0152001 COMPLEX, (empty), , , , , SAJE00 PCB ASSY,SUB,SMT SAJE0011401 PCB ASSY,SUB,SMT SAJC00...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R103 RES,CHIP,MAKER ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP R104 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R105 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R106 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP...

  • Page 184: Accessory

    SBOM standard on GCSC Location Level Description Part Number Specification Color Remark BATTERY PACK, 3.7 V,1000 mAh,1 CELL,PRISMATIC ,CU500 CGR, BATT, SBPP00 SBPP0015001 LI-POLYMER Pb-Free SSAD00 ADAPTOR,AC-DC SSAD0016903 100-240V ,5060 Hz,4.6 V,0.8 A,UL & CSA , - 185 -...
  • Page 185 Note...
  • Page 186 Note...

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