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Chip Monolithic Ceramic Capacitor for General
GRM033R61A104KE15_ (0201, X5R:EIA, 0.1uF, DC10V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
03
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
0.6±0.03
0.3±0.03
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM033R61A104KE15-01
3
R6
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.3±0.03
0.1 to 0.2
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 85 °C
DC 10 V
(25 °C)
Packaging Unit
15000 pcs./Reel
30000 pcs./Reel
50000 pcs./Reel
1A
104
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
0.2 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
0.1 uF
±10 %
1
Reference Sheet
K
E15
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 85 °C
D
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Related Manuals for Murata GRM033R61A104KE15D
Summarization of Contents
Capacitor Packaging Information
Minimum Quantity per Reel
Specifies the minimum quantity of capacitors per reel for tape carrier packaging.
Tape Carrier Packaging Dimensions
Details the dimensions and specifications for tape carrier packaging.
Application Limitations and Storage
Capacitor Storage Conditions
Guidelines for storing capacitors under specific temperature and humidity conditions.
Corrosive Gas Storage Warning
Warning against storing capacitors in environments with corrosive gases.
Humidity and Sunlight Effects
Caution on how humidity changes and sunlight can degrade solderability and performance.
Capacitor Rating and Characteristics
Temperature Dependent Characteristics
Explains how capacitance changes with temperature and provides guidance for selection.
Capacitance Measurement Procedures
Standard Capacitance Measurement
Instructions for measuring capacitance using specified voltage and frequency.
Measuring Equipment Voltage Drop
Notes on potential voltage decrease from measuring equipment when capacitance is high.
AC Voltage Effects on Capacitance
Consideration for AC voltage effects on capacitance for high dielectric constant types.
Applied Voltage Guidelines
Do Not Exceed Rated Voltage
Crucial warning against exceeding the capacitor's rated voltage.
Acceptable Voltage Limits
Defines acceptable voltage limits for DC, AC, and pulse applications.
Consequences of Over-Voltage
Explains consequences of over-voltage, including internal breakdown.
Applied Voltage and Self-Heating
Managing Self-Heating in AC/Pulse Use
Guidance on managing self-heating for AC/pulse voltage use.
DC and AC Voltage Characteristics
DC Voltage Impact on Capacitance
Explains DC voltage impact on capacitance for high dielectric types.
Capacitance Change with Applied Voltage
Details how applied voltage affects capacitance in ceramic capacitors.
AC Voltage Impact on Capacitance
Explains AC voltage impact on capacitance for high dielectric constant types.
Capacitance Aging Characteristic
Capacitance Decrease Over Time
Describes the aging characteristic where capacitance decreases over time.
Vibration and Shock Considerations
Confirming Vibration and Shock Conditions
Guidance on confirming vibration and shock conditions before use.
Mechanical Shock Damage Warning
Warning about potential damage from mechanical shock like dropping.
Handling Printed Circuit Boards Safely
Caution regarding handling printed circuit boards to avoid damaging capacitors.
Mounting Position Guidelines
Optimizing Mounting for Stress Reduction
Ensuring optimal mounting to minimize stress from board flexing or bending.
Chip Mounting for Stress Minimization
Guidance on chip mounting to reduce stress during board flexure.
Information Before Mounting
Do Not Re-use Removed Capacitors
Prohibition against reusing removed capacitors to maintain reliability.
Confirm Capacitance and Mechanical Stress
Verify capacitance characteristics and mechanical stress under real operating conditions.
Stored Capacitor Solderability and Solder Type
Ensure solderability of stored capacitors and caution on Sn-Zn solder reliability.
Pick and Place Machine Maintenance
Preventing Excessive Forces During Mounting
Ensuring pick and place machines do not apply excessive forces to capacitors.
Minimizing Bending Force During Mounting
Minimizing bending force during mounting to prevent capacitor damage.
Pick and Place Nozzle Maintenance
Maintenance advice for pick and place machine nozzles to prevent chip damage.
Reflow Soldering Procedures
Effect of Sudden Heat and Preheating
Explains how sudden heat affects component strength and the need for preheating.
Solderability with Low-Temperature Reflow
Caution regarding solderability issues with low-temperature reflow profiles.
Temperature Difference in Solvent Immersion
Guidance on temperature difference when immersing components in solvent.
Optimum Solder Amount for Reflow
Recommendations for achieving the optimal solder amount for reflow soldering.
Flow Soldering Procedures
Flow Soldering Restrictions
Restriction on using flow soldering for specific chip sizes.
Sudden Heat and Preheating in Flow Soldering
Impact of sudden heat on component strength and the importance of preheating.
Risks of Long Soldering Times
Risks of long soldering times or high temperatures, like termination leaching.
Solvent Immersion Temperature Management
Importance of managing temperature difference when components are immersed in solvent.
Optimum Solder Amount for Flow Soldering
Guidance on solder amount for flow soldering to prevent cracking.
Correction of Soldered Portions
Thermal Stress and Capacitor Cracking
Explains how thermal stress can cause cracks in capacitors.
Soldering Iron Correction Procedures
Procedures and precautions for making corrections with a soldering iron.
Spot Heater Correction Method
Using a spot heater for corrections to reduce thermal shock.
Optimum Solder Amount for Rework
Guidance on optimal solder amount for rework soldering.
Electrical Test and PCB Cropping
PCB Electrical Test Positioning
Ensuring correct jig/pin positioning for electrical testing of mounted capacitors.
Avoid PCB Bending During Testing
Instruction to avoid bending PCBs during testing to prevent capacitor damage.
PCB Cropping Stress Warning
Warning against applying stress to capacitors during PCB cropping.
Check PCB Cropping Method in Advance
Recommendation to pre-check PCB cropping methods to prevent stress.
Assembly Process Guidelines
Handling Assembled Boards
Guidelines for handling assembled boards with capacitors.
Attaching Other Components
Considerations when mounting components on the reverse side of the PCB.
Inserting Leaded Components Safely
Precautions for inserting leaded components to avoid board bending and capacitor damage.
Operation, Emergency, and Disposal
Operation Environment and Safety Precautions
Conditions and safety precautions for operating equipment containing capacitors.
Emergency and Disposal Procedures
Instructions for emergency situations and proper capacitor disposal.
Circuit Design and General Remarks
Considerations for circuit design, including fail-safe functions and remarks.
Capacitor Rating and Environmental Factors
Operating Temperature Considerations
Information on operating temperature limits and self-heating effects.
Atmosphere Surroundings Restrictions
Restrictions and considerations for operating environments concerning gases and liquids.
Piezo-electric Phenomenon
Explanation of piezoelectric effects and potential noise generation in capacitors.
Soldering and Mounting: PCB Design
PCB Design for Soldering and Mounting
Key considerations for PCB design related to soldering and mounting.
Pattern Form Guidelines
Guidelines on pattern forms for mounting chip components.
Flexing Stress on Chip Components
Chip components' susceptibility to flexing stresses compared to leaded types.
Cracking Risk from PCB Thermal Expansion
Risk of chip cracking due to PCB thermal expansion/contraction differences.
Land Dimensions for Capacitors
Capacitor Cracking Due to PCB Stress
Explains how improper land dimensions can lead to capacitor cracking from PCB stress.
Board Design Considerations
Strain Impact from Board Design Factors
Board design factors influencing strain and their impact on capacitors.
Adhesive Application and Curing
Importance of Sufficient Adhesive
Importance of sufficient adhesive for secure chip mounting during soldering.
Low Viscosity Adhesive Caution
Caution on using adhesives with low viscosity that may cause chip slippage.
Adhesive Coverage Specifications
Specifications for adhesive coverage amount based on chip size.
Consequences of Insufficient Adhesive Curing
Consequences of insufficient adhesive curing on chip connection and insulation resistance.
Flux Application for Flow Soldering
Flux Application and Gas Generation
Guidance on applying flux thinly and evenly for flow soldering.
Halide Content and Corrosion Risk
Warning about using flux with high halide content causing corrosion.
Prohibition of Strong Acidic Flux
Prohibition against using strong acidic flux.
Flow Soldering Parameters
Flow Soldering Temperature and Time
Parameters for flow soldering to prevent termination leaching.
Reflow Soldering Precautions
Corrosive Substances in Solder Paste
Caution regarding corrosive substances in solder paste.
Prohibition of Strong Acid Flux
Prohibition against using strong acid flux.
Prohibition of Water-Soluble Flux
Instruction not to use water-soluble flux.
Capacitor Cleaning Procedures
Evaluate Actual Cleaning Equipment
Recommendation to evaluate cleaning processes with actual equipment.
Risks of Unsuitable Cleaning Solvents
Consequences of using unsuitable cleaning solvents on capacitor reliability.
Selecting Proper Cleaning Conditions
Guidance on selecting appropriate cleaning conditions.
Capacitor Coating Considerations
Resin Contraction Stress and Cracking
Explains how resin contraction stress can cause capacitor cracks.
Using Less Hygroscopic Resins
Recommendation to use less hygroscopic resins to maintain insulation resistance.
Transportation and System Evaluation
Capacitor Transportation Guidelines
Guidelines and precautions for capacitor transportation.
Protection During Transportation
Protection requirements for capacitors against environmental factors during transport.
Avoid Excessive Stress During Transport
Warning against applying excessive vibration, shock, or pressure during transportation.
Actual System Evaluation of Characteristics
Process for evaluating capacitor characteristics in the actual system.
Product Specification Adherence
Ensure Product Evaluation Against Specifications
Ensure product evaluation aligns with specifications before integration.
Do Not Deviate from Product Specifications
Instruction to adhere strictly to product specifications.
Exclusion of Business Terms from Documentation
Statement on excluding business transaction terms from technical documents.
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