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LG U400 Service Manual

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Service Manual
U400
Date: July, 2006 / Issue 1.0

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Summary of Contents for LG U400

  • Page 1 Service Manual U400 Date: July, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table of Contents 1. INTRODUCTION ......6 3.2.2 Block Description ......44 3.2.3 Camera & Camera Interface ... 46 1.1 Purpose........... 6 3.2.4 Camera Regulator ......49 1.2 Regulatory Information......6 3.2.5 Display & LCD FPC Interface ..50 1.3 Abbreviations .......... 8 3.2.6 LCD Backlight Illumination ....52 3.2.7 Keypad Illumination ......
  • Page 3 4.13.1 Checking Vincenne2 Block ..130 5.3.2. U400 Download(2) - FlashRW 4.13.2 Checking Bluetooth Block ....131 configuration.........183 4.14 RF Component........132 5.3.3. U400 Download(3) - Download file selection........185 4.15 Procedure to check ......134 5.3.4. U400 Download(4) - Connect & 4.16 Checking Common Power Download ........186...
  • Page 4 Table Of Contents 6. BLOCK DIAGRAM ......193 6.1 GSM & WCDMA RF Block....193 7. CALIBRATION ......195 8. Circuit Diagram ......205 9. CALIBRATION ......209 9.1 General Description ......209 9.2 XCALMON Environment ......209 9.2.1 H/W Environment......209 9.2.2 S/W Environment ......209 9.2.3 Configuration Diagram of Calibration Environment........209 9.3 Calibration Explanation ......210 9.3.1 Overview ........210...

  • Page 5: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 6 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 7: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purpose of this manual, following abbreviations apply. Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing DeskTop Charger EEPROM...
  • Page 8 1. INTRODUCTION PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory UMTS Universal Mobile Telephony System - 9 -...

  • Page 9: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset Size 99.8 x 48 x 20.4 mm Weight 114g under (with Standard Battery) Power 1300mA Li-Polymer Over 184 Min (WCDMA, Tx=12 dBm, Voice) Talk Time Over 265 Min (GSM, Tx=Max, Voice) Over 280 hrs (WCDMA, DRX=1.28)

  • Page 10: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Spec. Unit Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.23) Operating Temp. -20 ~ + 60 °C Storage Temp. -30 ~ + 85 °C Humidity max. 85 2) Environment(Accessory) Item Spec. Typ. Unit Power Available power...
  • Page 11 2. PERFORMANCE Item DCS/PCS 30M ~ 1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G ~ 1710MHz -30dBm Channel 1710M ~ 1785MHz -36dBm 1G ~ 4GHz -30dBm Radiated 1785M ~ 4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm Emission 880M ~ 915MHz...
  • Page 12 2. PERFORMANCE Item DCS/PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3 ±3 ±3...
  • Page 13 2. PERFORMANCE 2) Transmitter-WCDMA Mode Item Specification Class3: +24dBm(+1/-3dB) Maximum Output Power Class4: +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 14 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1k BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k Spurious Emissions -30dBm@f=1~12.75GHz, 1M *: additional requirement -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k -31dBc@5MHz, Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5% (>-20dBm) Error Vector Magnitude(EVM) (@12.2k, 1DPDCH+1DPCCH)
  • Page 15 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensivitivity Level -106.7dBm(3.84M) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3) 33dB Adjacent Channel Selectivity(ACS) UE@+20dBm output power(class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(class3) -44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3) -30dBm/3.84MHz@f=2025~2050 &...
  • Page 16 2. PERFORMANCE 5) Bluetooth Mode 5.1) Transmitter Out Power Class 2 : -6~4dBm Power Density Power density < 20dBm per 100kHz EIRP Option Power Control 2dB ≤ step size ≤ 8dB TX Output Spectrum fmax & fmin @ below the level of -30dBm -Frequency range (100khz BW) within 2.4GHz~2.4835GHz TX Output Spectrum...
  • Page 17 2. PERFORMANCE 5.2) Receiver Sensitivity single slot packets BER≤0.1%@-70dBm Sensitivity multi slot packets BER≤0.1%@-70dBm BER ≤ 0.1%@ (Low,Mid,High Frequency) 2405MHz, 2441MHz, 2477MHz Interference Ratio Co-Channel interference, C/I co-channel 11dB C/I performance Adjacent(1MHz)interference, C/I 1MHz Adjacent(2MHz)interference, C/I 2MHz -30dB Adjacent(≥3MHz)interference, C/I ≥3MHz -40dB Adjacent(≥3MHz)interference to in band -9dB...

  • Page 18: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption (VT test : Speaker off, LCD backlight On) Stand by Voice Call WCDMA 280 Hours = 4.6 mA 184 Min = 424 mA 142 Min= 549 mA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) 330 Hours = 3.9 mA 265 Min = 294 mA (paging=9period) (Tx=Max)

  • Page 19: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8±3dB -1±3dB Receiving Loudness Rating (RLR) -15±3dB Side Tone Masking Rating (STMR) 17dB over Echo Loss (EL) 40dB over Sending Distortion (SD) refer to TABLE 30.3 Receiving Distortion (RD) refer to TABLE 30.4 Idle Noise-Sending (INS) -64dBm0p under...

  • Page 20: Charging

    2. PERFORMANCE 2.8 Charging • Normal mode: Complete Voltage: 4.2V Charging Current: 800mA • Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level) •...

  • Page 21: Technical Brief

    3. Technical Brief 3. BB Technical Description 3.1 Digital Baseband(DBB) & Multimedia Processor 3.1.1 General Description A. Features • CPU ARM926 running at 13, 104, 208 MHz - 32kB Instruction Cache, 16kB Data Cache, 64kB Instruction TCM and 16kB Data TCM - 8 channels DMAC •...

  • Page 22: Hardware Architecture

    3. Technical Brief 3.1.2 Hardware Architecture The hardware structure is delivered as five separate hardware macros to the top-level design, also depicted in Figure. Figure 3-1-1. Simplified Block Diagram of Ericsson DB2020 - 23 -...
  • Page 23 3. Technical Brief A. Block Diagram Figure 3- 1- 2. Detailed Block Diagram of Ericsson DB 2020 - 24 -...
  • Page 24 3. Technical Brief B. CPU Hardware Subsystem The CPU subsystem incorporates: • CPU Sub chip • Backplane • JTAG • DMA Controller • System Buffer RAM • Boot ROM • External Memory Interface (EMIF) for connection to external NAND Flash and SDRAM memory. The bus architecture implements AMBA-Lite, allowing only one AHB master on each AHB layer providing access to AHB slave.
  • Page 25 3. Technical Brief F. GSM Hardware Subsystem The GSM subsystem includes hardware functionality to support GSM and GPRS wireless access. Incoming data from the radio receiver is through a three-wire interface, consisting of I (IDATA), Q (QDATA) and clock (DCLK). The DCLK input is 13 MHz and the IDATA and QDATA each contain 48 bits per symbol.

  • Page 26: External Memory Interface

    200•Ïs 1 page = 528 Byte 2.64MByte/s NAND flash KAG004003M-DDD5 Samsung Erase speed 1 Block = 16K Byte 8MByte/s Table 3- 1- 1. External Memory Interface Spec. of U400 Figure 3- 1- 3. External Memory Configuration of U400 - 27 -...

  • Page 27: Rf Interface

    3. Technical Brief 3.1.4 RF Interface A. MARIKA Interface Marika controls GSM RF part using these signals through GSM RF chip-Tilde. • DIRMOD[A:D] : GSM/DCS/PCS TX Data • DCLK, IDATA, QDATA : GSM/DCS/PCS RX Data • RFCLK, RFDAT, RFSTR : Control signals for Tilde •...
  • Page 28 3. Technical Brief B. WANDA Interface Wanda controls WCDMA RF part using these signals through W-CDMA RF chip-Wopy & Wivi. • WCLK, WDAT, WSTR : Control signals for Wivi & Wopy • RXIA, RXIB, RXQA, RXQB : WCDMA RX Data •...

  • Page 29: Sim Interface

    3. Technical Brief 3.1.5 SIM Interface SIM interface scheme is shown in Figure3-1-6. SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(MARIKA) with ABB(VINCENNE2) and filter. SIM (Interface between DBB and ABB) SIMDAT0 SIM card bidirectional data line SIMCLK0 SIM card reference clock SIMRST0 SIM card async/sync reset Table 3- 1- 2.

  • Page 30: Uart Interface

    3. Technical Brief 3.1.6 UART Interface UART signals are connected to MARIKA GPIO through IO connector UART0 Resource Name Note GPIO00 UARTRX0 Receive Data GPIO01 UARTTX0 Transmit Data UART1 GPIO20 UARTRX3 Receive Data (UART3) GPIO21 UARTTX3 Transmit Data (UART3) GPIO22 UARTRTS3 Request To Send GPIO23...

  • Page 31: Gpio (General Purpose Input/Output) Map

    3. Technical Brief 3.1.7 GPIO (General Purpose Input/Output) map In total 40 allowable resources. This model is using 27 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table. GPIO Assigned Name Function Init Status GPIO00 UARTRX0 UART...

  • Page 32: Usb

    3. Technical Brief 3.1.8 USB The USB block supports the implementation of a "full-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention. The USB specification allows up to 15 pairs of endpoints.
  • Page 33 3. Technical Brief U903 ISP1102BS USBOE R938 TOL 1% USBRCV USBDP R939 TOL 1% USBVP VP_VPO USBDM R999 R998 Figure 3- 1- 9. Schematic of USB Transceiver - 34 -...

  • Page 34: Slider On/Off Detection

    3. Technical Brief 3.1.9 Slider ON/OFF Detection There is a magnet to detect the slide module status, up or down. If a magnet is close to the hall-effect switch(U900 on Keypad), the voltage at Pin 4 of U900 goes to 0V. Otherwise 1.8V.

  • Page 35: Bluetooth Interface

    3. Technical Brief 3.1.10 Bluetooth Interface U400 supports Bluetooth operation using ST’ STLC2500C Bluetooth module. A. General Description The Bluetooth interface utilizes the UART interface for control signals going to and from the Bluetooth module. The UART is also used for data transmissions.
  • Page 36 3. Technical Brief F. STLC2500C • Bluetooth™‚ specification compliance: V1.2 and V2.0 and compliant to EDR. • Ericsson Technology Licensing Baseband Core(EBC) • Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability • Asynchronous Connection Oriented (ACL) logical transport link •...
  • Page 37 3. Technical Brief G. U400 Bluetooth Schematic U802 STLC2500C R811 RESOUT2n RESET_N C828 330p MCLK_W_BT REF_CLK_IN BT_RTCCLK LP_CLK R812 CLK_REQ_OUT_1 CLKREQ BT_WAKEUP R813 R814 UARTTX3 UART_RXD UART_TXD UARTRX3 R815 R816 UARTRTS3 UART_CTS UART_RTS UARTCTS3 PCMCLK PCM_CLK PCMSYN PCM_SYNC PCMDATB PCM_A...

  • Page 38: Microsd Interface Card

    3. Technical Brief 3.1.11 MicroSD Interface card U400 supports the MicroSD card interface as external memory card. MicroSD card has 4-data line, so U400 uses 4-data line. All control and data line is connected to MARIKA. Cause of the difference between MARIKA and MicroSD card, a level shifter should be added.

  • Page 39: Power On Sequence

    3. Technical Brief 3.1.12 Power On Sequence ➀ User presses END key and then ONSWAn signal is changed to Low. ➁ VINCENNE2 initiates the internal oscillator and powers on the regulators. ➂ VINCENNE2 generates a power for MARIKA. ➃ VINCENNE2 releases the power reset signal(PWRRSTn) and generates an interrupt(IRQ0n) to MARIKA.

  • Page 40: Key Pad

    3. Technical Brief 3.1.13 Key Pad There are 26 buttons and 3 side keys in Figure 3-xx. Shows the Keypad circuit. ‘END’ Key is connected ONSWAn for Vincenne2. KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYOUT0 Vol UP Vol DOWN SIDE Music SIDE CAM KEYOUT1 KEYOUT2...
  • Page 41 3. Technical Brief R111 R117 R137 D100 CLEAR SEND SNED 1SS388 R109 KEYOUT4 Figure 3-1-15. KEY PCB KeyPad Circuit VDDG27 KEYIN0 R119 JOG_DISK_A_27 KEYIN1 R120 JOG_DISK_B_27 KEYIN2 R136 JOG_PWDN_27 KEYIN3 KEYIN4 JOG_LED_ANODE KEYOUT4 JOG_LED_CATHODE KEYOUT5 AXK7L20227G(0.9T) SOCKET KEY-JOG MODULE 20 PIN CONNECTOR ENBY0016601 Figure 3-1-16.

  • Page 42: Gam Hardware Subsystem

    3. Technical Brief 3.2 GAM Hardware Subsystem Figure 3-2-1. GAM Subsystem Functional Block Diagram 3.2.1 General Description The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of visual imagery and the transfer of this data to the display. GAM also provides support for the camera module.

  • Page 43: Block Description

    3. Technical Brief 3.2.2 Block Description A. GAM Controller(GAMCON) The GAM Controller (GAMCON) is responsible for clock gating and distribution within the GAM module. GAMCON receives the HCLK from SYSCON and distributes to GRAPHCON, GRAM, PDI and CDI. GAMCON also distributes the GAM reset signal to GRAPHCON, GRAM, PDI and CDI. The reset signals CIRES_N and PDIRES_N are distributed from GAMCON to the camera and display module respectively, see Figure 2.28.
  • Page 44 3. Technical Brief E. Camera Data Interface (CDI) Block The camera data interface (CDI) block is designed to support a range of still image camera modules. An 8-bit parallel bus supports data transfer from the camera module to the CDI. The pixel clock is an output clock from the camera module to the CDI and qualifies the data on the parallel bus.

  • Page 45: Camera & Camera Interface

    3. Technical Brief 3.2.3 Camera & Camera Interface CIRES_N CIRES_N CIPCLK CIPCLK CIVSYNC CIVSYNC CIHSYNC CIHSYNC CID0 CID0 CID1 CID1 CID2 CID2 CID3 CID3 CID4 CID4 CID5 CID5 CID6 CID6 CID7 CID7 NF_R_B TP712 NF_CS_N TP713 NF_CLE TP714 NF_ALE TP715 NF_WE_N NF_RE_N Figure 3-2-2.
  • Page 46 3. Technical Brief FL900 CSPEMI608 PDID7 FILTER2_1 FILTER1_1 VCAM28 VDDG27 VDDE18 VBATI PDID6 FILTER2_2 FILTER1_2 PDID5 FILTER2_3 FILTER1_3 PDID4 FILTER2_4 FILTER1_4 PDID3 FILTER2_5 FILTER1_5 PDID2 FILTER2_6 FILTER1_6 PDID1 FILTER2_7 FILTER1_7 PDID0 FILTER2_8 FILTER1_8 CN901 LCDBL1 LCDBL2 LCDBL3 JOG_DISK_A JOG_DISK_B BPP_MODE_CTRL JOG_PWDN KEY_LED_ONOFF_KEY KEYIN0...
  • Page 47 3. Technical Brief The 2M Camera modules are connected to main board(14-5602-024-000-829) and VGA Camera module is connected to LCD FPCB with 20-pin Board to Board connector(AXK724145) through 60 pin Board to Board connector. Its interface is dedicated camera interface port in Marika. The camera port supply 24MHz master clock to camera module and receive 15MHz pixel clock(30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module.

  • Page 48: Camera Regulator

    3. Technical Brief 3.2.4 Camera Regulator GPIO_33 enables 1.8V & 2.8V Camera Regulator for both 2M and VGA Camera. Charge Pump includes two voltage regulators. VBATI U902 MAX8631XETI R968 C909 C910 2012 PGND C911 C912 BGND 2012 ENM1 BL_EN ENM2 FLASH_CTRL LCDBL1 CAMLDO_CTRL...

  • Page 49: Display & Lcd Fpc Interface

    3. Technical Brief 3.2.5 Display & LCD FPC Interface LCD module include device in table 3-2 Device Type Main LCD 240 x RGB x 320 262K Color TFT LCD Main LCD Backlight 3 White LEDs Table 3-2-3. Device in LCD Module LCD Module is connected to Key PCB with 35-pin ZIF type Connector(XF2B-3545-31A ) in Key PCB.
  • Page 50 3. Technical Brief Table 3-2-5. Interface between LCD module and Key PCB - 51 -...

  • Page 51: Lcd Backlight Illumination

    3. Technical Brief 3.2.6 LCD Backlight Illumination There are 3 white LEDs in LCD Backlight circuit which is driven by Charge Pump(MAX8631). GPIO32 is used for Backlight brightness control. VBATI U902 MAX8631XETI R968 C909 C910 2012 PGND C911 C912 BGND 2012 ENM1 BL_EN...

  • Page 52: Camera Flash Led Illumination

    3. Technical Brief 3.2.8 Camera Flash LED Illumination Camera Flash LED is also driven by MAX8631. GPIO_04(FLASH_CTRL1) enables Flash mode. Flash is connected Main board by 6 pin ZIF type Connector(XF2R-0615-4A-P) VBATI U902 MAX8631XETI R968 C909 C910 2012 PGND C911 C912 BGND 2012...

  • Page 53: Lcd Module

    3. Technical Brief 3.3 LCD Module Flash LEDs Vibrator Ear Piece 35 pin ZIF 60pin BtoB 40pin BtoB LCD Module KEY PCB LCD FPCB Main Board Connector Connector Connector VGA Camera 2M Camera Figure 3-3-1. LCD Module Block Diagram 262K TFT LCD 240 X 320 pixels Main LCD Driver IC uPD161704...

  • Page 54: Analog Baseband (Abb) Processor

    3. Technical Brief 3.4 Analog Baseband (ABB) Processor 3.4.1 Overview of Audio path MARIKA Digital Baseband ASIC Voice Call RX Videp Telephony RX VINCENNE2 Audio and Power Management ASIC Receiver Tone Generator Audio Mixer C-MIC MIDI or WAVE Voice Call TX HEADSET CODEC Videp Telephony TX...

  • Page 55: Audio Signal Processing & Interface

    3. Technical Brief 3.4.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (Marika). This transmitted signal is reformed to fit in GSM &...
  • Page 56 3. Technical Brief MIC600 R600 SP0102BE3 VDDE18 R603 1.5K CN600 C601 0.1u MIC1P C602 0.1u MIC1N BLM15HD182SN1 C603 0.1u R688 FB603 R686 AUXI1P FB604 AUXI1N R687 C697 0.1u R685 51 R699 HS_DET R696 R689 HS_KEY_ADC R698 C695 1.5K C694 HOOK R614 C696 C612...

  • Page 57: Audio Mode

    3. Technical Brief 3.4.3 Audio Mode Audio Mode includes three states.( Voice call, Midi.MP3). Each states is sorted by the total 7 Modes according to external Devices (Receiver,Loud Speaker,Headset). Video Telephony Mode Operate on state of the WCDMA CALL. VINCENNE2 In /Out Port Mode Receiver Mode MIC1P/MIC1N...

  • Page 58: Voice Call

    3. Technical Brief 3.4.4 Voice Call A. Voice call Downlink Mode(Receiver, Speaker, Headset) This section provides a detailed description of the Voice Call RX functions. Figure 3-4-4. Voice call Downlink Scheme - 59 -...
  • Page 59 3. Technical Brief The voice decoder accepts a serial input stream of linear PCM coded speech. The receive bandpass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path.
  • Page 60 3. Technical Brief B. Voice Call Uplink Mode (Receiver,Speaker,Headset) This section provides a detailed description of the Voice Call TX functions. The VINCENNE2 internal voltage source (CCO) provides the necessary drive current for the electric microphone. The voltage source is via I2C programmable to supply 2.2V or 2.4V. But the voltage source of our Model is to supply 2.4V.

  • Page 61: Midi (Ring Tone Play)

    3. Technical Brief 3.4.5 MIDI (Ring Tone Play) This section provides a detailed description of the MIDI and WAV-file functions. MARIKA Digital Baseband ASIC VINCENNE2 MIDI or WAVE Audio and Power Audio Mixer Management ASIC AUDIO AMP HEADSET Speaker CODEC Figure 3-4-6.

  • Page 62: Mp3 (Audio Player)

    3. Technical Brief 3.4.6 MP3 (Audio Player) This section provides a detailed description of the MP3 file functions. MARIKA Digital Baseband ASIC VINCENNE2 Audio and Power Audio Mixer AUDIO AMP Management ASIC HEADSET Speaker CODEC Figure 3-4-7. MP3 Scheme MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used as a audio amp and one speaker.

  • Page 63: Video Telephony

    AUDIO AMP Figure 3-4-8. Video Telephony Scheme Video Telephony Mode has same paths with Loud Speaker Mode. 3.4.8 Audio Main Component There are 7 components in U400 schematic Diagram. Part Number marked on U400 Schematic Diagram. ITEM PART NUMBER MAKER...

  • Page 64: Gpadc(General Purpose Adc) And Autoadc2

    3. Technical Brief 3.4.9 GPADC(General Purpose ADC) and AUTOADC2 The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention.

  • Page 65: Charger Control

    3. Technical Brief 3.4.10 Charger control A programmable charger in AB2010 is used for battery charging. It is possible to set limits for the output voltage at CHSENSE- and the output current from DCIO via the sense resistor to CHSENSE-. The voltage at CHSENSE- and the current feed to CHSENSE- cannot be measured directly by the GPADC.

  • Page 66: Fuel Gauge

    3. Technical Brief 3.4.11 Fuel Gauge AB2010 supports the measurement of the current consumption/charging current in the U8100 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity. The function of the fuel gauge block is schematically described in (Fig.3-4-14).

  • Page 67: Battery Temperature

    3. Technical Brief 3.4.12 Battery Temperature Measurement The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. (Fig.3-4-16) shows the schematic of battery temperature measurement part. FGSENSE+ FGSENSE- D501...

  • Page 68: Charging Part

    3. Technical Brief 3.4.13 Charging Part The charging block in AB2010 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. (Fig.3-4-16) shows the schematic of charging part.
  • Page 69 3. Technical Brief Trickle charging When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA. Parameter Unit Trickle current Table. 3-4-9. Trickle charging spec Normal charging When the VBAT voltage is within limits or the internal regulators are turned on, the current source for trickle charging is turned off and all parts of the charging block are active.
  • Page 70 3. Technical Brief • Charging Method : CCCV (Constant Current Constant Voltage) • Maximum Charging Voltage : 4.2V • Maximum Charging Current : 700mA • Nominal Battery Capacity : 1300 mAh • Charger Voltage : 4.6V • Charging time : Max 3.5h •...

  • Page 71: Voltage Regulation

    3. Technical Brief 3.5 Voltage Regulation 3.5.1 Internal Regulation There are LDO (Low Drop Output) regulators and BUCK converter in AB2010 (Vincenne2) chip. LDO regulators and BUCK converter generate the following voltages : 1.5V, 1.8V and 2.75V. The output of these LDOs supply VDD-A, VDD-B and VDIG with 2.75V. BUCK converter steps down the VBAT to 1.5V for VCORE and VRTC, and to 1.8V for VMEM voltage.
  • Page 72 3. Technical Brief Figure 3-5-1. Power supply scheme Name Type Output voltage Description VDD_A Power Supply 2.75V Supply output VDD_B Power Supply 2.75V Supply output VDD_D Power Supply 2.75V Supply output VDD_E Power Supply 1.8V Supply output VDDLP Power Supply 1.5V Low Power supply output VDDBUCK...

  • Page 73: General Description Of Rf Part

    3. Technical Brief 3.6 General Description of RF Part The RF part includes a tri-band GSM/DCS/PCS part (900, 1800 and 1900MHz) and W-CDMA part for IMT-2000 (UL 1900MHz, dl 2100MHz). It also contains FEM(RF Front End Module), WCDMA duplexer, WCDMA Power Amplifier and GSM Power Amplifier. The whole structure of Radio part is shown in Figure 3-6-1.
  • Page 74 3. Technical Brief Figure 3-6-2. RF control signal flow The MARIKA(the main processor) controls the overall radio system. In the GSM/GPRS air interface mode, this control is handled via direct interfaces to individual RF components. The MARIKA(the main processor) also handles the antenna switch mechanism for selection of mode. In the W-CDMA mode, the RF system is managed via the Wanda (WCDMA digital base-band coprocessor ASIC) and its DSP processor.

  • Page 75: Gsm Mode

    3. Technical Brief 3.7 GSM Mode 3.7.1 Receiver The received RF signal on the antenna connector arrives via antenna switch at external band pass filters for band selectivity. One filter is required per supported GSM band. The corresponding LNA amplifies the signal for optimum noise suppression. The LNA output signal is mixed with the on-channel LO generated by the proper VCO and transformed into a Q and an I signal.
  • Page 76 3. Technical Brief B. Receiver Block The circuit contains one frequency down-conversion section for each receive band and a common base band amplifier and filter section. The GSM900 RF part consists of a low noise amplifier followed by high dynamic range mixers. The DCS 1800 and PCS 1900 RF part also have low noise amplifier connected to the other mixers.
  • Page 77 3. Technical Brief C. LO Block The LO signals from the receive VCO section drive the dividers for GSM 900, DCS 1800 and PCS 1900 respectively to provide quadrature LO signals to the receive mixers. The LO signal is also supplied to the prescaler and transmit output buffer.
  • Page 78 3. Technical Brief D. VCO Block The VCOs are fully integrated balanced LC oscillators with on-chip resonators. The receive VCOs run on double frequency. Different frequency ranges can be selected in the VCOs for GSM, DCS and PCS band operation. The VCOs are supplied from a separated external voltage regulator to avoid frequency pushing and up conversion of low frequency noise.
  • Page 79 3. Technical Brief E. PLL Block The PLL consists of a programmable prescaler with multiple division ratios and a phase and frequency detector with a charge pump with programmable output current. Channel frequency selection and transmitter modulation is controlled via the prescaler modulus inputs MODA ~ MODD and the prescaler offset value N offset.

  • Page 80: Transmitter

    3. Technical Brief 3.7.2 Transmitter A 4-bit sigma-delta bit stream comes from the Marika ASIC including both channel information and the GMSK phase information. Via the 3-wire control bus also driven from Marika, the selection of transmitter band is made. The 4bits from the bit stream provides the fine-tuning of the division ratio before going to the divider of the used VCO (low band, 900MHz or high band, 1800/1900MHz).
  • Page 81 3. Technical Brief A. Power Amplifier The Power Amplifier (N400) is intended for use in EGSM and DCS/PCS mobile equipment. It is a module with two parallel amplifier chains, with one chain for the EGSM transmitter section and one for the DCS/PCS transmitter section. Each chain amplifies the RF signal from the respective transmitter to the antenna.

  • Page 82: Wcdma Mode

    3. Technical Brief 3.8 WCDMA Mode 3.8.1 Receiver The received RF signal on the antenna connector arrives via the antenna switch to the duplexer. The duplexer directs the signal to the LNA, which resides in Wopy (W-CDMA Receive ASIC) as every other active part of the radio receiver.
  • Page 83 3. Technical Brief B. RFLO Section The VCO is a fully integrated balanced LC oscillator with on-chip resonator. An on-chip varactor is used to control the frequency over the desired tuning range. A separate external voltage regulator supplies the VCO with power to avoid frequency pushing and up conversion of low frequency noise.
  • Page 84 3. Technical Brief C. Reference Section The reference block consists of a balanced oscillator and a buffer amplifier. The crystal unit and the feedback capacitors are external. The current consumption when only the reference oscillator and the output buffer are activated must be kept to an absolute minimum. Figure 3-8-3.

  • Page 85: Transmitter

    3. Technical Brief 3.8.2 Transmitter Analogue differential signals (currents), representing I and Q, are sent to the radio ASCI Wivi (W- CDMA Transmitter ASIC) from the D/A converter in Wanda (W-CDMA digital base-band coprocessor ASIC). The signals are filtered in a reconstruction filter and then modulated up to 380MHz (using the IFLO signal).
  • Page 86 3. Technical Brief C. Variable Gain Amplifier(VGA) Comprising two cascaded variable gain amplifiers, the VGA-together with the RF mixer-controls the power of the transmitter. The first of these two amplifiers, the so-called QVGA, enables fine-tuning of the transmitter by varying the gain in 0.25dB steps, that is 0/0.25/0.5/0.75dB.
  • Page 87 (RF). The mixer can be switched between three different gain levels: high gain (HG), medium gain (MG), and low gain (LG). The LO buffer provides the buffering for either an internal LO signal generated within the internal RFPLL, or an external LO signal applied to the RFLO/RFLOBAR pins.
  • Page 88 3. Technical Brief F. Power Amplifier The N302(ACPM7881) is a high-power, high-efficiency linear amplifier module targeting WCDMA transmitter ASIC. The module is fully matched to 50Ω for easy system integration and utilizes pHEMT process technology. The PA is compatible with DC-DC converter operation in DC power management applications.

  • Page 89: Frequency Generation

    3. Technical Brief 3.8.3 Frequency Generation The Wopy (W-CDMA Receive ASIC) contains the active elements for a 13MHz VCXO, which is designed to be the reference frequency of the UE. There are two synthesizers in the W-CDMA part of the radio, an intermediate frequency (IF) synthesizer and a radio frequency (RF) synthesizer.
  • Page 90 3. Technical Brief A. IF PLL The IF LO frequency synthesis comprises the four following par is: - Input buffer: A 13MHz input buffer with DC-biasing provided at source. - VCO: Operating on 1.52GHz which is 4times the TX-IF frequency (380MHz) and 8 times the RX-IF (190MHz), this is a fully integrated balanced LC oscillator with on-chip resonator.

  • Page 91: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Power ON Trouble START Charge or change The voltage of main battery main battery is higher than 3.2V ? Follow the Press END key. Keypad backlight Keypad LED ON? Trouble shooting guide END key operates well? Follow the keypad Trouble ONSWAn(TP504) level is low...

  • Page 92: Usb Trouble

    4. TROUBLE SHOOTING 4.2 USB Trouble START (Measure during the state of USB module running) Check host USB port Input power(U903, Pin#12) is 5V? or USB cable Resolder or change U903 Output power(U903, Pin#13) is 3.3V? Resolder or change U903 USBVALID level is 1.8V? Resolder R938 D+(R938) is 3.3V?

  • Page 93: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.3 SIM Detect Trouble • • SIM control path - MARIKA generates SIM interface signals(2.75V level) to VINCENNE2. - Vincenne2 converts SIM interface signals to 3V/5V. START Reconnect SIM card SIM work well? Finish Resolder S500 on main PCB and check the contact between S500 and SIM card Finish...

  • Page 94: Microsd Card Trouble

    4. TROUBLE SHOOTING 4.4 MicroSD card Trouble START Re-insert MicroSD card MicroSD card work well? Finish Check operation of MicroSD card using other notebook or PDA Change the MicroSD MicroSD work well? Re-insert MicroSD MicroSD _DETECT(R580) is Resolder R580 2.75V? Finish MicroSD work well? Change main board...

  • Page 95: Keypad Trouble

    4. TROUBLE SHOOTING 4.5 Keypad Trouble Keypad singals to MARIKA and VINCENNE2 directly and through board-to-board connector. START Press the Keypad Keypad operates well? Resolder side key (Camera key or volum key) Check side key short? Keypad operates well? Check BtoB connector short? Resolder BtoB connector CN901(Main Bíd), CN4(Keypad) CN901(Main Bíd) or CN4(Keypad)
  • Page 96 4. TROUBLE SHOOTING Main PCB Pin #9 ~ #16 KEYIN0 KEYIN1 KEYIN2 CN901 KEYIN3 KEYIN4 KEYOUT4 KEYOUT5 OMSWAn Pin #22 ~ #29 KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYOUT4 KEYOUT5 OMSWAn Key PCB - 97 -...

  • Page 97: Camera Trouble

    4. TROUBLE SHOOTING 4.6 Camera Trouble Camera control signals are generated by Marika 4.6.1 2M Camera START Press END Key to turn on the power Follow the Power On Trouble Is the circuit powered? Shooting Reconnect the 2M 24pin B to B connector 2M Camera Operation OK? Pin 4 of U902 or R933 = 2.8V? Change U902...
  • Page 98 4. TROUBLE SHOOTING CN900 24 pin 2M Camera Connector in Main Board U902 R934 R933 Charge Pump in Main Board - 99 -...

  • Page 99: Vga Camera

    4. TROUBLE SHOOTING 4.6.2 VGA Camera START Press END Key to turn on the power Follow the Power On Trouble Is the circuit powered? Shooting Reconnect the 60pin BtoB connector CN901 and VGA 20 pin Camera Connector VGA Camera Operation OK? Pin 4 of U902 or R933 = 2.8V? Change U902 Change VGA Camera...
  • Page 100 4. TROUBLE SHOOTING CN100 CN901 Main Board 60 pin BtoB Connector LCD FPCB 20 pin VGA Connector U902 R933 Charge Pump in Main Board - 101 -...

  • Page 101: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.7. Main LCD Trouble LCD control signals are generated by Marika START Press END Key to turn on the power Follow the Power On Trouble Follow the Power On Trouble Is the circuit powered? Shooting Shooting Disconnect and Reconnect the 60pin (Main) or 40 pin(LCD PCB) LCD Display OK? Disconnect and Reconnect the 40pin...
  • Page 102 4. TROUBLE SHOOTING CN901 Main Board 60 pin BtoB Connector LCD FPCB 40 pin BtoB Connector Key PCB 35 pin LCD Connector - 103 -...

  • Page 103: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.8. Keypad Backlight Trouble START Press END Key to turn on the power Keypad Backlight Works? Backlight Control Signal is 2.8V at R914? Resolder or Change Q900 Keypad Backlight Works? Finish Change Main Board - 104 -...

  • Page 104: Keypad Backlight Driver

    4. TROUBLE SHOOTING VBATI HSMR-C191 R914 KEY_LED_ONOFF_MAIN 2.7K C913 H LEVEL CHECK 0.1u R915 Q900 EMX18 R994 R929 100K KEYPAD BACKLIGHT DRIVER R914 Q800 - 105 -...

  • Page 105: Camera Flash Trouble

    4. TROUBLE SHOOTING 4.9 Camera Flash Trouble START Press END Key to turn on the power Follow the Power On Trouble Is the circuit powered? Shooting Solder Flash FPCB again Flash Operation OK? Is C912 high? Change U902 Check voltage of Flash LED Flash Operation OK? Change Flash FPCB Flash Works...
  • Page 106 4. TROUBLE SHOOTING Flash FPCB soldered in the Main board U902 R933 Charge Pump in Main Board Flash FPCB - 107 -...

  • Page 107: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.10 Folder ON/OFF Trouble START Insert magnet Check magnet in lower slide Turn the power on Change Main Pin 1 of U900 = 2.75V VDIG=2.75V at R524 board Place magnet on U900 Slide OK? Pin 2 of U1 = 0V Change keypad Slide OK? Finished...
  • Page 108 4. TROUBLE SHOOTING VDIG27 VDDE18 U900 TK60012BM5 IO_VDD GND1 GND2 C900 0.1u SLIDE_DET Hall effect switch U900 Be sure that magnet is here R524 - 109 -...

  • Page 109: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.11 Audio Trouble Shooting 4.11.1. Receiver • Signals to the receiver - Receiver signals are generated at Vincenne2 BEARP, BEARN • - Receiver path : 1. Vincenne2 (BEARP, BEARN) → 2. CN901 on main board → 3. LCD FPCB → 4.
  • Page 110 4. TROUBLE SHOOTING START Connect the phone to network Equipment and setup call Setup 1KHz tone out Does the sine wave appear Change the main board at FB901,FB902 ? The sine wave not appear Does the sine wave appear Check R908,R909 at Number 39, 40 pin in the main Bíd CN901? Does the sine wave appear...
  • Page 111 4. TROUBLE SHOOTING A SIDE CN800 FB901,FB902 Pin 39, 40 LCD FPCB - 112 -...
  • Page 112 4. TROUBLE SHOOTING Measured 1khz Sine Wave Signal Measured 1khz Sine Wave Signal - 113 -...

  • Page 113: Speaker

    4. TROUBLE SHOOTING 4.11.2. Speaker (Voice Loud Speaker,Midi, MP3,Key Tone) Signals to the speaker • Speaker signals are generated at Vincenne2 - AUXO1/Right, AUXO2/Left • Speaker path : 1. Vincenne2 (AUXO1/Right, AUXO2/Left)→ 2. C620, C621 on the main board → 3.
  • Page 114 4. TROUBLE SHOOTING START Connect the phone to network Equipment and setup call Setup 1KHz tone out Does the sine wave appear Change the main board at C620,C621 ? The sine wave not appear Does the sine wave appear at U600 ? Change the U600 Does the sine wave appear Change the main board...
  • Page 115 4. TROUBLE SHOOTING B SIDE C620,C621 U600 U600 B SIDE OUT601,OUT602 - 116 -...
  • Page 116 4. TROUBLE SHOOTING Measured 1khz Sine Wave Signal - 117 -...

  • Page 117: Microphone

    4. TROUBLE SHOOTING 4.11.3. Microphone (Voice call, Voice Recorder, Video Recorder) • • Microphone Signal Flow - MIC is enable by MIC Bias - CCO, MIC1P, MIC1N signals to ABB ( Vincenne2 ) • • Check Points - Microphone bias - Audio signal level of the microphone - Soldering of components •...
  • Page 118 4. TROUBLE SHOOTING START Check the MIC bias level at the pad of MIC Check the signal level Is the level of MIC+ AND MIC- at C601 at the putting 2.4Volt ? Audio signal in MIC Resolder C601,C602, R600 A few hundred of mV and try again.
  • Page 119 4. TROUBLE SHOOTING B SIDE C601,C602 B SIDE R601 R600 - 120 -...
  • Page 120 4. TROUBLE SHOOTING Measured Some Noise Signal - 121 -...

  • Page 121: Headset Receiver

    4. TROUBLE SHOOTING 4.11.4. Headset Receiver (Voice call, Video Telephony,MP3 ) START Connect the phone to network Equipment and setup call Setup 1KHz tone out Insert Headset. Does the level of R605 Does the Headset icon display under 0.5Volt ? on the main LCD? Does the level of R603 over 2.0Volt ?

  • Page 122: Headset Mic

    4. TROUBLE SHOOTING 4.11.5. Headset MIC(Voice call, Video Telephony ) START Insert Headset. Does the level of R605 Does the Headset icon display under 0.5Volt ? on the main LCD? Does the level of R603 over 2.0Volt ? Check the signal level at R603 at the putting Change the main B,d Audio signal in MIC...

  • Page 123: Headset

    4. TROUBLE SHOOTING 4.11.6. Headset R605 CN600 CN600 R679,R680 C622,C625 2,4,5 R603 C620,C621 C603 U600 - 124 -...

  • Page 124: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.12 Charger Trouble Shooting 05.09.07 BATTERY TEMP SENSOR MOVE FROM BOARD TO BATTERY VBAT_TEMP B_DATA DCIN_3 DCIO CH_REG CHSENSE+ R599 CHSENSE- VDIG27 270K_1% VDD_ADC R546 DIG_VDD VDD_CODEC 2012 VDD_BEAR C531 C532 C533 VCORE15 0.1u 0.1u VDDE18 VDD_IO VDD_IO_18 Q500 SI7411DN-T1-E3...
  • Page 125 4. TROUBLE SHOOTING start start Check the pin and battery Check the pin and battery connect terminals of I/O connect terminals of I/O connector connector Connection OK? Connection OK? Change I/O connector Change I/O connector Change TA Change TA Is the TA voltage 4.6V? Is it charging properly Is it charging properly after changing Q500?
  • Page 126 4. TROUBLE SHOOTING Fig. 15. Main Board - I/O connector and FET - 127 -...

  • Page 127: Checking Bluetooth Block

    4. TROUBLE SHOOTING 4.13 Checking Bluetooth Block <Bottom view> <Top view> start 1. Check Vincenne2 Block 2. Check BT Chip Block - 128 -...
  • Page 128 4. TROUBLE SHOOTING <Bottom view> <Top view> Bluetooth Antenna (ANT800) VRTC13 (R534) VBT27 (R526) MCLK (C828) RTCCLK(R711) VBT27 (C832) VBT18 (C837) VBT18 (R528) Bluetooth chip Output (L800) VRTC13 (R818) <Bluetooth Chip Block> <Vincenne2 Block> - 129 -...

  • Page 129: Checking Vincenne2 Block

    4. TROUBLE SHOOTING 4.13.1 Checking Vincenne2 Block VRTC13 (R534) VBT27 (R526) VBT18 (R528) voltage level at Check About Check Vincenne2 (U503) VBT27 (R526) 2.85V? with Oscilloscope About Check Vincenne2 (U503) voltage level Check 1.8V? VBT18 (R528) with Oscilloscope About Check Vincenne2 (U503) voltage level Check 1.3V?

  • Page 130: Checking Bluetooth Block

    4. TROUBLE SHOOTING 4.13.2 Checking Bluetooth Block Bluetooth Antenna (ANT800) E5515C 8960 setting -Center Frequency => 2441MHz -Span =500kHz MCLK (C828) RTCCLK(R711) VBT27 (C832) VBT18 (C837) Bluetooth chip Output (L800) VRTC13 (R818) voltage level at Check 2.85V, (C832), VBT18(C837) VBT27 1.8V, Check Vincenne2 Block VRTC13(C837) with...

  • Page 131: Rf Component

    4. TROUBLE SHOOTING 4.14 RF Component N401 Z301 N301 Z201 Z400 B301 Z202 Z401 N201 N102 B201 Figure 4-1. RF component (Top) Reference Description Reference Description N201 WCDMA Receiver Z400 GSM TX Balun N301 WCDMA Transmitter Z401 DCS TX Balun N401 GSM Transceiver Z201...
  • Page 132 4. TROUBLE SHOOTING N101 N400 W101 N103 V101 N304 N303 N302 Figure 4-2. RF component (Bottom) Reference Description Reference Description N101 Front End Module N304 DC / DC Convertor N103 Duplexer N400 GSM/DCS/PCS PAM N302 WCDMA PAM V101 Transistor,BJT N303 Isolator W101 Test connector...

  • Page 133: Procedure To Check

    4. TROUBLE SHOOTING 4.15 Procedure to check start Oscilloscope setting 1. Check Power Source Block 2. Check VCXO Block 3. Check Ant. SW Module Agillent 8960 : Test mode(WCDMA) Ch. 9750 (Uplink) Ch. 10700 (Downlink) 4. Check WCDMA Block Agillent 8960 : Test mode(GSM) Ch.

  • Page 134: Checking Common Power Source Block

    4. TROUBLE SHOOTING 4.16 Checking Common Power Source Block Step 2 GSM PAM Block Power Source Block Step 3 WCDMA PAM Block Vincenne 2 Step 1 Regulator Block (Bottom) (Top) Figure 4-3. Common Source Block - 135 -...
  • Page 135 4. TROUBLE SHOOTING 4.16.1 Step 1 Check point (C622,C625) R522 Check VBATI R546 BH28MA3WHFV (C107) Figure 4-4. Step 1 : Regulator Block Figure 4-5. Power Source Block Step 1 3.7V Check Point (C625) in Power Source Block To Check Power source to Check if Proceed to the Step 2 main power source...
  • Page 136 4. TROUBLE SHOOTING 4.16.2 Step 2 VBATI (C402) GSM PAM (Top) Figure 4-6. Step 2 : GSM PAM Block Step 2 Check VBATI (C402) 3.7V in GSM PAM Block to Check if main power source input or not Proceed to the Step 3 Check Point (C622) 3.7V OK? Check The PowerSupply...
  • Page 137 4. TROUBLE SHOOTING 4.16.3 Step 3 VccC27 (R315) Check Point (C622) R522 WCDMA R546 Figure 4-7. Step 3 :WCDMA PAM Block Figure 4-8. PAM Power Source Step 3 3.7V Check VccC27 (R315) in WCDMA PAM Block See the Next Page Check Point (C622) 3.7V Check the PowerSupply...
  • Page 138 4. TROUBLE SHOOTING 4.16.4 Checking VCC Vincenne 2 VDDA VDDB (R515) (R514) (Bottom) Figure 4-9-1. Power for Radio ASIC VRF27 Tilde(N401) VPLL27 VVCO27 VBUFF27 Wopy(N201) VccB27 VccB_1 R515 VDD_A VDD_B EXT_LDO EXTLDO_1 C503 C504 1608 1608 Figure 4-9-2. Schematic (Power) 2.75V Check Point Check the Vincenne2...
  • Page 139 4. TROUBLE SHOOTING 4.16.5 Checking Regulator Part EXTLDO_1 (R102) BH28MA3WHFV Regulator VccC27 (R104) Figure 4-10. Regulator Block(Top) >>VccB_1 VBATI >> >> VccC27 EXTLDO_1 >> Figure 4-11. Schematic (Regulator Block) Check Point (R104) 2.8V High Change the Board Point To Check Regulator OK ? Output Voltage Check EXTLDO_1...

  • Page 140: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.17 Checking VCXO Block The reference frequency (13MHz) from B201 (Crystal) is used WCDMA TX part and BB part. Therefore, 3 test points in the following figure should be checked. Check 2 Check 3 Check 1 Figure 4-12. Top Place Notebook to send TP command Oscilloscope...
  • Page 141 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1 B201.3 Figure 4-14-1. Test Point (Crystal Part) XOIA C235 C234 R209 R210 VCXOCONT 330p C229 C230 V201 C241 B201 4.7p 0.01u BBY58-02W TSX-8A C240...
  • Page 142 4. TROUBLE SHOOTING Check 2. 13MHz at TX part N301.B1 N301.C1 Figure 4-16-1. Test point (13MHz at TX part) TP305 TP306 C324 C325 0.01u XOOA XOOB TP304 TP303 TP302 TP301 TXQB QINBAR TXQA IINBAR TXIB TXIA N301.B1 N301.C1 Figure 4-16-2. Schematic (13MHz at TX part) Figure 4-17.
  • Page 143 4. TROUBLE SHOOTING Check 3. 13MHz at BB part N201.C7 Figure 4-18. Test point (13MHz at BB part) RXIB MCLK_W R260 L202 MCLK_W_BT C208 120p C209 0.01u N201.c7 C206 C207 0.01u 0.01u R205 VccB27 C233 C235 C234 R209 R210 VCXOCONT 330p C229 C230...
  • Page 144 4. TROUBLE SHOOTING VCXO part has a problem. Check B201.3 Checking 1 Changing B210 13MHz at VCXO Refer to Figure 4-15 Check N301.B1 & C1 N301 has any problem. Checking 2 Refer to Figure 4-17 Changing RF board 13MHz at TX part Check N201.C7 N201 has any problem.

  • Page 145: Checking Front End Module Block

    4. TROUBLE SHOOTING 4.18 Checking Front End Module Block D1032 ANTSW0 ANTSW2 ANTSW1 Figure 4-21. Front End Module Block (Bottom) R108 GND6 GND2 N101 GND1 D1032 GND5 GND4 GND3 VccC27 C109 PEMD13 V101 GSM_Tx DCSPCS_Tx GSM_RX_P GSM_RX_N PCS_RX_P PCS_RX_N DCS_RX_P DCS_RX_N L117 ANTSW0_27...

  • Page 146: Checking Front End Module Block Input Logic

    4. TROUBLE SHOOTING 4.19 Checking Front End Module Block input logic 4.19.1 Mode Logic by TP Command WCDMA EGSM Tx High ANTSW0_27 ANTSW1_27 ANTSW2_27 High High DCS Rx & EGSM RX DCS/PCS Tx ANTSW0_27 ANTSW1_27 High ANTSW2_27 High PCS Rx ANTSW0_27 ANTSW1_27 ANTSW2_27...
  • Page 147 4. TROUBLE SHOOTING Band ANTSW0 ANTSW1 ANTSW2 ANTSW3 EGSM Tx EGSM Rx DCS Tx DCS Rx PCS RX WCDMA Table 4-1. Front End module Logic - 148 -...

  • Page 148: Checking Switch Block Power Source

    4. TROUBLE SHOOTING 4.19.2 Checking Switch Block power source Before Checking this part, must check common power source(through Vincenne 2) part TP Command MODE=0 SWRX=64,1024,2 Check Soldering Open? It is necessary to check short condition. Using Tester. Check 3 bead & 1 capacitor Check soldering ANTSW0(L117),ANTSW1(L116) (L117)
  • Page 149 4. TROUBLE SHOOTING A. EGSM Rx mode EGSM Rx MODE=0 SWRX=64,1024,2 ANTSW0_27 ANTSW1_27 ANTSW3_27 Figure 4-22. EGSM Rx Mode EGSM Rx 4.17 part Check Try 4.17 part Logic OK? See the Next mode Change the Board (EGSM Tx Mode) - 150 -...
  • Page 150 4. TROUBLE SHOOTING B. EGSM Tx mode EGSM Tx MODE=0 SWTX=1,64,7,1024,1 ANTSW0_27 High ANTSW1_27 High ANTSW3_27 Figure 4-23. EGSM Tx Mode EGSM Tx 4.17 part Check Try 4.17 part Logic OK? See the Next mode ANTSW0:High (DCS Tx Mode) ANTSW1:Low Change the Board ANTSW2:High WON : Low...
  • Page 151 4. TROUBLE SHOOTING C. DCS Rx mode DCS Rx MODE=2 SWRX=699,1024,2 ANTSW0_27 ANTSW1_27 ANTSW3_27 Figure 4-24. DCS Rx Mode DCS Rx 4.17 part Check Try 4.17 part Logic OK? See the Next mode Change the Board (DCS Tx Mode) - 152 -...
  • Page 152 4. TROUBLE SHOOTING D. PCS Rx mode PCS Rx MODE=1 SWRX=661,1024,2 ANTSW0_27 ANTSW1_27 High ANTSW3_27 Figure 4-25. PCS Rx Mode PCS Rx 4.17 part Check Try 4.17 part Logic OK? See the Next mode Change the Board (PCS Tx Mode) - 153 -...
  • Page 153 4. TROUBLE SHOOTING E. DCS / PCS Tx mode DCS / PCS Tx MODE=2 SWTX=1,699,0,1024,1 ANTSW0_27 ANTSW1_27 High ANTSW3_27 High Figure 4-26. DCS / PCS Tx Mode DCS Tx 4.17 part Check Try 4.17 part Logic OK? WCDMA Mode Change the Board - 154 -...
  • Page 154 4. TROUBLE SHOOTING F. WCDMA mode WCDMA Mode MODE=4 WTXC=9 75 0,0,1,0 SYCT=107 00 TXGN=1,4 3 ANTSW0_27 ANTSW1_27 ANTSW3_27 High Figure 4-27. WCDMA Mode WCDMA 4.17 part Check Try 4.17 part Logic OK? Input Signal and Power to Change the Board Front End Module block is OK.

  • Page 155: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.20 Checking WCDMA Block start 1. Check VCXO Block 2. Check Front End Module Bottom View 3. Check Control Signal 4. Check RF TX Level 5. Check PAM Block 6. Check RX IQ 7. Check Top View RF RX Level Redownload SW, Cal - 156 -...

  • Page 156: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.20.1 Checking VCXO Block Refer to 4.17 4.20.2 Checking Ant. SW module Refer to 4.18 4.20.3 Checking Control Signal First of all, control signal should be checked. (data, clk, strobe) TP201(CLK) TP202(DAT) TP203(STROBE) Figure 4-28-1. Test points (Control Signal) - 157 -...
  • Page 157 4. TROUBLE SHOOTING MIXINA MIXINB GNDBIAS GNDEME C217 C222 N201 WCDMA_RX RFIN LZT-108-5323 GNDBYP VCCRF GNDIF L206 DATA 2.7nH L207 STROBE 4.7nH GLNA C219 C218 1.2p 1.2p Z202 B7849 C214 L204 2.7nH R207 5.6K C226 TP202 TP201 TP203 390p WDAT WCLK WSTR_27 Figure 4-28-2.
  • Page 158 4. TROUBLE SHOOTING TP203(STROBE) TP201(DATA) TP202(CLK) TP203(STROBE) TP201(DATA) TP202(CLK) Figure 4-30. Control Signal TP Command MODE=4 WTXC=9750,0,1,0 SYCT=10700 TXGN=1,43 Check TP201,TP202 TP203. Check shape and pk-pk level Similar ? Download the SW Refer to Figure 4-30 If signal is not OK even after downloading, Change the U801 Control Signal is O.K.

  • Page 159: Checking Rf Tx Level

    4. TROUBLE SHOOTING 4.20.4 Checking RF TX Level Check 3 N103.Ant Check 1 W101 Check 2 N101.7 FEM Output Check 6 N302.2 PAM Input Check 4 Check 5 N303. N303.Isolator Input Isolator Output Figure 4-31. Test point (RF TX Level) Notebook to send TP command Spectrum Analyzer...
  • Page 160 4. TROUBLE SHOOTING Fig. 4-33-1 Output Level at RF Fig. 4-33-2 Output Level at FEM Output test connector (W101) (N101.7 , C103) Fig. 4-33-3 Output Level at N103.Ant Fig. 4-33-4 Output Level at Isolator Output (N303.Out ) - 161 -...
  • Page 161 4. TROUBLE SHOOTING Fig. 4-33-5 Output Level at Isolator Fig. 4-33-6 Output Level at PAM Input Input (N303. In) ( N302.2) Fig. 4-33-7 Output Level at Wivi Output (N301.K2;K3) - 162 -...
  • Page 162 4. TROUBLE SHOOTING To verify that the phone fulfils requirments on maximum output power. TP Command MODE=4 Set the FDD Test of the Agillent 8960 WTXC=9750,0,1,0 Set the Maximum Power SYCT=10700 TXGN=1,43 TFTI=10700 Check output power at Check 1 the W101 with antenna RF TX Level is OK About 23dBm? Cable.

  • Page 163: Checking Pam Block

    4. TROUBLE SHOOTING 4.20.5 Checking PAM Block (Bottom) VCCWPA (C326) from DC/DC WDCDCREF (C329) DC/DC converter WCDMA Duplexer Output (C108) WPAM WPAREF input (C333) Figure 4-34. Test points of WCDMA TX PAM block - 164 -...
  • Page 164 4. TROUBLE SHOOTING TP Command -mode =4 -wtxc = 9750,1,1,43,0,0,197,117 Check Duplex output Level Download the SW (C108) 23dBm ? < - & Calibrate To Check PAM 10dBm? output CDMA PAM is OK See the Next page Check L313(Top) Level Check the WCDMA RF Tx Chip(Wivi) >2dBm To Check PAM Input...

  • Page 165: Checking Rx I,Q

    4. TROUBLE SHOOTING 4.20.6 Checking RX I,Q To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q. N201.A7 (RXQA) C210 N201.A8 (RXQB) C211 N201.A9 (RXIA) C231 N1400.A10 (RXIB) C232 Figure 4-35. WCDMA RF RX IC (Top) About 2 MHz Feed a CW signal at 2142MHz with a power level of ñ60dBm.
  • Page 166 4. TROUBLE SHOOTING N201.A7 (RXQA) C210 N201.A8 (RXQB) C211 N201.A9 (RXIA) C231 N201.A10 (RXIB) C232 Figure 4-36-3. RX I, Q signal Set the CW Mode of the Agillent TP Command 8960 MODE=4 Feed a CW signal at 2141MHz WRXC=10700 Set the RX Continuous mode Check the pk-pk level at N201.A7~A10 with About 120mVp-p?

  • Page 167: Checking Gsm Block

    4. TROUBLE SHOOTING 4.21 Checking GSM Block start 1. Check Regulator Circuit 2. Check VCXO Block 3. Check FEM Module Figure 4-37-1. GSM Block (Top) 4. Check Control Signal 5. Check RF TX Path 6. Check RF RX Path Figure 4-37-2. GSM Block (Bottom) Redownload SW, Cal - 168 -...

  • Page 168: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4.21.1 Checking Regulator Circuit Refer to 4.16 Checking Power Source block IF you already check this point while checking power source block (4.15), You can skip this test. 4.21.2 Checking VCXO Block Refer to 4.17 Checking VCXO block IF you already check this point while checking VCXO block (4.17), You can skip this test.

  • Page 169: Checking Control Signal

    4. TROUBLE SHOOTING 4.21.4 Checking Control Signal Test Program Script MODE=0 SWTX=1,64,7,1024,1 TXON VRF27 VPLL27 (L414) (C426) (C433) LPF block block VTUEN (C432) RADSTR RADDAT RADCL (TP405) (TP406) K(TP404) < Bottom > < Top > Figure 4-38. Test points of RF control signals TXON TXON Vtune...
  • Page 170 4. TROUBLE SHOOTING Check TP404,TP405,TP406. Check if there is any Major difference. Refer to left side of Figure 4-38 Similar? Short? Redownload SW Change the board Check L414,C432. Check if there is any Major difference. Refer to right side of Figure 4-38 Similar? Short? Resoldering VDD block...

  • Page 171: Checking Rf Tx Path

    4. TROUBLE SHOOTING 4.21.5 Checking RF Tx Path A. GSM Tx path Level Figure 4-40. GSM/DCS/PCS Tx Path Level - 172 -...
  • Page 172 4. TROUBLE SHOOTING N400 (Bottom) N401 Z400 Z401 (Top) Figure 4-41. Test Points of GSM/DCS/PCS Tx Path - 173 -...
  • Page 173 4. TROUBLE SHOOTING B. GSM Tx Output Level Check Figure 4-42. GSM/DCS/PCS Tx Level at Test Program Script 1. GSM Tx 2. DCS Tx 3. PCS Tx MODE=2 MODE=1 MODE=0 SWTX=1,699,0,1024,1 SWTX=1,661,0,1024,1 SWTX=1,64,5,1024,1 v Agilent 8960 Setting : GSM BCH+TCH Mode v Oscilloscope Setting Check GSM/DCS/PCS output power at Check if there is any Major difference.
  • Page 174 4. TROUBLE SHOOTING C. GSM RF Transceiver IN/OUT Signal Check MODD MODC MODB MODA (R402) (R405) (R406) (R407) DCS/PCS Tx (R409) N401 MODA GSM Tx (L401) MODB Z401 Z400 DCS/PCS Tx GSM Tx (L409) (R412) Figure 4-43. GSM/DCS/PCS Tx MODE signal Check Mode(A/B/C/D)signal at Similar? Resoldering MODE block...
  • Page 175 4. TROUBLE SHOOTING D. GSM PAM Check N400 GSM Tx (C417) DCS Tx (C411) Vapc (R403) Figure 4-44-1. Test points of DCS/PCS Tx TXON TXON Vapc (GSM) Vapc (DCS/PCS) Figure 4-44-2. GSM Tx control signal Figure 4-44-3. DCS/PCS Tx control signal Check Vapc level.

  • Page 176: Checking Rf Rx Path

    4. TROUBLE SHOOTING 4.21.6 Checking RF Rx Path A. GSM Rx path Level Figure 4-45. GSM/DCS/PCS Rx Path Level - 177 -...
  • Page 177 4. TROUBLE SHOOTING N401 (Top) (Bottom) Figure 4-46. Test Points of DCS/PCS Tx Test Program Script 1. GSM Rx 2. DCS/PCS Rx MODE=0 MODE=2(DCS),1(PCS) SWRX=1,64,5,1024,1 SWRX=1,699,0,1024,1 v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz) v Oscilloscope Setting - 178 -...
  • Page 178 4. TROUBLE SHOOTING B. GSM I/Q Signal Check I Data N401 DCLK (TP403) Q Data Qdata DCLK (TP402) Idata (TP401) Figure 4-47. Tilde IQ data and DCLK v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz) v Oscilloscope Setting Check GSM/DCS/PCS Rx IQ data at...
  • Page 179 4. TROUBLE SHOOTING C. GSM RF Level Check N401 PCS RX DCS RX Figure 4-49. GSM/DCS/PCS Rx path v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz) Check GSM/DCS/PCS Rx GSM:-51.5dBm Change Ant. SW module signal level at DCS/PCS:-51.5dBm (N1000)

  • Page 180: Download

    - FlashRW : Download tool for U400 software 5.2 Download Environment Setup EMP : USB Cable Cable Phone Cable USB Cable QCT : USB Cable U400 Phone Cable Phone Cable Figure 5-2-1. U400 Download can be done via USB - 181 -...

  • Page 181: U400 Download

    5. Download 5.3 U400 Download 5.3.1. U400 Download(1) - Phone Model Selection A. Execute “../USB01/FlashRW01.exe” B. Press Button for Model. C. Select Model U400. - 182 -...

  • Page 182: U400 Download(2) - Flashrw Configuration

    5. Download 5.3.2. U400 Download(2) - FlashRW configuration. A. Press the “Global Settings” on the top menu to configure FlashRW environment. - 183 -...
  • Page 183 5. Download B. Select Loader File for Product. You can use browse button to select Loader File. You must select only CXC1329129_R3D_54_red.ldr for U400. Loader File is provided with FlashRW. C. Select Port configurations for USB Port. USB port should be selected the USB1.

  • Page 184: U400 Download(3) - Download File Selection

    5. Download 5.3.3. U400 Download(3) - Download file selection A. Press “Add” button to select LGE SSW files to download. B. If you want to download image, you must copy files (main image & filesystem image) in “../USB01/Download_Data01/Image01” folder. This “Add1” button will be used for upgraded if needed. Only When LGE propose this action, you must press this button.

  • Page 185: Download

    5. Download 5.3.4. U400 Download(4) - Connect & Download A. Click on connector icon( ) to connect to the phone Check the Dialog Box that say “Please,switch on the target”. B. Connect the phone to PC via Cable for Downloading.

  • Page 186: U400 Download(5) - Usb Driver Install

    5. Download 5.3.5. U400 Download(5) - USB Driver Install A. If you use FlashRW Tool firstly, Error will happen because of USB Driver uninstalled. You have to do FlashRW USB Driver Installation only at the first time of installation 1 step : go to the directory = ../Platform_Assistant_USB_Driver/wrapper_USBDriver 2 step : click “erasedrv.exe”...
  • Page 187 5. Download C. Select “Search for the best driver in these locations” in Found New Hardware Wizard D. Select “Include this location in the search” in Found New Hardware Wizard E. Push “the Browse Button” , and then select “USB driver Information file” This File is provided with FlashRW.
  • Page 188 5. Download F. Select “Mobile Equipment USB Flash” in Found New Hardware Wizard You must be select this..! G. Continue Anyway - 189 -...
  • Page 189 5. Download H. Please wait while the wizard installs the software.. I. Push “the Finish Button” in Found New Hardware Wizard - 190 -...
  • Page 190 K. Remove & Insert Main battery to reset the phone This action for USB Driver Install is done only at the first time of installation If you want to download Software, just do as same as U400 Download (4) - Connect & Download says...

  • Page 191: Trouble Shooting

    5. Download 5.3.6. U400 Download(6) - Trouble shooting Check these questions when trouble happens. A. Check if USB Port configuration is right, Model is right. B. Check if battery gauge is full. C. Check if file path is right. D. Check if USB driver is right.

  • Page 192: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block UMTS UMTS IF Filter UMTS RF Filter Z201 Z202 Duplexer N103 U MTS R eceiver Antenna N201(Wop y ) U801 Wanda UMTS PAM Isolator N302 UMTS TX Filter Test Conn .

  • Page 193: Calibration

    6. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment Common N101 D1032 Front End Module Band select W101 KMS-512 Test Connector Calibration, etc B201 TSX-8A Crystal Reference -13M WCDMA N103 DFYY61G95LANAD-TT1 Duplexer N201 LZT-108-5323(WOPY) Receiver Z202 B7849 RX RF Filter Z201 TMX-W503 RX IF Filter...
  • Page 194 R102 EXTLDO_1 STBY PPAD C107 4.7u C106 C105 4.7u 33nF Engineer: Engineer: LG ELECTRONICS INC. JS Joo Mobile Handsets R&D Center Drawn by: Drawn by: HW Group, Develpment Lab 6 JS Joo R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: NEO-MAIN-1.2...
  • Page 195 C239 C237 FROM MARIKA SIDE FOR POWER SAVING 0.1u 0.1u U201 ST1G3234BJR WSTR WSTR_27 Engineer: LG ELECTRONICS INC. JS Joo Mobilehandsets R&D Center Drawn by: HW Group, Development Lab 6 JS Joo R&D CHK: Size: TITLE: NEO-MAIN-1.2 DOC CTRL CHK:...
  • Page 196 R302 R306 4.7K R303 C316 C303 VccC27 150p 3300p WTXON Engineer: LG ELECTRONICS INC. JS Joo Mobile Handsets R&D Center Drawn by: JS Joo HW Group, Development Lab 6 R&D CHK: TITLE: Size: U400-MAIN-1.2 DOC CTRL CHK: 12 1 8 A...
  • Page 197 MCLK_W RADDAT R421 MCLK RADSTR TP404 TP405 TP406 V401 SI8402DB CLKREQ Engineer: LG ELECTRONICS INC. JS Joo Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6 JS Joo R&D CHK: Size: TITLE: NEO-MAIN-1.2 DOC CTRL CHK: GSM/DCS (Tilde)
  • Page 198 SW_BOOST VREF BOOST_ISENSE+ IREF BOOST_ISENSE- C539 V_BOOST 0.1u C540 BOOST_FB+ 0.1u Engineer: LG ELECTRONICS INC. Sung Ju, You DEVELOPMENT 6 Drawn by: HARDWARE GROUP Sung Ju, You R&D CHK: Size: TITLE: ABB & Regulator DOC CTRL CHK: NEO-MAIN-1.2 MFG ENGR CHK:...
  • Page 199 CBYPASS R693 R694 C626 2.2u 1608 C628 C627 0.068u 0.068u VINCENNE2 AUDIO INTERFACE Engineer: LG ELECTRONICS INC. Sung Ju, You DEVELOPMENT 6 Drawn by: HARDWARE GROUP Sung Ju, You R&D CHK: Size: TITLE: BL & AUDIO DOC CTRL CHK: NEO-MAIN-1.2...
  • Page 200 TP713 05.11.23 Change the voltage source from VDDG27 to VDIG27 NF_CLE TP714 NF_ALE TP715 NF_WE_N NF_RE_N NF_D(0:7) Engineer: LG ELECTRONICS INC. Sung Ju, You DEVELOPMENT 6 Drawn by: Sung Ju, You HARDWARE GROUP R&D CHK: TITLE: Size: DOC CTRL CHK: NEO-MAIN-1.2...
  • Page 201 VSS_ANA3 VDD_HV_D VDD_DSM VDD_N VDD_CL AF_PRG VDD_RF BLUETOOTH 05.08.31 Replace STLC2500B0 with STLC2500B1 Engineer: LG ELECTRONICS INC. Sung Ju, You DEVELOPMENT 6 Drawn by: Sung Ju, You HARDWARE GROUP R&D CHK: Size: TITLE: MEMORY, BT & WANDA DOC CTRL CHK: NEO-MAIN-1.2...
  • Page 202 BATT CON USBDP UTXD USBDM URXD KNATTE2 VBUS 05.08.31 Replace IP4024CX20-LF with KNATTE2F2 VBAT VBAT Engineer: KEYOUT3 LG ELECTRONICS INC. CTS_ON ON_SW ON_SW Sung Ju, You VPPFLASH_e UFLS DEVELOPMENT 6 Drawn by: Sung Ju, You HARDWARE GROUP UART R&D CHK:...
  • Page 203 DEVELOPMENT GROUP 5 R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: DOC CTRL CHK: DOC CTRL CHK: U400 KEY PCB Rev.E MFG ENGR CHK: MFG ENGR CHK: Changed by: Changed by: Date Changed: Date Changed: Time Changed: Time Changed: QA CHK:...

  • Page 204: Circuit Diagram

    8. pcb layout - 205 -...
  • Page 205 8. pcb layout - 206 -...
  • Page 206 8. pcb layout - 207 -...
  • Page 207 8. pcb layout - 208 -...

  • Page 208: Calibration

    9.1 General Description This document describes the construction and the usage of the software used for the calibration of LG’s GSM/GPRS/WCDMA Multimedia Mobile Phone (U400). The calibration menu and its result is displayed in PC terminal by Mobile phone. This calibration software includes GSM, DCS, PCS, WCDMA Band RF parts calibration and Battery calibration.

  • Page 209: Calibration Explanation

    9. CALIBRATION 9.3 Calibration Explanation 9.3.1 Overview In this section, it is explained each calibration item in the XCALMON. Also the explanation includes technical information such as basic formula of calibration and settings for key parameters in each calibration procedure. At first, when any of calibration is done, the results are displayed in the XCALMON result window and the result of calibration will be stored in GDFS(Global Data Flash Storage).

  • Page 210: Egsm 900 Calibration Items

    9. CALIBRATION E. Baseband Calibration - Battery Calibration 9.3.3 EGSM 900 Calibration Items A. VCO Varactor Operating Point Calibration To adjust the VCO varactor diode to a pre-determined operating point, via the Ericsson RF 2001 CVCO setting, so that the loop voltage of the VCO is within a valid range for each band. This is necessary to ensure that for each band all the channels can be covered.

  • Page 211: Dcs1800 Calibration Items

    9. CALIBRATION 9.3.4 DCS1800 Calibration Items A. TX Loop Bandwidth Calibration The PLL loop bandwidth of Ericsson RF 2001 is calibrated to match the pre-filtering of the modulation in Ericsson DB 2012 by adjusting its phase detector current. This will ensure that the RMS phase error of the ME is kept to a minimum.

  • Page 212: Pcs1900 Calibration Items

    9. CALIBRATION 9.3.5 PCS1900 Calibration Items A. TX Loop Bandwidth Calibration The PLL loop bandwidth of Ericsson RF 2001 is calibrated to match the pre-filtering of the modulation in Ericsson DB 2012 by adjusting its phase detector current. This will ensure that the RMS phase error of the ME is kept to a minimum.

  • Page 213: Wcdma Calibration Items

    9. CALIBRATION 9.3.6 WCDMA Calibration Items A. RF VCO Center Frequency Calibration This procedure is designed to calibrate the center frequency of the Radio Frequency Voltage Controlled Oscillator (RFVCO) in the WCDMA receiver, Ericsson RF 2110. It also checks that all channels can be reached with sufficient margin.

  • Page 214: Baseband Calibration Items

    GLNA=0 and GLNA=1; that is, it establishes the gain difference in the LNA between HG mode and LG mode. It also calibrates AGC_UL and AGC_LL and the upper and lower Ak values where the AGC should switch between high and low LNA gain (AGC hysteresis). LBW and LPQ and must be calibrated before and applied to this calibration.

  • Page 215: Program Operation

    9.4 Program Operation 9.4.1 XCALMON Program Overview When try to calibrate the U400 mobile phone, the service engineers make a configuration of calibration environment like Figure9-1. And if you finish making configuration, please execute the XCALMON program. Running the XCALMON program, you should show XCALMON program window like Figure9-2.

  • Page 216: Xcalmon Icon Description

    When you click the calibration window icon ”C”, then you should see the calibration tree window. That will be shown all calibration items. If you want to calibrate U400 mobile phone for all calibration items, you should select “Calibration” and push “F4” button in your keyboard.
  • Page 217 9. CALIBRATION Figure 9-4. XCALMON Calibration Tree Window (OUTPUT Tab) Figure 9-5. XCALMON Calibration Tree Window (INSTRUMENT Tab) - 218 -...
  • Page 218 C. ITP Starting Window Using Production Loader When click the ITP starting window icon”L”, then find out the ITP starting window. That dialog window just wait for power-on of U400 mobile phone. When it will occur power-on, it automatically start ITP running.

  • Page 219: Calibration Procedure

    Click the “L” icon, then you will see the ITP start window like Figure9-7. When you will turn on the U400 mobile phone, the production loader will be downloaded automatically like Figure9-8 and then it will execute the ITP at once.
  • Page 220 9. CALIBRATION Figure 9-8. Production Loader Downloading Figure 9-9. ITP Start Complete Window - 221 -...

  • Page 221: Calibration Result Message

    9. CALIBRATION C. Calibration Start Using XCALMON If you want to calibrate U400 mobile phone, click the calibration icon “C”. And then you will see the calibration tree window like Figure9-4. To start calibration, you should select “Calibration” item and push “F4” button in your keyboard.
  • Page 222 9. CALIBRATION Figure 9-11. Calibration FAIL Message Window Figure 9-12. Calibration Result from OUTPUT Tab View - 223 -...
  • Page 223 - 224 -...
  • Page 224 10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW - 225 -...
  • Page 225 - 226 -...

  • Page 226: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part <Mechanic component> order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark IMT-2000(SLIDE) TISL0000202 Black AAAY00 ADDITION AAAY0178704 Black...
  • Page 227 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark ACGQ00 COVER ASSY,SLIDE ACGQ0008301 Black ABGA00 BUTTON ASSY,DIAL ABGA0006101 ABGB00 BUTTON ASSY,FUNCTION ABGB0003201 ACGK00 COVER ASSY,FRONT ACGK0064701 Black MBJL00 BUTTON,SIDE MBJL0028401 MBJL01 BUTTON,SIDE MBJL0028501 MBJN00 BUTTON,VOLUME MBJN0007401 MCCE00...
  • Page 228 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MFBB00 FILTER,RECEIVER MFBB0014101 Black MIAA00 INDICATOR,LED MIAA0017101 MICC00 INSERT,FRONT(UPPER) MICC0010001 D2.2 L2.0 KURL 45 Gold MLAN00 LABEL,QUALCOMM MLAN0000603 White,95C Transparent MPBG00 PAD,LCD MPBG0040301 Black MPBJ00 PAD,MOTOR MPBJ0029601 DIA 9...
  • Page 229 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCH00 CAP,SCREW MCCH0081401 MOLD, Silicone Rubber K-770, , , , , Black MLAK00 LABEL,MODEL MLAK0006901 MPBZ00 MPBZ0150101 MOLD, Silicone Rubber K-770, , , , , White ADCA00 DOME ASSY,METAL...

  • Page 230: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order <Main component> is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SNGF00 ANTENNA,GSM,FIXED SNGF0017601 3.0 ,-2.0 dBd, ,internal, GSM900/1800/1900/WCDMA2100 SUSY00 SPEAKER SUSY0022601...
  • Page 231 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark ADCA00 DOME ASSY,METAL ADCA0052901 SAEE00 PCB ASSY,KEYPAD,SMT SAEE0016801 PCB ASSY,KEYPAD,SMT SAEC SAEC0014901 BOTTOM C103 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C104 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C105...
  • Page 232 ERHZ00 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP SPCY00 PCB,FLEXIBLE SPCY0062401 POLYI ,0.15 mm,DOUBLE ,F-CAMERA SPKY00 PCB,SIDEKEY SPKY0025201 POLYI ,0.2 mm,DOUBLE ,U400 SIDEKEY FPCB SPKY01 PCB,SIDEKEY SPKY0027101 POLYI ,0.2 mm,DOUBLE ,CAMERA SIDEKEY FPCB SAFF00 PCB ASSY,MAIN,SMT SAFF0080304 MLAB00 LABEL,A/S MLAB0000601...
  • Page 233 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAZ00 LABEL MLAZ0038301 PID Label 4 Array PCB ASSY,MAIN,SMT SAFC00 SAFC0072101 BOTTOM ANT800 ANTENNA,GSM,FIXED SNGF0012201 3.0 ,-2.0 dBd, ,bluetooth chip C101 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP C103 CAP,CERAMIC,CHIP ECCH0000115...
  • Page 234 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C512 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C513 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C514 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C515 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 235 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C607 CAP,CHIP,MAKER ECZH0003118 560 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C608 CAP,CHIP,MAKER ECZH0003118 560 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C609 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C612 CAP,CERAMIC,CHIP ECCH0000138...
  • Page 236 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C716 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C717 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C718 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C719 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 237 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C812 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C813 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C814 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C815 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 238 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D502 DIODE,SWITCHING EDSY0011901 IR=30uA(VR=10V) SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF , D601 DIODE,TVS EDTY0007601 1.6*1.625*0.58 SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,...
  • Page 239 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 800.1800 ,1900.2000 ,1.4 dB,1.7 dB,35 dB,30 dB,ETC N101 FILTER,SEPERATOR SFAY0005201 ,7.2*5.0*1.8 Size N103 DUPLEXER,IMT SDMY0000901 1950 MHz,2140 MHz,1.5 dB,1.9 dB, dB, dB, ,SMD , 28.5 dBm,44 %,50 mA, dBc,28 dB,4x4x1.1 ,SMD ,EMP N302 SMPY0013701 U250...
  • Page 240 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R517 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP R518 RES,CHIP,MAKER ERHZ0000506 6800 ohm,1/16W ,J ,1005 ,R/TP R519 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R520 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 241 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R605 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R606 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R614 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP R617 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 242 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R901 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R902 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R903 RES,CHIP,MAKER ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP R904 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 243 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U903 EUSY0257901 SOT773-1 ,14 PIN,R/TP ,USB Transceiver SOT666 ,.3 W,R/TP ,NPN/PNP RESISTOR-EQUIPPED / V101 TR,BJT,ARRAY EQBA0003601 R1=4.7K / R2=47K / PB FREE SOT666 ,.3 W,R/TP ,NPN/PNP RESISTOR-EQUIPPED / V301 TR,BJT,ARRAY EQBA0003601...

  • Page 244: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C216 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C217 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C218 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C219 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C220 CAP,CERAMIC,CHIP ECCH0000115...
  • Page 245 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C311 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C312 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C313 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C314 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C315 CAP,CHIP,MAKER ECZH0000813...
  • Page 246 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C433 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C828 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C831 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP C832 CAP,CHIP,MAKER ECZH0001216...
  • Page 247 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L201 INDUCTOR,CHIP ELCH0004903 82 nH,J ,1608 ,R/TP , L202 INDUCTOR,CHIP ELCH0003811 1000 nH,K ,1608 ,R/TP ,COIL TYPE L203 INDUCTOR,CHIP ELCH0004912 39 nH,J ,1608 ,R/TP , L204 INDUCTOR,CHIP ELCH0004708...
  • Page 248 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark N201 EUSY0133001 uBGA ,56 PIN,R/TP ,U8000 RF IC TFBGA ,56 PIN,R/TP ,WCDMA TXIC,Wivi, N301 EUSY0300901 OM5955ET/C3/M1,6x6 Size N401 EUSY0256201 HVQFN48 ,48 PIN,R/TP ,Tilde, GSM Transceiver ASIC. VSM ,0.1 W,R/TP ,1.2*1.2*0.5 Vcbo=20, Vceo=12, Q901 TR,BJT,NPN...
  • Page 249 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R420 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R422 RES,CHIP,MAKER ERHZ0000475 3900 ohm,1/16W ,J ,1005 ,R/TP R707 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R811 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 250 EDTY0007501 SOD-523 ,5 V,240 W,R/TP ,Vc 12.5V , 160pF , 1.6*0.8*.06 ZD904 DIODE,TVS EDTY0007501 SOD-523 ,5 V,240 W,R/TP ,Vc 12.5V , 160pF , 1.6*0.8*.06 SPFY00 PCB,MAIN SPFY0113601 FR-4 ,1.0 mm,STAGGERED-8 , WSYY00 SOFTWARE WSYY0408301 BIN-U400-V10a-July 03 2006-H3G-UK - 251 -...

  • Page 251: Accessory

    SBOM standard on GCSC Location Level Description Part Number Specification Color Remark ADEY00 DATA KIT ADEY0006301 U400 Data kit Assy for H3G MBAZ00 MBAZ0004702 80mm CD Cover MCHZ00 COMPACT DISK MCHZ0025101 COMPLEX, (empty), , , , , MSFG00 STICKER,SEAL MSFG0000801...
  • Page 252 Note - 253 -...
  • Page 253 Note - 254 -...

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