Murata GQM1555C2D5R6CB01 Series Reference Sheet

Rf high frequency chip monolithic ceramic capacitor

Hide thumbs

RF High Frequency Chip Monolithic Ceramic Capacitor

GQM1555C2D5R6CB01_ (0402, C0G, 5.6pF, DC200V)

_: packaging code

1.Scope

This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Electronic equipment.

2.MURATA Part NO. System

(Ex.)

GQM

(1)L/W

Dimensions

3. Type & Dimensions

(1)-1 L

(1)-2 W

1.0±0.05

0.5±0.05

4.Rated value

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

Temp. coeff

or　Cap. Change

0±30 ppm/°C

5.Package

mark

(8) Packaging

f180mm Reel

PAPER W8P2

f180mm Reel

PAPER W8P1

f330mm Reel

PAPER W8P2

Product specifications in this catalog are as of May.24,2014,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

GQM1555C2D5R6CB01-01

(2)T

(3)Temperature

Dimensions

Characteristics

(2) T

0.5±0.05

0.15 to 0.35

(4)

DC Rated

Temp. Range

Voltage

(Ref.Temp.)

25 to 125 °C

200 Vdc

(25 °C)

Packaging Unit

10000 pcs./Reel

20000 pcs./Reel

50000 pcs./Reel

5R6

(6)Capacitance

(4)DC Rated

(5)Nominal

Voltage

Capacitance

(Unit:mm)

0.3 min.

(6)

(5) Nominal

Capacitance

Tolerance

5.6 pF

±0.25 pF

Reference Sheet

B01

(7)Murata's

(8)Packaging

Tolerance

Control Code

Specifications and Test

Methods

(Operating

Temp. Range)

-55 to 125 °C

Code

Table of Contents

Need help?

Do you have a question about the GQM1555C2D5R6CB01 Series and is the answer not in the manual?

Questions and answers

Summary of Contents for Murata GQM1555C2D5R6CB01 Series

Page 1 GQM1555C2D5R6CB01_ (0402, C0G, 5.6pF, DC200V) _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) (7)Murata’s (6)Capacitance (1)L/W (2)T (3)Temperature...
Page 2 ■SPECIFICATIONS AND TEST METHODS Item Specification Test Method 1 Operating 5C : -55℃ to 125℃ Reference Temperature : 25℃ Temperature Range 2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, V or V whichever is larger, should be maintained within the rated voltage...
Page 3 ■SPECIFICATIONS AND TEST METHODS Item Specification Test Method The measured and observed characteristics should Preheat the capacitor at 120 to 150℃ for 1 minute. Resistance to Immerse the capacitor in an eutectic solder solution or Soldering Heat satisfy the specifications in the following table. Sn-3.0Ag-0.5Cu solder solution at 270±5℃...
Page 4 ■SPECIFICATIONS AND TEST METHODS Adhesive Strength of Termination, Vibration Resistance,Temperature Cycle, Test method : Deflection Humidity ,Humidity Load,High Temperature Load ・Test substrate ・Test substrate Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs 　　　　　　　　 (Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin) Thickness : 0.8mm Thickness : 0.8mm...
Page 5 PACKAGING GQM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GQM15 10000(W8P2) 20000(W8P1) 50000(W8P2) GQM18 4000 10000 4000 10000 GQM21 1000 4000 GQM22 1.2 Dimensions of Tape...
Page 6 PACKAGING GQM Type 　(3)GQM18/GQM21 (in mm) 4.0±0.1 4.0±0.1 2.0±0.05 +0.1 φ1.5 Ａ 1.1 max. Code GQM18 GQM21 1.05±0.1 1.55±0.15 1.85±0.1 2.3±0.15 　(4)GQM22 4.0±0.1 4.0±0.1 2.0±0.1 0.25±0.1 +0.1 φ1.5 Ａ 2.5 max. Code GQM22 2.8* 3.5* *Nominal Value JEMCNP-01900A...
Page 7 ( 単位： mm) PACKAGING GQM Type Fig.1 Package Chips (in mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 10±1.5 16.5 max. Fig.3 Taping Diagram Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2. Bottom Tape :Thickness 0.05 (Only a bottom tape existence ) Base Tape : As specified in 1.2.
Page 8 PACKAGING 詰め状態 ( 単位： mm) GQM Type 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. (in mm) Tail vacant Section Chip-mounting Unit...
Page 9: Limitation Of Applications
Caution ■ Limitation of Applications Please contact us before using our products for the applications listed below 　 which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. 　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment 　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.)
Page 10 Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to ensure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range.
Page 11 Caution 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
Page 12 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. [DC Voltage Characteristics] Sample: X7R Characteristics 0.1μF, Rated Voltage 50VDC Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
Page 13: Vibration And Shock
Caution 7.Vibration and Shock 1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. 2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor.
Page 14 Caution ■ Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
Page 15 Caution 2.Information before Mounting 1. Do not re-use capacitors that were removed from the equipment. 2. Confirm capacitance characteristics under actual applied voltage. 3. Confirm the mechanical stress under actual process and equipment use. 4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5.
Page 16 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Reflow deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering...
Page 17 Caution 4-2.Flow Soldering 1. Do not apply flow soldering to chips not listed in Table 2. [Standard Conditions for Flow Soldering] Table 2 Temperature(℃) Part Number Temperature Differential Soldering Soldering Peak Gradual Temperature ΔT Cooling ΔT≦150℃ GQM18/GQM21 Preheating Peak Temperature Preheating 2.
Page 18 Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Page 19 Caution 3. Optimum solder amount when re-working with a soldering iron 3-1. In the case of 0603 (in inch) / 1608 (in mm) and smaller sizes (GQM15/18), the top of the solder fillet should Solder Amount be lower than 2/3 of the thickness of the component or 0.5mm, whichever is smaller.
Page 20 Caution 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that caused bending or twisting the board. 1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Page 21 Caution [In the case of Double-sided Mounting] Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the above method. Therefore, implement the following measures to prevent stress from being applied to the components. 　...
Page 22 Caution 8. Assembly 1. Handling If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors. Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
Page 23 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
Page 24 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1.Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
Page 25: Pcb Design
Notice ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
Page 26 Notice 2. Land Dimensions Chip Capacitor 2-1. Chip capacitors can be cracked due to the stress Land of PCB bending , etc. if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
Page 27: Adhesive Application
Notice 3. Board Design When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size and material of the board. Relationship with amount of strain to the board thickness, length, width, etc.] ε= Relationship between load and strain 2Ewh...
Page 28 Notice 4.Flux Application 1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability, so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.) 2. Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless there is sufficient cleaning.
Page 29 Notice ■ Others 1.Transportation 1. The performance of a capacitor may be affected by the conditions during transportation. 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation. (1) Climatic condition 　･ low air temperature：-40℃ ･...
Page 30 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.

This manual is also suitable for:

Gqm1555c2d5r6cb01d

Murata GQM1555C2D5R6CB01 Series Reference Sheet

Table of Contents

Need help?

Questions and answers

Related Manuals for Murata GQM1555C2D5R6CB01 Series

Summary of Contents for Murata GQM1555C2D5R6CB01 Series

Page 9: Limitation Of Applications

Page 13: Vibration And Shock

Page 25: Pcb Design

Page 27: Adhesive Application

This manual is also suitable for:

Table of Contents