Related Manuals for Panasonic TX-58AXR800
Summarization of Contents
Service Manual Introduction and Safety
General Warnings and Safety Notices
Provides critical warnings and safety notices for service technicians.
1 Safety Precautions
1.1. General Guidelines
Outlines general rules and practices for safe and proper equipment servicing.
1.2. Touch-Current Check
Details the procedure for measuring touch current to ensure electrical safety.
2 Warnings and ESD Prevention
2.1. Prevention of Electrostatic Discharge (ESD)
Explains techniques to prevent damage to sensitive electronic components from static electricity.
2.2. About Lead-Free Solder (PbF)
2.2. About Lead-Free Solder (PbF)
Provides information and usage guidelines for lead-free solder in repair work.
3 Service Navigation
3.1. PCB Layout
Illustrates the layout of the Printed Circuit Boards (PCBs) within the unit.
4 Specifications
Product Fiche and TV Dimensions
Lists key product specs, dimensions, mass, power, and connections.
Wireless and Camera Specifications
Covers specifications for wireless LAN, Bluetooth, and built-in camera features.
5 Technical Descriptions
5.1. Key Specifications for Content Protection
Details key specifications for content protection and streaming technologies like CI Plus.
5.2. USB HDD Recording Functionality
Explains the functionality and requirements for recording digital TV programs to a USB HDD.
5.3. Service Port (M3 Mini Jack) Specifications
Describes the M3 mini jack service port for PC control and communication parameters.
5.3. Remote Control Commands
Lists commands for controlling TV functions, input, and picture settings via remote.
5.3. Additional Remote Commands
Details commands for channel selection and other remote controller functions.
5.4. FR Board Connector Handling
Instructions for safely connecting and disconnecting FR12 and FR13 connectors on the FR board.
6 Service Mode Operations
6.1. Entering and Navigating Service Mode
Procedure for accessing service mode, using keys, and exiting.
6.1.4. Contents of Adjustment Mode
Lists the adjustable parameters and their sample data within the Service Mode.
6.2 Service Tool Mode
Accessing and Viewing Service Tool Data
Covers accessing the mode, viewing SOS history, power time, and exiting.
6.3 DRV Check - USBHDD Check
6.3 DRV Check - USBHDD Check
Procedure for checking the functionality of the Drive (DRV) and USB HDD.
6.4 Hotel Mode Configuration
Hotel Mode Setup and Options
Covers accessing the Hotel mode and configuring its various settings for guest rooms.
6.5 Data Copy via USB Memory
6.5.1. Purpose and Preparation
Explains the purpose of data copying and preparing USB memory for it.
6.5.3. Copying Data from TV to USB Memory
Detailed steps for copying TV data to a USB memory device.
6.5.4. Copying Data from USB Memory to TV
Instructions for copying data from a USB memory device back to the TV set.
7 Troubleshooting Guide
7.1 IIC Bus Line Diagnostics
Guide to checking IIC bus lines, accessing self-checks, and interpreting screen display.
7.1.3. Component Check Points
Lists specific components and their check points based on self-check results.
7.1.4. Exit Diagnostic Mode
Procedure for exiting the diagnostic mode.
7.2 Power LED Blinking Timing Chart
Chart correlating power LED blink patterns to specific error conditions.
7.3 LCD Panel and FR Test Modes
Covers the objective and steps for performing LCD Panel and FR board tests.
7.4 No Power Troubleshooting
Troubleshooting guide for diagnosing 'No Power' issues based on LED indicators.
8 Disassembly and Assembly Instructions
8.1. Disassembly Flow Chart
Visual flow chart outlining the sequence of disassembly steps for the unit.
8.2 Unit Disassembly Procedures
Details the disassembly of the rear pedestal, front pedestal, and AC inlet.
8.2.4-8.2.7 Component and Cover Removal
Instructions for removing Wi-Fi dongle, BT cover, and back cover.
8.2.7-8.2.8 Board Removal
Details the steps for removing the P-Board and the A-Board.
8.2.9-8.2.11 Board and Bracket Removal
Covers removal of FR, HE, and GK boards, and the key button bracket.
8.2.12-8.2.15 Component Removal
Details the removal of the woofer, Wi-Fi cable, camera module, and Bluetooth dongle.
8.2.16-8.2.21 Minor Component Removal
Details the removal of positioning pins, VESA metals, ornament covers, and metal brackets.
8.2.22-8.2.27 Panel and Board Removal
Details the removal of rear panels, MD/K boards, and speaker assemblies.
8.2.28-8.2.29 Chassis and Panel Component Removal
Covers removal of metal frames, AL cabinet, LCD panel, and heatsinks.
8.3 EMI Countermeasure Specifications
Gasket Placement on A-Board (Front and Back)
Specifies gasket application for EMI shielding on both sides of the A-board.
8.3 EMI Countermeasure Details
Gasket and Tape Application Procedures
Details gasket placement on A-board 2 and application of conductive tape.
8.3 EMI Countermeasure Guidelines
Sponge and AL Tape Application for Shielding
Covers the application of sponge and AL tape for EMI shielding purposes.
8.3 EMI Countermeasure Instructions
CI Slot AL Tape Application Procedures
Provides detailed steps and cautions for applying AL tape to the CI slot.
8.3 EMI Countermeasure Specifications
CI Slot Conductive and AL Tape Application
Details application of conductive tape and AL tape to the CI slot.
8.3 EMI Countermeasure Details
CI Slot AL Tape and Gasket Application
Details steps for applying AL tape and gasket to the CI slot.
8.3 EMI Countermeasure Guidelines
CI Slot Gasket Application (Back Cover)
Specifies gasket application on the back cover for the CI slot.
8.3 EMI Countermeasure Instructions
Gasket Placement on A-Board (Front Side)
Details gasket application on the front of A-board 3 and 4 for EMI shielding.
8.3 EMI Countermeasure Specifications
Gasket Placement Near and On A-Board (Back Side)
Details gasket application near and on the back of A-board 3.
8.3 EMI Countermeasure Details
Gasket and Tape Application for Shielding
Covers application of gasket and tape, including warnings for headphone/SD slots.
8.3 EMI Countermeasure Guidelines
Shield Case Fixing and Gasket Placement
Details fixing the shield case and applying gasket near the Bluetooth module.
8.3 EMI Countermeasure Instructions
Gasket and Felt Application on PCB
Details gasket application and felt material placement on the PCB.
8.3 EMI Countermeasure Specifications
Clamp-Core Attachment and A-Board Gasket Application
Covers attaching the clamp-core and gasket placement on the back of A-board 4.
8.3 EMI Countermeasure Details
Shield Case Fixing and Rubber/Gasket Application
Details fixing shield cases and applying rubber/gasket materials.
8.3 EMI Countermeasure Guidelines
Rubber and Gasket Application on PCB
Covers application of rubber and gasket materials to specific PCB locations.
8.3 EMI Countermeasure Instructions
Numbered Gasket Application Procedures
Details gasket application in a numbered sequence with specific positional requirements.
8.3 EMI Countermeasure Specifications
Gasket Application for Specific Locations
Details gasket application for specific locations (4th and 5th steps).
8.3 EMI Countermeasure Details
Gasket Application for Multiple Positions
Details gasket application for specific positions (8th and 9th steps).
8.3 EMI Countermeasure Guidelines
Gasket and Rubber Application Details
Details gasket application and rubber/gasket application for specific areas.
8.3 EMI Countermeasure Instructions
Final Gasket Application Specifications
Details the final gasket application specifications with X/Y directions.
9 Voltage Measurement Charts
P-Board and A-Board Voltage Specifications
Details voltage test points and specifications for the P-board and A-board.
FR-Board and HE-Board Voltage Specifications
Details voltage test points and specifications for the FR-board and HE-board.
10 Block Diagrams
10.1 P-Board, MD, GK, and K Board Block Diagram
Presents the system block diagram for the P-board, MD, GK, and K boards.
10.2 A-Board Block Diagram (Part 1)
Details the block diagram of the A-board, showing component interconnections.
10.2 A-Board Block Diagram (Part 2)
Continues the block diagram for the A-board, illustrating further component details.
10.3 FR and HE Board Block Diagram
Presents the third part of the system block diagram, focusing on FR and HE boards.
11 Wiring Connection Diagram
11.1 Overall Wiring Diagram
Illustrates the overall wiring connections between major boards and components.
11.2 Caution Statements and Wire Dressing
Provides cautions for cable assembly and instructions for wire dressing.
11.3 Detailed Cable Routing Instructions
Shows specific routing for HDMI, USB, and A-K/BT wires.
11.3 Wire Routing and Placement Guidelines
Illustrates wire routing and placement relative to components like VESA metal and heatsinks.
11.3 Final Wire Routing and Tape Application
Shows final wire routing and tape application for securing wires.
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