LG G4015 Service Manual
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LG G4015 Service Manual

LG G4015 Service Manual

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Service Manual
G4015
P/N : MMBD0033301
Date : June, 2004 / Issue 1.0

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  • Page 1 Service Manual G4015 P/N : MMBD0033301 Date : June, 2004 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents ........1. INTRODUCTION 5. DISASSEMBLY INSTRUCTION 1.1 Purpose ..........3 1.2 Regulatory Information ......3 6. DOWNLOAD AND 1.3 Abbreviations ........5 ........CALIBRATION 6.1 The Purpose of Downloading ......... 2. PERFORMANCE Software ..........68 2.1 H/W Features ........6 6.2 The Environment of Downloading 2.2 Technical Specification ......

  • Page 3: Revised History

    LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the G4015. - 2 -...

  • Page 4: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the G4015 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

  • Page 5: Interference And Attenuation

    The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation An G4015 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems . H. Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

  • Page 6: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual,following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electroluminescence...

  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 760 mAh Standard Battery Size: 50 x 34 x 4.4mm Weight: 23.4g AVG TCVR Current GSM850: 250mA, PCS: 200mA Standby Current < 4.0mA Talk time 4hours (GSM TX Level 7) Standby time 200 hours (Paging Period: 9, RSSI: -85dBm) Charging time...

  • Page 8: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification GSM 850 TX: 824 + (n-127) x 0.2 MHz RX: 869 + (n-127) x 0.2 MHz (n=128~251) Frequency Band TX: 1850 + (n-511) x 0.2 MHz RX: 1930 + (n-511) x 0.2 MHz (n=512~810) RMS <...
  • Page 9 2. PERFORMANCE Item Description Specification GSM850 Offset from Carrier (kHz). Max. dBc +0.5 –30 –33 –60 600~ <1,200 –60 1,200~ <1,800 –60 1,800~ <3,000 –63 3,000~ <6,000 –65 Output RF Spectrum 6,000 –71 (due to modulation) Offset from Carrier (kHz). Max.
  • Page 10 2. PERFORMANCE Item Description Specification GSM850 BER (Class II) < 2.439% @–102 dBm Bit Error Rate BER (Class II) < 2.439% @–102 dBm RX Level Report accuracy 3 dB 8 3 dB Frequency (Hz) Max.(dB) Min.(dB) –12 – – –12 Sending Response 1,000 –6...
  • Page 11 2. PERFORMANCE Item Description Specification <Change> 32.768 KHz ≤ 30 ppm tolerance Full power <240mA (GSM850); < 180mA (PCS) Power consumption Standby • Normal Mode ≤ 4.0mA(Mix. Power) • Using Test mode on DSP Sleep function ≤ 6mA GSM850/Level 7 (Battery Capacity 740mA) : 230 Min Talk time GSM850/Level 12 (Battery Capacity 740mA) : 380 Min Under conditions, at least 200 hours:...

  • Page 12: Technical Brief

    3. Technical brief 3. Technical brief 3.1 The Block Diagram of the Baseband Part LCD MODULE Memory (AM50DL128CH) Connector MIDI Speaker / Receiver (YMU762) (Calypso) Analog Vibrator Backup Battery (IOTA) Ear_Mic jack Charging : SIGNAL Block I/O Connector : Current Battery Data Cable,…...

  • Page 13: Baseband Components

    3. Technical brief 3.2 BaseBand Components (1) Component Side J201 SIDE KEY U201 U101 Digital Baseband Chipset (Calypso) U202 U102 Analog Baseband Chipset (IOTA) X101 Crystal (32.768KHz Oscillator) U102 U101 U201 Melody IC (40 Poly) X101 U203 U202 Analog Switch (Dual) U203 Analog Switch (Single) J401...

  • Page 14: Digital Baseband (Dbb) Processor

    3. Technical brief 3.3 Digital Baseband (DBB) Processor Figure 3-4. The Internal Architecture of the Calypso G2(HERCROM400G2) - 13 -...

  • Page 15: Analog Main Processor (Abb)

    3. Technical brief 3.4 Analog Main Processor (ABB) Figure 3-5. TWL3014 Functional Block Diagram • Applications include GSM 850, 900, DCS 1800, PCS 1900 Cellular Telephones • Voice Coder/Decoder (CODEC) • Baseband CODEC single and multislot with I/Q RF Interface •...

  • Page 16: Memory

    • Dedicated very low quiescent current domain supply 3.5 Memory Figure 3-6. • Memory used G4015 is designed by AMD • Mixed Multi-Chip Package containing a 64M pSRAM and 128M Flash Memory • MCP(Multi-Chip Package) Features - Power Supply Voltage of 2.7 to 3.3 V - Operating Temperature of -40°…...

  • Page 17: Voltage Regulation (Ldo)

    3. Technical brief 3.6 Voltage Regulation (LDO) Figure 3-7. • VRDBB - Provides the power to the DBB(Calypso) Core - 1.5V / 120mA max. • VRRAM - Provides the power to the Analog S/W, IC, etc.external memory - 2.8V / 50mA •...

  • Page 18: Midi

    - 2.85V / 10mA max. 3.7 MIDI Figure 3-8. • The ringing source of G4015 is the MIDI. • The MIDI chip which is used in G4015 is YMU762 from YAMAHA. • YMU762 generates 40-poly MIDI sound. - 17 -...

  • Page 19: Charging

    3. Technical brief 3.8 Charging • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : 4.0V • Charging temperature adc range • Charging time : about 2h - ~ -5°C : Charging range (3.6V ~ 3.8V) •...

  • Page 20: Sim

    3. Technical brief 3.10 SIM A. SIM Interface The Sim Card digital interface in ABB insures the translation of logic levels between DBB and Sim Card, for the transmission of 3 different signals: • A clock derived from a clock elaborated in DBB, to the Sim-Card (DBBSCK -> SIM_CK) •...

  • Page 21: The Block Diagram Of The Rf Part

    3. Technical brief 3.12 The Block Diagram of the RF Part RF SAW RXIN RXIP 100kHz RXQN RXQP 100kHz Si4205 Divider TXVCO TXIN Divider TXIP TXQN Divider TXQP 26MHz RF PLL IF PLL Dual ANT_SW ANTSW_TXTX AndGate ANTSW_BAND Figure 3-13. 3.13 RF Part Components •...

  • Page 22: Tx/Rx Part Description

    3. Technical brief 3.14 Tx/Rx Part Description A. Tx/Rx Part component Description 1. Regulator • Regulator - Produce 2.85V DC Power - Support DC Power to every RF component except PAM 2.85V Output Figure 3-15. 2. VCTCXO • VCTCXO - Produce RF reference clock - 26MHz frequency X501 26MHz frequency Output Figure 3-16.

  • Page 23: Receiver Part Description

    3. Technical brief 3. RF Main Chip (Si4205) • PDNB, S_EN, S_CLK, S_DATA - From DBB Main Chip Set - Contains information all about ARFCN, voice data, user information etc. - RF Chips operate according to these signals S_DATA U502 S_CLK S_EN PDNB...
  • Page 24 3. Technical brief B. Rx Part component Description 1. Mobile Switch & Ant Switch • Antenna Switch - Select the Path – GSM / PCS Tx, GSM / PCS Rx - From DBB, three control signals (ANT_SW, ANTSW_TXRX, ANTSW_BAND) are fed into the Dual AND Gate - Dual AND Gate Controls the Ant SW with VC1 &...
  • Page 25 3. Technical brief 2. Band Selection Filter PCS BSF GSM BSF Figure 3-21. • Band Selection Filter - Cuts the out of band frequency For GSM : 869MHz 894MHz For PCS : 1930MHz 1990MHz Figure 3-22. - Insertion Loss - For GSM : ~-2.5dB - For DCS : ~-3dB - 24 -...
  • Page 26 3. Technical brief 3. RF Transceiver Chip (LNA Input) Si-4205 GSM LNA Input PCS LNA Input Figure 3-23. • LNA input port of RF Main Chip(Si4205) - Balanced-type LNA Input Matching Si4205 Circuit Figure 3-24. - 25 -...
  • Page 27 3. Technical brief 4. RX Local signal (Si4205) TXVCO GSM850 RF1 : 1737.8~1787.8MHz RF PLL PCS1900 RF1 : 1929.9~1989.9MHz Figure 3-25. • RF1 Frequency - GSM850 : 1737.8 ~ 1787.8MHz - PCS1900 : 1929.9 ~ 1989.9MHz • GSM Rx Frequency - GSM850 : 869 ~ 894MHz - PCS1900 : 1930 ~ 1990MHz •...

  • Page 28: Transmitter Part Description

    3. Technical brief 3.16 Transmitter Part Description A. Tx Block Diagram GSM TxVCO : 1648 ~ 1698MHz PCS TxVCO : 1850 ~ 1910MHz TxVco GSM RX : 824 ~ 849MHz PCS RX : 1850 ~ 1910MHz 26MHz RF PLL IF PLL Dual Andgate GSM RF2 : 1272 ~ 1297MHz GSM IF : 896MHz...
  • Page 29 3. Technical brief 2. Tx Local and IF signal (Si4205 RF2 and IF) TXVCO GSM850 : 448MHz PCS1900 : 427MHz RF PLL IF PLL Figure 3-29. • RF2 Frequency : GSM : 1272 ~ 1297MHz PCS : 1423 ~ 1483MHz •...
  • Page 30 3. Technical brief 4. PAM – control signals PA BAND PA ON U501 Figure 3-31. • PA_ON - From DBB Chip Set - Enables Tx Path • PA_Band - From DBB Chip Set - Select PAM operating band - Low : GSM selected - High : PCS selected •...
  • Page 31 3. Technical brief 5. Mobile Switch & Ant Switch GSM Tx Path PCS Tx Path GSM / PCS Tx Path Figure 3-32. • Antenna Switch - Select the Path – GSM / PCS Tx, GSM / PCS Rx - From DBB, three control signals (ANT_SW, ANTSW_TXRX, ANTSW_BAND) are fed into the Dual AND Gate - Dual AND Gate Controls the Ant SW with VC1 &...

  • Page 32: Trouble Shooting

    4. Trouble Shooting 4. Trouble Shooting 4.1 Power On Sequence A. Power On Sequence 1. Connecting Battery 2. Power-On Key Detection 3. END_ON_OFF signal goes to ABB and then ABB reset DBB by ON_OFF signal 4. ON_OFF turn low(0V) to HIGH(2.8V) and it resets Calypso. 5.

  • Page 33: Charging Trouble

    4. Trouble Shooting 4.2 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : 4.0V • Charging temperature adc range • Charging time : about 2h - ~ -5°C : Charging range (3.6V ~ 3.8V) •...
  • Page 34 4. Trouble Shooting • Trouble Shooting Setup - Connect Battery & TA to the handset. • Trouble Shooting Procedure - Check the charger connector. - Check the charging current path. - Check the battery START Resolder the CN401. I/O Connector (CN401) (pin 4,5:VCHG, is well-soldered? pin 12,19:GND)

  • Page 35: Lcd Display Trouble

    4. Trouble Shooting 4.3 LCD Display Trouble Check soldering around connector If the FPCB has a problem, the control signals for LCD cannot be transmitted properly. Figure 4-5. • LCD Control Signals From Main Board - MAIN_CS, LCD_ID, _WR, LCD_RESET, A(1),LCD_BACKLIGHT, DATA(0)~DATA(15) •...
  • Page 36 4. Trouble Shooting START Refer to Power is supplied to the board? Power On Trouble Connection between FPCB Reconnect FPCB and board is OK? CN301 is soldered well? Resolder the CN301 Paths of LCD control Resolder signals are OK? the CRC Filter The board is broken.

  • Page 37: Speaker/Receiver Trouble

    4. Trouble Shooting 4.4 Speaker/Receiver Trouble • Block Diagram V_SRAM Calypso SPK_EN U101 VoiceMail_EN SPK_RCVN MAX4684 SPK_RCVN RCV_N EAR_N U202 C230 CN402 IOTA R203 U102 SPK_RCVP SPK_RCVP RCV_P EAR_P U203 Speaker MAX4624 R221 /Receiver SPKN SPKP C202 C205 C206 YMU762 LCD Module U201 Board...
  • Page 38 4. Trouble Shooting R203:RCV_N Check soldering these points ! R221 :RCV_P Check Audio signal here ! RCV_N and RCV_P Figure 4-9. • Receiver Trouble shooting setup - Initialize GSM MS test equipment. - Connect PIF-UNION and power on. - Make a test call to 112. - Set audio part at test equipment as PRBS or continuous wave, not echo.

  • Page 39: Receiver Trouble

    4. Trouble Shooting A. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. et the audio volume max. ABB is out of order. Does sine wave appear Change the board. at R203, R221? Resolder the U202.

  • Page 40: Microphone Trouble

    4. Trouble Shooting B. Speaker Trouble START Enter into Engineering Mode and go to menu “Baseband => Alert => Ring” Resolder the U202 Does sine wave appear SPK_EN signal is high? otherwise Change it. at C230? Connection between Resolder the U202 Reconnect FPCB.
  • Page 41 4. Trouble Shooting • Microphone Signal Flow - MIC is enable by MICBIAS - MICBIAS, MICP, MICN signals from ABB • Check Points - Microphone bias - Audio signal level of the microphone - Soldering of components • Trouble Shooting Setup - Initialize GSM MS test equipment.
  • Page 42 4. Trouble Shooting AC voltages of the signals MICP MICN Figure 4-14. The waveforms at MICP and MICN START Conne ct th e hand set to net work equi pment and s etup c all. The voltage of R208 The soldering of R208 is OK? Resolder the R208.

  • Page 43: Vibrator Trouble

    4. Trouble Shooting 4.6 Vibrator Trouble • Block Diagram VBAT VBAT YMU762 U201 MOTOR FPCB CN301 Dual Tr. R373 MOTOR VIBRATOR Q306 R374 VIBRATOR LCD Module Board Connector Figure 4-16. • Vibrator Operation - Vibrator is controlled by MIDI chip - When vibrator signal is high, vibrator on LCD module is enabled •...
  • Page 44 4. Trouble Shooting START Enter into Engineering Mode and select Vibrator Connection between Reconnect FPCB. FPCB and board is OK? Resolder the CN301, CN301, FPCB, Vibrator are FPCB, Vibrator. soldered well ? Resolder the R373, Signal path is OK? R374,Q306,R372, R377.

  • Page 45: Keypad Backlight Trouble

    4. Trouble Shooting 4.7 Keypad Backlight Trouble • Block Diagram VBAT LD301 R302 LD302 R303 IOTA LEDB LD303 R304 U102 LD304 R305 LD305 R306 LD306 R307 LD307 R308 LD308 R309 LD309 R536 LD310 R537 Figure 4-19. • Backlight Operation - The keypad LED backlight is controlled with LEDB signal. - LEDB signal from ABB.
  • Page 46 4. Trouble Shooting A. All LEDs are not working START Enter into Engineering Mode and select Keypad On ABB is out of order. The Voltage of LEDB signal Change the Board. is about 0V? Power off and Measure the Resistor Value of all LEDs . Is there anything that Replace the LED.

  • Page 47: Folder On/Off Trouble

    4. Trouble Shooting 4.8 Folder ON/OFF Trouble • Block Diagram V_IO FOLDER R323 Calypso U102 FOLDER_DETECT C306 C307 A3212EEH U302 Keypad Side Component Side Figure 4-23. • Folder Operation - There is a magnet to detect the folder status, opened or closed. - If a magnet is close to the hall-effect switch(U302), the voltage at pin 1 of U302 goes to 0V.
  • Page 48 4. Trouble Shooting START Resolder the The all paths connected C306, C307, R323. to U302 are OK? Refer to The V_SRAM is 2.8V? Power On Trouble. The FOLDER signal is low Replace the U302. on magnetizing into U302? U302 is broken. The DBB(Calypso) is broken.

  • Page 49: Sim Detect Trouble

    4. Trouble Shooting 4.9 SIM Detect Trouble • Block Diagram V_SIM VRSIM R405 SIM_IO IOTA C407 U102 Connector SIM_RST J401 SIM_CLK C406 J401 Figure 4-26. • Connection between SIM and DBB - SIM_CLK, SIM_IO, SIM_RST • Check Point - Contact between SIM and socket - Soldering of SIM socket •...
  • Page 50 4. Trouble Shooting START Insert the SIM Card Resolder the The soldering of SIM connector J401. is OK? Resolder the The all paths connected R405, C406, C407. to J401 are OK? SIM card is broken. The SIM Card is OK? Change the SIM Card.

  • Page 51: Earphone Trouble

    4. Trouble Shooting 4.10 Earphone Trouble • Block Diagram V_IO R207 R206 HSMICBIAS R210 R209 IOTA C215 HOOK_DETECT R212 U102 C231 HSMICP C224 R214 L201 R222 HEADSET_MIC C226 (N.A) R218 ADIN1 HEADSET_OUT C225 R215 R216 JACK_DETECT EAR_JACK SPEC Figure 4-28. SOUND HSMICP •...
  • Page 52 4. Trouble Shooting • Earphone Sending Path - HSMICP is the audio signal from the microphone of the earphone. - R214, L201 and C224 make the path of the audio signal from the microphone of the earphone. - This audio signal is delivered to ABB(IOTA). •...
  • Page 53 4. Trouble Shooting START cf) PRBS : Pseudo Random Bit Sequence Insert the earphone into the headset. Go to Figure 4-32 Does the Audio profile change 1. Earphone detection problem to the earphone mode? Resolder the Set the audio part of test equipment Soldering of C224, L201 C224, L201, R214 R214 is OK?

  • Page 54: Rx Part Trouble Shooting

    4. Trouble Shooting 2. Sending Path problem Set audio part of the test equipment to the echo mode. Resolder The soldering of C224, the C224, R214, R2163. R214, R216 is OK? Resolder the The voltage at R214 R212, R210. is 1.1V ~ 1.3V? Resolder The soldering of the J201.
  • Page 55 4. Trouble Shooting A. Check Ant. SW and Mobile SW ANTSW_BAND, ANTSW_TXRX U504 ANTSW_TXRX Figure 4-35. 1. Check Dual And gate input signals. 2. Check Ant. SW control signals (Outputs of And gate). GSMTx PCSTx 3. If VC1 and VC2 are differ to above logic table, change U504(dual and gate). - 54 -...
  • Page 56 4. Trouble Shooting FL501 3 -2 3 -1 Check these circuit with High Frequency Probe. You can see RF signal at Spectrum Analyzer! Figure 4-36. 1. Check RF Power at each point ( , -2). 2. Can you observe good RF signal at proper frequency? •...
  • Page 57 4. Trouble Shooting B. Check SAW Filter circuit A2, B2 Figure 4-37. 1. Check SAW Filter Input power(A1, B1) 2. Check SAW Filter Output power(A2, B2) • GSM Insertion loss ~ -2.5dB • PCS Insertion loss ~ -3dB 3. If checked insertion loss is too big, check matching circuit or change SAW Filter. C521 1.2p R514...
  • Page 58 4. Trouble Shooting C. Check VCTCXO and Regulation 1. VCTCXO • 26MHz Clock Output 26MHz frequency output Figure 4-38. 2. Regulation • 2.85V Regulator Out 2.85V Output Figure 4-39. - 57 -...
  • Page 59 4. Trouble Shooting D. Check control signals 1. PDNB, S_EN, S_CLK, S_DATA PDNB S_EN S_CLK S_DATA PDNB / S_EN / S_CLK S_DATA Figure 4-40. E. Check RX I/Q signal Expended ! RXQN RXQP RXIP RXIN Figure 4-41. - 58 -...

  • Page 60: Tx Part Trouble Shooting

    4. Trouble Shooting 4.12 TX Part Trouble Shooting START Setup Test with LAPUTA GSM 190Ch. DAC 500 PCS 661Ch. DAC 530 4. Check IF and Local 1. Check VCTCXO and signals Regulation 2. Check control signals 5. Check PAM circuit 6.
  • Page 61 4. Trouble Shooting C. Check Tx I/Q 1. Tx I/Q TXQN TXQP TXIN TXIP Figure 4-43. D. Check PAM Circuit 1. PAM input and output Check these points with High Frequency Probe. GSM PCS VBAT PCS GSM You can see RF signal at Spectrum Analyzer ! OUT OUT Figure 4-44.
  • Page 62 4. Trouble Shooting 2. PAM control signals PA_ON PA_Band APC PA BAND ON Figure 4-45. E. Check Ant. SW circuit 1. Control signal VC1, VC2 Same as 4.11 RX Part Trouble Shooting Procedure A. 2. Tx OUT Power • GSM : about 33dBm •...

  • Page 63: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION 5.1. Disassembly Instruction 1. Remove the battery cover Figure 5-1. Figure 5-2. - 62 -...
  • Page 64 5. DISASSEMBLY INSTRUCTION Figure 5-3. Figure 5-4. - 63 -...
  • Page 65 5. DISASSEMBLY INSTRUCTION Figure 5-5. Figure 5-6. Figure 5-7. - 64 -...
  • Page 66 5. DISASSEMBLY INSTRUCTION Figure 5-8. Figure 5-9. - 65 -...
  • Page 67 5. DISASSEMBLY INSTRUCTION Figure 5-10. - 66 -...
  • Page 68 5. DISASSEMBLY INSTRUCTION Figure 5-11. Figure 5-12. - 67 -...

  • Page 69: Download And Calibration

    Handset PC with RS-232 Figure 6-1. • Preparation - Target Handset (G4015) - Data kit - Battery - IBM compatible PC supporting RS-232 with Windows 98 or newer • If you use data kit, you should have a battery with the voltage above 3.7V.

  • Page 70: In Case Of Using The Pif

    C1300 Handset PC with RS-232 Figure 6-2. • Preparation - Target Handset (G4015) - PIF - RS-232 Cable and PIF-to-Phone interface Cable - TA/Power Supply or Battery - IBM compatible PC supporting RS-232 with Windows 98 or newer • If you use battery, you should have a battery with the voltage above 3.7V.

  • Page 71: The Procedure Of Downloading Software

    6. DOWNLOAD AND CALIBRATION 6.3 The Procedure of Downloading Software 1. Execute FLUID.EXE. And then a window will be shown as below. 2. Press “Add” button and select a software to download in browser. - 70 -...
  • Page 72 6. DOWNLOAD AND CALIBRATION 3. And then the window will be shown as below. Check the “Erase entire flash device” item. 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. - 71 -...
  • Page 73 6. DOWNLOAD AND CALIBRATION 5. Press “Erase/Program flash” menu. Click the “Erase/Program” item and you will see the window as below. 6. After you watched the “Bootloader: ” message, press the Power key of handset (in case of Data kit) or turn the POWER on (PIF) and switch on the TI-REMOTE (PIF). The window will be shown as below.
  • Page 74 6. DOWNLOAD AND CALIBRATION 7. If downloading is completed, you will see the window as below. And then turn the Power On after removing and inserting battery again. (in using of battery) - 73 -...
  • Page 75 Note. - 74 -...

  • Page 76: Circuit Diagram

    0.1u 0.1u 0.1u <-(1608) C114~C119 , 124,125 ROM1_CS ROM0_CS Section Date Sign & Name Sheet/ JTAG1 Sheets MODEL KBC(0:4) _F_WE C1300 / G4015 TDO_0 04/04/06 Designer S. G. KIM KBR(0:4) TDO_ARM TDO_1 TP101 TP102 TP103 TP104 TP105 TP106 TP107 TP108...
  • Page 77 C230 COM1 SPK_RCVP VA201 VA202 EAR_P VARISTER-G5300 Section Date Sign & Name Sheet/ VARISTER-G5300 Sheets MODEL EAR_N C1300 /G4015 SPK_EN 04/04/06 S. G. KIM Designer R219 Checked 04/04/06 T. S. PARK DRAWING AUDIO NAME 04/04/06 S. S. BAE Approved DRAWING V 1.1...
  • Page 78 C349 R362 0.1u 0.1u 0.1u 0.1u 0.1u INDLED_R Section Date Sign & Name Sheet/ Sheets MODEL C1300 / G4015 04/04/06 S. G. KIM Designer Checked 04/04/06 T. S. PARK DRAWING NAME 04/04/06 S. S. BAE Approved DRAWING V 1.1 Iss.
  • Page 79 C406 ICTL 100p C407 R406 PCHG D401 CUS02 VCCS Section Date Sign & Name Sheet/ R407 Sheets MODEL C1300 / G4015 S.G.KIM 04/04/06 Designer (2012) VBATS 04/04/06 T. S. PARK Checked C408 DRAWING 4.7u IO/SIM (1608) NAME 04/04/06 S. S. BAE...
  • Page 80 R532 R533 VBAT RF2.85V 270K 22K THERMISTER U505 R534 Section Date Sign & Name Sheet/ C543 RF_EN MODEL C1300 / G4015 Sheets TEMPSENSE C542 MIC5255-2.85BM5 (1608) 0.01u C544 C545 Designer 04/04/06 M. S. YEO R535 (1608) 4.7K T. S. PARK...

  • Page 81: Pcb Layout

    8. PCB LAYOUT 8. PCB LAYOUT - 80 -...
  • Page 82 8. PCB LAYOUT - 81 -...
  • Page 83 Note. - 82 -...

  • Page 84: Engineering Mode

    • LED • LCD • Font • Alert • Serial Port • Battery Info1 • Audio Gain C. G4015 SW Vers D. G4015 HW Vers E. Eng Mode • Cell Environ • Location Info • Layer1 Info F. Call Timer G.

  • Page 85: Rf Test

    9. ENGINEERING MODE 9.2 RF Test [MENU 2] Radio Frequency Test A. SAR Test [2-1] This menu is to test the Specific Absorption Rate. • SAR Test On [2-1-1] : Phone continuously process TX only. Call-setup equipment is not required. •...

  • Page 86: Trace Option

    9. ENGINEERING MODE 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.

  • Page 87: Stand Alone Test

    10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 What is Standalone Test? • What’s the Standalone Test? - Set the Phone to Perform only Tx or Rx mode • During the Normal Call • During Rx Standalone • During Tx Standalone - 86 -...

  • Page 88: Standalone Test Equipment Setup

    10. STAND ALONE TEST 10.2 Standalone Test Equipment Setup GSM Test Set Spectrum Analyzer Oscilloscope High Frequency Probe Probe C1300 PBA Power Supply 10.3 Rx Standalone Test A. Test Equipment Setting • Set Test equip. to “CW Generator” • Set RF Frequency - RX Frequency + 67.7 kHz - Ex.) GSM 190Ch : 881.6MHz + 67.7KHz = 881.6677MHz •...

  • Page 89: Tx Standalone Test

    10. STAND ALONE TEST 10.4 Tx Standalone Test A. Test Equipment Setting • Set Test equip. to “BCCH + BCH Only” • Set TCH CH and PWR Level - You can set any CH and power level that you want to test BCCH + BCH Only - 88 -...

  • Page 90: Auto Calibration

    11. AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 What’s the Rx Calibration A. What’s the Rx Calibration • Find proper AGC Gain to make the same Rx Power fed into the Base Band Part regardless of Antenna Input Level • Can make report correct RSSI level PART X(Input Level) + G(Gain)=Y B.

  • Page 91: Calibration Program

    11. AUTO CALIBRATION 11.2 Calibration program A. Calibration program (LAPUTA) • Under windows 98 or 2k • Not support win xp B. Required Equipments • Test PC with PCMCIA slot • GPIB card and cable • PIF JIG • E5515C(Agilent 8960 series) •...

  • Page 92: Calibration Equipment Setup

    11. AUTO CALIBRATION 11.3 Calibration Equipment Setup GSM Test Set(8960) GPIB control Power Supply C1300 Battery Simulator - 91 -...
  • Page 93 11. AUTO CALIBRATION A. Initialize Target • After connect phone and equipments, click Initialize button • You can see the green signal after successful initialize B. Initialize E5515C • After connect phone and equipments, click Initialize button • You can see the green signal after successful initialize - 92 -...
  • Page 94 11. AUTO CALIBRATION C. AUTO CAL (1) • Click AUTO CAL tab. • Another auto cal window will appeared D. AUTO CAL (2) • Load calibration setting files • Power Index file, Initial Value file and Ramp Table - 93 -...
  • Page 95 11. AUTO CALIBRATION E. AUTO CAL (3) • Click RF CAL button • Auto cal is started with Rx calibration F. AUTO CAL (4) : Rx Calibration • Fig A : Rx calibration is started • Fig B : Rx calibration is ended Fig A Fig B - 94 -...
  • Page 96 11. AUTO CALIBRATION G. AUTO CAL (4) : Tx Calibration • Fig A : Tx calibration is started • Fig B : Tx calibration is ended Fig A Fig B H. Saving Cal data to phone • Click Save button on Auto calibration window - 95 -...
  • Page 97 11. AUTO CALIBRATION I. Reset Target • Click reset button on Laputa main window • The green signal turn to red after reset - 96 -...

  • Page 98: Exploded View

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 97 -...
  • Page 99 Note. - 98 -...

  • Page 100: Replacement Parts

    C1300 CGRSV Dark Gray MFBC00 FILTER,SPEAKER MFBC0008101 C1300 CGRSV ELLIPSE 0.1t Black MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver MPBF00 PAD,FLEXIBLE PCB MPBF0005601 C1300 CGRSV 22 X 5 X 3.5 t Black MPBG00 PAD,LCD MPBG0021101 C1300 CGRSV 35.6 X 39.3 X 0.7 t...
  • Page 101 C1300 CGRSV 9 X 5.5 X 0.05t Blue MTAB00 TAPE,PROTECTION MTAB0042601 C1300 CGRSV Main Window Protection 41 X 65 X 0.15t MWAD00 WINDOW,LED MWAD0003701 G4015 ATTSV BLACK LG, AT&T LOGO Black ACGM00 COVER ASSY,REAR ACGM0036801 G4015 ATTSV LDI Hole Silver MCCC00 CAP,EARPHONE JACK MCCC0013501 C1300 CGRSV 6.2PI...

  • Page 102: Main Component

    SJMY0002802 3 V,0.08 A,12*15 ,G5300 VIBRATOR (0.5t PAD) SUSY00 SPEAKER SUSY0006207 ASSY ,8 ohm,92 dB,17 mm,5T SVLY00 SVLY0018801 SAFY00 PCB ASSY,MAIN SAFY0102201 G4015 PCB ASSY Silver SAFA00 PCB ASSY,MAIN,AUTO SAFA0037001 G4015, PCB ASSY Silver C101 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C102...
  • Page 103 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C118 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C119 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C120 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C121 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 104 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C231 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C233 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C234 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C250 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C306 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C307 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 105 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C342 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C343 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C344 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C345 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C346 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C347 CAP,CERAMIC,CHIP ECCH0000117...
  • Page 106 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C527 CAP,CERAMIC,CHIP ECCH0000140 560 pF,50V,K,X7R,HD,1005,R/TP C530 CAP,CERAMIC,CHIP ECCH0000103 1.5 pF,50V,C,NP0,TC,1005,R/TP C531 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C532 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C534 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C535 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 107 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark LD301 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD302 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD303 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD304 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD305 DIODE,LED,CHIP EDLH0004502...
  • Page 108 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R215 RES,CHIP ERHY0000215 56 ohm,1/16W,J,1005,R/TP R216 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R217 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R218 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R219 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R220 RES,CHIP ERHY0000201...
  • Page 109 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R346 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R347 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R348 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R349 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R350 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R351 RES,CHIP ERHY0000237...
  • Page 110 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R425 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R426 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R431 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R432 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R433 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R434 RES,CHIP ERHY0000261...
  • Page 111 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SW302 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W SW501 CONN,RF SWITCH ENWY0003001 STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T 179GHH PBGA ,179 PIN,R/TP ,CALYPSO / DIGITAL BB U101 EUSY0155201 CHIP...

  • Page 112: Accessory

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,760 mAh,1 CELL,PRISMATIC ,C1300 SBPL00 BATTERY PACK,LI-ION SBPL0072134 Silver BATTERY(SV)

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