Murata GRM033R60J105MEA2D Reference Sheet

Murata GRM033R60J105MEA2D Reference Sheet

Chip monolithic ceramic capacitor for general

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Chip Monolithic Ceramic Capacitor for General
GRM033R60J105MEA2_ (0201, X5R:EIA, 1uF, DC6.3V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
  
2.MURATA Part NO. System
(Ex.)
GRM
03
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
0.6±0.05
0.3±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Mar.5,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM033R60J105MEA2-02
3
R6
(2)T
(3)Temperature
Characteristics
Dimensions
(2) T
e
0.3±0.05
0.1 to 0.2
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 85 °C
DC 6.3 V
(25 °C)
Packaging Unit
15000 pcs./Reel
30000 pcs./Reel
50000 pcs./Reel
0J
105
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Tolerance
Capacitance
(Unit:mm)
g
0.2 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
1 uF
±20 %
1
Reference Sheet
M
EA2
D
(7)Murata's
(8)Packaging
Control Code
Code
Methods
(Operating
Temp. Range)
-55 to 85 °C

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Summarization of Contents

Scope of Product Specification
Product Specification Application
Specifies application of chip monolithic ceramic capacitor for general electronic equipment.
MURATA Part Number System
Part Number Structure Explanation
Explains the coding system for MURATA part numbers, including dimensions, characteristics, voltage, capacitance, and packaging.
Type and Dimensions
Physical Dimensions of Capacitor
Details the physical dimensions (L, W, T, e, g) of the ceramic capacitor.
Rated Value Information
Electrical Ratings Overview
Lists rated voltage, capacitance, temperature characteristics, and tolerance.
Package Options
Available Packaging Types
Describes available packaging types (reels) and quantities for the capacitors.
Specifications and Test Methods
Electrical Specifications Details
Covers rated voltage, capacitance, dissipation factor, and temperature characteristics.
Physical and Mechanical Test Procedures
Details tests for appearance, dimensions, voltage proof, insulation resistance, and adhesive strength.
Reliability and Environmental Testing
Vibration, Bending, and Solderability Tests
Outlines tests for vibration, substrate bending, and solderability.
Thermal Shock and Humidity Tests
Describes tests for sudden temperature changes and high humidity conditions.
Durability and Derating Guidelines
Component Durability Test Conditions
Specifies conditions and procedures for durability testing.
Recommended Derating Conditions
Provides guidance on voltage and temperature derating for reliability.
Test Method Illustrations
Substrate Bending Test Setup
Illustrates the setup and dimensions for the substrate bending test.
Soldering Test Land Patterns
Shows land patterns and dimensions for soldering tests.
Tape Carrier Packaging Details
Packaging Codes and Quantities
Lists packaging codes and minimum quantities per reel.
Tape Dimensions by Series
Specifies tape dimensions for GRM01/02, GRM03/15, GRM18/21/31/32, GRM43/55.
Taping and Reel Specifications
Reel Dimensions and Taping Diagram
Shows reel dimensions and illustrates the taping diagram.
Tape Handling and Strength
Details tape winding, leader/vacant sections, and strength requirements.
Application and Storage Guidelines
Limitation of Applications
Lists applications requiring high reliability.
Storage and Operation Conditions
Advises on storage environment, duration, and corrosive gas effects.
Temperature Dependent Characteristics
Shows capacitance change with temperature for X7R and X5R types.
Measurement and Voltage Application
Capacitance Measurement Notes
Discusses measurement equipment output and AC voltage effects on capacitance.
Applied Voltage and Self-heating
Details voltage limits and self-heating due to ripple current.
Capacitor Electrical Characteristics
Voltage and Aging Characteristics
Illustrates capacitance change vs. voltage and over time.
Vibration and Shock Precautions
Advises on preventing damage from mechanical stress.
Soldering and Mounting Procedures
Component Mounting Position
Recommends positions to minimize stress during board flexing/bending.
Pre-Mounting Checks
Lists essential checks before mounting, like re-use, solderability, and material compatibility.
Mounting Machine Maintenance
Pick and Place Machine Precautions
Details forces to avoid and maintenance for pickup nozzles and locating claws.
Reflow Soldering
Reflow Soldering Conditions and Time
Specifies temperature profiles, time, and atmosphere for reflow soldering.
Solder Paste Amount
Discusses optimum solder paste amount to prevent stress and ensure adhesion.
Flow Soldering
Flow Soldering Conditions and Limitations
Outlines conditions and limitations for flow soldering, including termination leaching.
Solder Fillet Requirements
Advises on solder fillet height for flow soldering to prevent cracking.
Soldering Rework Procedures
Soldering Iron Rework
Provides steps for correcting soldered portions with a soldering iron, including preheating.
Spot Heater Rework
Explains using a spot heater for rework, including distance and angle.
Printed Circuit Board Handling
PCB Electrical Test Support
Advises on supporting the PCB during electrical testing to avoid stress.
PCB Cropping Methods
Details methods to prevent stress during board separation.
PCB Separation Jig Examples
Hand Separation Jig Design
Illustrates recommended and not-recommended jigs for hand separation.
Disc Separator Operation and Design
Explains disc separator operation and potential issues with misalignment.
Assembly and Component Placement
Handling Mounted Boards
Guidelines for handling boards with mounted capacitors to prevent damage.
Mounting Other Components
Precautions when mounting components on the back side.
Inserting Leaded Components
Advises on preventing board bending when inserting leaded components.
Screw Tightening Precautions
Precautions against board bending when tightening screws.
Operation and Safety Precautions
Equipment Operation Guidelines
Warns against direct contact, short circuits, and unsuitable operating environments.
Emergency Procedures and Disposal
Actions for emergencies and guidelines for waste disposal.
Fail-Safe Circuit Design
Recommends fail-safe functions for circuits where shorts may cause hazards.
Rating and Operating Environment
Operating Temperature and Self-heating
Defines operating temperature limits and self-heating considerations.
Atmosphere Restrictions
Lists unsuitable operating environments related to gas and liquid exposure.
Piezo-electric Phenomenon
Describes vibration and noise generation in high dielectric constant capacitors.
PCB Design for Soldering
Pattern Forms for Chip Mounting
Illustrates correct and incorrect pattern forms to prevent chip cracking.
Land Dimensions for Soldering
Flow Soldering Land Dimensions
Provides land dimensions (a, b, c) for flow soldering.
Reflow Soldering Land Dimensions
Provides land dimensions (a, b, c) for reflow soldering.
Board Design and Assembly Adhesives
Board Strain and Adhesive Requirements
Discusses board design impact on strain and adhesive specs for chip mounting.
Flux for Flow Soldering
Details flux requirements and precautions for flow soldering.
Soldering, Washing, and Coating
Soldering Process Controls
Covers termination leaching, flux choice, and cleaning solvent selection.
Coating Resin Selection
Recommends resin types to prevent cracks and reduce hygroscopicity.
Transportation and System Evaluation
Transportation Conditions
Specifies conditions for temperature, humidity, and mechanical force during transport.
Actual System Performance Evaluation
Emphasizes evaluating capacitors in the actual system for reliability.
Product Use and Specification Compliance
Product Evaluation and Specification Adherence
Stresses product evaluation and adherence to specifications for business transactions.

Table of Contents