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bynav M20D User Manual

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M20D High-Precision Positioning & Heading
Module
USER MANUAL
Description
This document applys to M20D high-precision positioning&heading module.
No.: UG073
Ver.: V1.8
Date: 2024.12.30

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Summary of Contents for bynav M20D

  • Page 1 M20D High-Precision Positioning & Heading Module USER MANUAL Description This document applys to M20D high-precision positioning&heading module. No.: UG073 Ver.: V1.8 Date: 2024.12.30...

  • Page 2: Table Of Contents

    CONTENTS CONTENTS .......................... 1 1 Feature ..........................1 1.1 Brief Introduction ......................... 1 1.2 Performance ........................1 1.3 Supported Protocol ......................3 2 System Architecture ......................4 3 Pin Definition ........................5 3.1 Pin Assignment ........................5 3.2 Pin Description ........................6 4 Electrical Specification ....................
  • Page 3 7 Manufacturing ....................... 27 7.1 Assembly and Welding ....................... 27 7.1.1 SMD Device Requirement ........................27 7.1.2 Humidity Sensitivity Level ........................28 7.1.3 Baking ..............................28 7.1.4 Preheating Phase ........................... 29 7.1.5 Storage ..............................29 7.1.6 Workshop Lifetime and Temperature-Humidity Control ................. 29 7.1.7 Requirement for Production of Stencil ....................

  • Page 4: Contents

    1 Feature 1.1 Brief Introduction The M20D high-precision positioning and heading module is based on Bynav Technology's new generation 22nm process high-performance automotive-grade GNSS SoC, Alice. It is equipped with the high-precision measurement engine and navigation engine, it supports high- performance RTK solution, anti-interference and dual-antenna heading.
  • Page 5 Feature BDS B1I, B2I, B1C*, B2b (PPP)* GPS L1 C/A, L1C*, L2 GNSS Band GLONASS G1, G2 Galileo E1, E5b QZSS L1C*, L2, L1 C/A Number of Channels 1500 Re-acquisition Time ≤1s Carrier Phase ≤1mm (RMS) Measurement Accuracy Pseudorange≤ 0.1m (RMS) GNSS Observation Transfer Rate 10Hz GNSS RTK Positioning Data...

  • Page 6: Supported Protocol

    Feature Note 6: Typical value. The duration from power-up to the first output of a valid single-point solution after clearing the ephemeris/almanac/approximate position and time information. Note 7: Typical value. The duration from power-up to the first output of a valid single-point solution, given that the receiver has stored valid ephemeris/almanac/approximate position and reasonably accurate time (error less than 5 minutes).

  • Page 7: System Architecture

    System Architecture 2 System Architecture The architecture diagram of M20D high-precision positioning & heading module as shown below. Figure 2-1 Architecture Diagram 4 / 40...

  • Page 8: Pin Definition

    Pin Definition 3 Pin Definition 3.1 Pin Assignment Note: is digital GND and is analog GND Figure 3-1 Pin Assignment 5 / 40...

  • Page 9: Pin Description

    Pin Definition 3.2 Pin Description Table 3-1 Pin Description Connection when not in Name Description GNDA Analog ground GNDA RF signal input (Main ANT1_IN Floating Antenna) GNDA Analog ground GNDA Digital grounding Internal unconnection Floating Slave SPI chip selection input and control signal SPIS_CSN0/RMII_TX_CTRL of RMII data sending;...
  • Page 10 Pin Definition Abnormal indication, active high. Outputs high when the module ERR_STAT Floating system self-check fails; outputs low when self- check passes. positioning indication, active high. Outputs high when the PVT_STAT Floating module is capable of positioning; outputs low when not positioning. positioning indication.
  • Page 11 Pin Definition Serial port 1 receiving and CAN1 receiving; It RXD1/CAN1_RXD Floating switched software configuration Recommend adding a test point; connect ground, Floating power external peripheral I/O. Second pulse, supports software Floating configuration Recommend adding a test point; connect ground, Floating power, external...
  • Page 12 Pin Definition Internal unconnection Floating Digital grounding Reserved. Floating Floating required Reserved. Floating Floating required The internal program update enabling pin, BOOT Floating and has pulled down by internal 1kΩ resistance GNDA Analog ground GNDA Digital grounding 9 / 40...

  • Page 13: Electrical Specification

    Electrical Specification 4 Electrical Specification 4.1 Absolute Maximum Ratings Table 4-1 Absolute Maximum Ratings Parameter Name Condition Min. Max. Unit Power Supply Voltage -0.3 VCC Ramp Voltage 8000 μs/V VCC≤3.1V -0.3 VCC + 0.5 Input Pin Voltage VCC>3.1V -0.3 Input Power of RF_IN 50Ω...
  • Page 14 Electrical Specification Operating Temperature ℃ operation Note1: Optional maximum temperature is 105℃. 11 / 40...

  • Page 15: Communication Interface

    -2.5% +2.5% 5.2 SPI The M20D module can support one SPI slave interface by configured via software. The maximum SPI clock frequency is 10 MHz. 5.3 CAN The M20D module can support one CAN/CANFD interface by configured via software. It supports the rate of 500k~2Mbps.
  • Page 16 Up to 921600 baud, 8 bits, no parity bit, 1 stop bit. UART2 input BYNAV commands, RTCM protocol supported. UART3 input Maximum rate of 100Mbps. NMEA messages, BYNAV protocol, RTCM protocol RMII output supported. RMII input Maximum rate of 100Mbps. BYNAV commands, RTCM protocol supported.

  • Page 17: Application Guide

    GNSS RF is illustrated in the following diagram: Figure 6-2 Internal Structure of RF Fore-end The trace between the RF input interface of the M20D module and the RF coaxial connector also needs to be controlled within the impedance range. To ensure RF performance, a conservative...
  • Page 18 Application Guide design approach is to add a matching network in the RF circuits. The matching network is typically categorized into three types: L-type, T-type and π-type which is recommended, the matching network should be place near the module. Figure 6-3 Diagram of π Type Matching Network Design considerations for schematic: The components in the RF matching circuits are capacitors and inductors which should be ⚫...
  • Page 19 Application Guide Figure 6-4 Diagram of RF PCB design considerations: The RF traces should be surrounded by grounded copper planes. Ground planes should have ⚫ multiple GND vias to ensure a low ground impedance. Insufficient GND vias can increase the loop area of the RF signal reference ground, so an adequate GND vias should be placed around the RF traces.
  • Page 20 Application Guide Figure 6-5 RF Signal Curved Traces RF traces should not have branches or splits. Improper placement of reserved matching ⚫ circuits on the RF traces can cause splits in the RF signal path, leading to impedance discontinuity. Do not take other signal lines in the projection area on the back of the RF trace and make sure ⚫...

  • Page 21: Antenna Power Supply

    Application Guide power inductors or clocks. 6.1.2 Antenna Power Supply The M20 module does not provide VCC_RF. The feeding circuit can be designed as followed diagram when external active antenna is used. Figure 6-7 Reference Design for Active Antenna Feeding The C1 capacitor is used to block the DC signal from the feed;...

  • Page 22: Power Supply Design

    The M20D module internally uses a single power input, VCC_3V3, as the main power input. The input voltage range for VCC_3V3 is 3.0 V to 3.6 V, with a recommended value of 3.3 V and a ripple of less than 10mVpp.

  • Page 23: Minimal Design

    Application Guide Place bypass capacitors close to the module to filter out high-frequency interference from the ⚫ power supply. Be sure to evaluate the power consumption and heat dissipation of the LDO. ⚫ 6.3 Minimal Design The diagram of minimal design is shown below, UART1 is used to connect to a host device, UART3 is optional and can be used to receive RTCM data.
  • Page 24 Application Guide Figure 6-9 Minimal Design Please follow the tips below in design: VCC should be connected to power supply of 3.3V. ⚫ The central GND pad at the bottom of the module should be well-grounded. ⚫ The recommended value of serial resistance is 200Ω. ⚫...

  • Page 25: Uart Interface

    Pay attention to the following When it comes to the schematic: Mind the correspondence between signal connections. ⚫ If the voltage level of the HOST device is different from that of the M20D module, a level ⚫ conversion design is required.

  • Page 26: Spi Interface

    Avoid areas that may introduce static electricity. ⚫ The serial resistance should be placed near the module. ⚫ 6.5 SPI Interface M20D modules can provide a set of slave SPI interface, reference chapter 5.2 for configuration details. Table 6-3 Slave SPI Function Pin Name...

  • Page 27: Reset Interface

    Application Guide RMII_RXD0 RMII_RXD0 3.3V LVTTL RMII_RXD1 RMII_RXD1 3.3V LVTTL RMII_TX_CTRL SPIS_CSN/RMII_TX_CTRL 3.3V LVTTL RMII_TXD0 RMII_TXD0 3.3V LVTTL RMII_TXD1 RXD3/RMII_TXD1 3.3V LVTTL RMII interface application information as shown below, the recommended resistance value of serial resistance is 200Ω: Figure 6-12 Recommended RMII Interface Design 6.7 Reset Interface The module has a hardware reset pin, RESET_N, which is active low.

  • Page 28: Trouble Shooting

    Application Guide 6.8 Trouble Shooting In the event of an unexpected failure of the M20D module, it is recommended that the users bring out the following pins to a test point or connector to troubleshooting. Pin No. Pin Name Description ERR_STAT Debugging interface for test mode.

  • Page 29: Electromagnetic Interference (Emi) Precaution

    Application Guide heat generated inside the module to external cooling systems. PCB layout: The PCB layout should keep sensitive areas away from heat-generating regions. ⚫ Thermal isolation: For high-power or heat-generating components, the module needs to be ⚫ separated or kept at a distance from these components to reduce heat transfer. Environmental testing: After design completion, thermal cycling tests and extreme ⚫...

  • Page 30: Manufacturing

    7 Manufacturing 7.1 Assembly and Welding The M20D module is a precision device that uses LGA packaging. To ensure good surface mount soldering, it is recommended to use reflow soldering to avoid issues such as solder voids and short circuits. It is not recommended to solder the module using a hot air gun, as the uneven and high temperature from the hot air gun can severely damage the module's functionality and performance.

  • Page 31: Humidity Sensitivity Level

    ⚫ 7.1.2 Humidity Sensitivity Level The M20D module is moisture-sensitive, according to IPC/JEDEC J-STD-033 standards, the M20D module has a Moisture Sensitivity Level (MSL) of 3. Before using the module, it is necessary to confirm the integrity of the packaging. After opening the package, check the status of the humidity indicator card inside the vacuum packaging.

  • Page 32: Preheating Phase

    Manufacturing 7.1.4 Preheating Phase The initial heating process evaporates residual moisture from the module. Note that the preheating phase cannot replace the previous baking process. The preheating temperature requirements are as follows: Temperature rise rate: Maximum 3℃/s. If the preheating temperature rises too quickly, it may ⚫...

  • Page 33: Requirement For Production Of Stencil

    7.1.7 Requirement for Production of Stencil To ensure sufficient solder and reliable soldering of the M20D module in LGA packaging, it is recommended to locally increase the thickness of the stencil (Step-up) at the module positions.
  • Page 34 Manufacturing Figure 7-2 Recommended Furnace Temperature Profile of Assembly Table 7-1 Control Requirements of Recommended Furnace Temperature Test Requirement Recommended Value Soak Zone Max Temperature Ramp Slope 1~3°C/s Constant Temperature Time (Time Between A and B: 150°C~200°C) 70~120s Reflow Zone Max Temperature Ramp Slope 1~3°C/s Reflux Time (D: Period Exceeding 217°C)

  • Page 35: Smt Furnace Recommendation

    7.2 ESD Protection The M20D module is an electrostatic sensitive (ESD), and ESD protection should be taken into 32 / 40...
  • Page 36 Manufacturing consideration when packaging, handling or assembling the module. 33 / 40...

  • Page 37: Mechanical Specification

    Mechanical Specification 8 Mechanical Specification Figure 8-1 Mechanical Size 34 / 40...

  • Page 38: Labeling And Ordering Information

    The label of M20D module is as follows: Figure 9-1 Module Label 9.1.1 T/N Code The M20D product number is shown below includes information such as the product ID and internal product features. Figure 9-2 T/N Label ① is the product ID: code: M20D/M21D, 20D means module M20D.

  • Page 39: Ordering Number

    ① is the hardware type. ② is the date of manufacture. ③④ is production serial number. 9.2 Ordering Number Table 9-1 Ordering Number Product Name Ordering Number Description M20D Multi-frequency, RTK, 85℃ M20D M20D A Multi-frequency, RTK, 105℃, automotive grade 36 / 40...

  • Page 40: Package

    Package 10 Package The M20D module is packaged in vacuum-sealed aluminum foil anti-static bags using tape and reel packaging, with desiccants and a humidity indicator card included. When soldering the module using the reflow process, please strictly follow the IPC-7350 standard for module handling.
  • Page 41 Package Internal Box Packaging External Box Packaging Figure 10 3 External Packaging Information 38 / 40...

  • Page 42: Appendix A Record Of Revision Of Documents

    Package Appendix A Record of Revision of Documents Ver. Creation/Revision Contents Release Date V1.0 Initial version 2023.04.08 Added hardware architecture V1.1 2023.05.16 Updated interface signal definitions V1.2 Added minimum design requirements 2023.09.13 V1.3 Added module certification icons 2024.05.08 V1.4 Modified the format throughout the document 2024.05.13 Updated module laser engraving image and V1.5...
  • Page 43 This manual provides information about the products of Hunan Bynav Technology Co., Ltd. (hereinafter referred to as Bynav Technology). The manual does not transfer any rights or licenses under the patents, copyrights, trademarks, ownership, etc. of the company or any third party in any form, implied or implied.

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