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Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution
of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business
relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components
to meet their specific needs.
With the principle of "Quality Parts,Customers Priority,Honest Operation,and Considerate Service",our business
mainly focus on the distribution of electronic components. Line cards we deal with include
Microchip,ALPS,ROHM,Xilinx,Pulse,ON,Everlight and Freescale. Main products comprise
IC,Modules,Potentiometer,IC Socket,Relay,Connector.Our parts cover such applications as commercial,industrial,
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Related Manuals for Murata GCM155R71E104KE02 Series
Summary of Contents for Murata GCM155R71E104KE02 Series
- Page 1 Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components to meet their specific needs.
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Page 2: Reference Sheet
Chip Multilayer Ceramic Capacitors for Automotive GCM155R71E104KE02_ (0402, X7R:EIA, 0.1uF, DC25V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s Control (2)T (4)Rated (1)L/W (3)Temperature... - Page 3 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specification. AEC-Q200 Test Method Pre-and Post-Stress Electrical Test 2 High Temperature The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board). Exposure (Storage) specifications in the following table.
- Page 4 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specification. AEC-Q200 Test Method The measured and observed characteristics should satisfy the 7 Operational Life Solder the capacitor on the test substrate(glass epoxy board). specifications in the following table. Apply 150% of the rated voltage for 1000+/-12h at 125+/-3℃.
- Page 5 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specification. AEC-Q200 Test Method 14 Thermal Shock The measured and observed characteristics shall satisfy the Solder the capacitor on the test substrate(glass epoxy board). specifications in the following table. Perform the 300 cycles according to the two heat treatments listed...
- Page 6 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specification. AEC-Q200 Test Method 18 Board Flex Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board) shown in Fig1. Then apply a force in the direction shown in Fig 2 for 60s.
- Page 7 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specification. AEC-Q200 Test Method 21 Capacitance Temperature R7 : Within +/-15% The capacitance change should be measured after 5 minutes (-55℃ to +125℃) Characteristics at each specified temperature stage. Capacitance value as a reference is the value in step 3.
- Page 8 Package GCM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GCM03 15000(W8P2) 30000(W8P1) 50000(W8P2) 5 (Dimensions Tolerance:±0.05) 10000(W8P2) 20000(W8P1) 50000(W8P2) GCM15 5 (Dimensions Tolerance:±0.1min.) 10000(W8P2) 40000(W8P2) GCM18...
- Page 9 Package GCM Type (3)GCM18/21/31/32 <Paper Tape> 4.0±0.1 4.0±0.1 (in mm) 2.0±0.1 +0.1 φ1.5 Ａ Dimensions(Chip) Type GCM18 1.6±0.1 0.8±0.1 0.8±0.1 1.05±0.10 1.85±0.10 0.6±0.1 GCM21 2.0±0.15 1.25±0.15 1.55±0.15 2.30±0.15 1.1 max. 0.85±0.1 GCM31 3.2±0.15 1.6±0.15 2.00±0.20 3.60±0.20 GCM32 3.2±0.3 2.5±0.2 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 (4)GCM21/31/32 <Plastic Tape>...
- Page 10 態 単位： Package GCM Type Fig.1 Package Chips (in mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GCM32 max. 16.5 max. 10±1.5 GCM43/55 20.5 max. 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
- Page 11 Package GCM Type ｯﾌﾟ詰め状態 単位： 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. Tail vacant Section Chip-mounting Unit Leader vacant Section...
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Page 12: Limitation Of Applications
Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment... - Page 13 Caution 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2.
- Page 14 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type [Example of DC Voltage Characteristics] capacitor changes depending on the DC voltage applied. Sample: R(R1) Characteristics 0.1μF, Rated Voltage 50VDC Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
- Page 15 Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. ...
- Page 16 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. Check the mounting in the actual device under actual use conditions ahead of time. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum to prevent them from any damage or cracking.
- Page 17 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) Soldering mechanical damage to the components, preheating is Peak Temperature...
- Page 18 Caution 4-2.Flow Soldering [Standard Conditions for Flow Soldering] 1. Do not apply flow soldering to chips not listed in Table 2. Temperature(℃) Table 2 Soldering Soldering Chip Dimension Peak Series Temperature Differential Gradual Temperature (L/W) Code ΔT Cooling Preheating ΔT≦150℃ Peak GC□...
- Page 19 Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
- Page 20 Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade the capacitors. 6.Electrical Test on Printed Circuit Board 1.
- Page 21 Caution (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
- Page 22 Caution (3) Example of Router Type Separator [ Outline Drawing ] Router The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation.
- Page 23 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 24 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the maximum operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor.
- Page 25 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
- Page 26 Notice 2. Land Dimensions Chip Capacitor Please confirm the suitable land dimension by Land evaluating of the actual SET / PCB. Solder Resist Table 1 Flow Soldering Method Chip Dimension Series Chip(L×W) (L/W) Code GC□ 1.6×0.8 0.6 to 1.0 0.8 to 0.9 0.6 to 0.8 GC□...
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