TA790GXE 128M BIOS Manual
tWTR
Options:
Auto (Default) / 4~7 CLK
tWRWR
Options:
Auto (Default) / 3~10 CLK
tRDRD
Options:
Auto (Default) / 2~10 CLK
tRFC0 / tRFC1 / tRFC2 / tRFC3
Options:
Auto (Default) / 90ns / 110ns / 160ns / 300ns / 350ns
Memory Configuration
Memor y Configurati on
Bank Interleaving
Enabl e Clock to Al l DIMMs
MemCl k Tristate C3 /ATLVID
Memor y Hole Remapp ing
DCT U nganged Mode
Power Down Enable
Pow er Smashing
> ECC Configuratio n
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Bank Interleaving
Bank Interleaving is an advanced chipset technique used to improve memory
perform ance. Memory interleaving increases bandwidth by allowing simultaneous
access to more than one piece of memory.
Options:
Auto (Default)
BIOS S ETUP UTILITY
T-Series
[ Auto]
[ Disabled]
[ Disabled]
[ Enabled]
[ Always]
[ Disabled]
[ Disabled]
39
Enab le Bank Memo ry
Inte rleaving
S elect Screen
S elect Item
C hange Option
+-
F1
G eneral Help
F1 0
S ave and Exit
ES C
E xit