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PICK AND PLACE LOCATION
LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
250
140~180°C 60~120 sec.
200
Ramp-up temp.
0.5~3.0°C /sec.
150
100
50
0
60
120
Time ( sec. )
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Temp
.
Peak Temp. 240 ~ 245 ℃
220℃
200℃
Preheat time
150℃
90~120 sec.
Ramp up
max. 3 ℃ /sec.
25℃
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
DS_DNM04SMD10_07162008
Peak temp.
2nd Ramp-up temp.
210~230°C 5sec.
1.0~3.0°C /sec.
Pre-heat temp.
Over 200°C
40~50sec.
180
240
Time Limited 75 sec.
above 220 ℃
SURFACE-MOUNT TAPE & REEL
Cooling down rate <3°C /sec.
300
Ramp down
max. 4 ℃ /sec.
Time
15
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