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Chip Monolithic Ceramic Capacitor for General
GRM1555C1H180FA01_ (0402, C0G:EIA, 18pF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
15
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
1.0±0.05
0.5±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
or Cap. Change
0±30 ppm/°C
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Feb.9,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM1555C1H180FA01-01
5
5C
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.5±0.05
0.15 to 0.35
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
25 to 125 °C
DC 50 V
(25 °C)
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
1H
180
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
0.3 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
18 pF
±1 %
1
Reference Sheet
F
A01
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 125 °C
D
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Related Manuals for Murata GRM1555C1H180JA01D
Summarization of Contents
Specifications and Test Methods
Rated Voltage Specification
Defines the maximum continuous voltage the capacitor can withstand.
Appearance Inspection
Describes criteria for visual inspection to ensure no defects.
Dimensional Verification
Details the methods for measuring and verifying component dimensions.
Voltage Proof Testing
Specifies the test for dielectric strength under applied voltage.
Insulation Resistance Measurement
Details the method for measuring DC resistance to assess leakage.
Capacitance Measurement
Explains how capacitance is measured at specified frequency and voltage.
Q Factor Measurement
Describes the procedure for measuring the quality factor (dissipation factor).
Temperature Coefficient of Capacitance
Details how temperature's effect on capacitance is measured and specified.
Adhesive Strength of Termination
Specifies tests for the adhesion of terminal metallization to the capacitor body.
Specifications and Test Methods
Vibration Resistance Test
Outlines the test procedure for assessing performance under vibration.
Substrate Bending Test
Details tests to evaluate capacitor reliability under board flexure.
Solderability Test
Describes the method to check solder wetting on terminations.
Resistance to Soldering Heat Test
Specifies tests to ensure performance after exposure to soldering temperatures.
Temperature Sudden Change Test
Details tests for capacitors subjected to rapid temperature variations.
Specifications and Test Methods
High Temperature High Humidity Test
Explains tests for capacitor stability under prolonged high temperature and humidity.
Durability Testing
Outlines tests to assess the long-term reliability and performance of the capacitor.
Tape Carrier Packaging
Minimum Quantity per Reel
Specifies the minimum number of components supplied per reel for different packaging types.
Limitation of Applications
Storage and Operation Conditions
Provides guidelines for storing and operating capacitors to maintain performance.
Rating
Temperature Dependent Characteristics
Explains how capacitance changes with temperature and provides selection advice.
Applied Voltage
Influence of Over Voltage
Explains the risks of applying voltages exceeding the rated value.
Soldering and Mounting
Mounting Position Guidance
Advises on optimal component placement to minimize stress during board handling.
Information Before Mounting
Lists essential checks and considerations prior to capacitor assembly.
Mounting Machine Maintenance
Details maintenance requirements for pick and place machines to prevent capacitor damage.
Soldering and Mounting
Reflow Soldering Process
Provides recommended parameters and precautions for reflow soldering processes.
Soldering and Mounting
Flow Soldering Process
Outlines recommended conditions and precautions for flow soldering applications.
Soldering and Mounting
Soldered Portion Correction
Describes methods for rework and correction of soldered connections.
PCB Processing Procedures
Cleaning and Washing Precautions
Warns against excessive ultrasonic vibration during cleaning that can damage components.
Electrical Testing on PCB
Advises on proper support and handling during electrical testing.
PCB Cropping Methods
Recommends safe methods for cutting PCBs to avoid component damage.
Assembly Process
Handling and Component Mounting
Emphasizes proper board handling to prevent damage and cracks.
Lead Component Insertion
Details methods to prevent stress and cracking when inserting leaded components.
Screw Tightening Procedures
Advises on preventing board bending and over-tightening when securing components.
Operational Considerations
Operation Environment and Safety
Details conditions to avoid during equipment operation and general safety advice.
Emergency Response and Disposal
Outlines actions for emergencies and proper waste disposal methods.
Circuit Design and Product Remarks
Covers fail-safe functions, product certification status, and general remarks.
Performance Characteristics
Operating Temperature and Environment
Specifies maximum operating temperatures and environmental restrictions.
Piezo-electric Phenomenon Effects
Explains potential vibration and noise generation due to piezo-electric effects.
PCB Design for Reliability
Pattern Form Design Guidelines
Illustrates prohibited and correct pattern layouts to minimize stress and cracking.
PCB Design for Reliability
Land Dimension Recommendations
Specifies recommended land dimensions for flow and reflow soldering to prevent cracks.
Soldering Preparation and Materials
Adhesive Application and Curing
Details adhesive requirements for chip fixation and curing procedures.
Flux Selection for Soldering
Provides guidance on appropriate flux types and usage for soldering.
Soldering Process Details
Flow Soldering Parameters
Specifies temperature and time settings for flow soldering to prevent termination leaching.
Reflow Soldering Considerations
Warns against halogen substances and strong acids in solder paste and flux.
Capacitor Cleaning and Coating
Covers cleaning procedures and resin selection for capacitor coating.
Transportation and System Evaluation
Transportation Precautions
Details requirements for protecting capacitors during transport against environmental factors and shock.
Actual System Performance Evaluation
Emphasizes evaluating capacitors in the final system for voltage/temperature dependency and surge resistance.
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