Lenovo 11R80052US Hardware Maintenance Manual
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Lenovo 11R80052US Hardware Maintenance Manual

Lenovo 11R80052US Hardware Maintenance Manual

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M75s Gen 2
Hardware Maintenance Manual

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  • Page 1 M75s Gen 2 Hardware Maintenance Manual...
  • Page 2 Fourth Edition (February 2024) © Copyright Lenovo 2022, 2024. LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services Administration “GSA” contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-...

  • Page 3: Table Of Contents

    ..Chapter 7. Notices and Chapter 5. Diagnostics ..39 trademarks ....75 © Copyright Lenovo 2022, 2024...
  • Page 4 M75s Gen 2 Hardware Maintenance Manual...

  • Page 5: About This Manual

    Important: This manual is intended only for trained service technicians who are familiar with ThinkCentre computers. Use this manual along with the advanced diagnostic tests to troubleshoot problems effectively. Before servicing a ThinkCentre computer, be sure to read and understand Chapter 1 “Important safety information” on page 1. © Copyright Lenovo 2022, 2024...
  • Page 6 M75s Gen 2 Hardware Maintenance Manual...

  • Page 7: Chapter 1. Important Safety Information

    Avoid contact with hot components inside the computer. During operation, some components become hot enough to burn the skin. Before you open the computer cover, turn off the computer, disconnect power, and wait approximately 10 minutes for the components to cool. © Copyright Lenovo 2022, 2024...

  • Page 8: Electrical Safety

    Electrical safety CAUTION: Electrical current from power, telephone, and communication cables can be hazardous. To avoid personal injury or equipment damage, disconnect the attached power cords, telecommunication systems, networks, and modems before you open the computer covers, unless instructed otherwise in the installation and configuration procedures.

  • Page 9: Safety Inspection Guide

    – Power supply units – Pumps – Blowers and fans – Motor generators and similar units. (This practice ensures correct grounding of the units.) • If an electrical accident occurs: – Use caution; do not become a victim yourself. – Switch off power. –...

  • Page 10: Handling Electrostatic Discharge-Sensitive Devices

    Handling electrostatic discharge-sensitive devices Any computer part containing transistors or integrated circuits (ICs) should be considered sensitive to electrostatic discharge (ESD). ESD damage can occur when there is a difference in charge between objects. Protect against ESD damage by equalizing the charge so that the machine, the part, the work mat, and the person handling the part are all at the same charge.
  • Page 11 • Spanish DANGER Electrical current from power, telephone and communication cables is hazardous. To avoid a shock hazard: • Do not connect or disconnect any cables or perform installation, maintenance, or reconfiguration of this product during an electrical storm. • Connect all power cords to a properly wired and grounded electrical outlet. •...
  • Page 12 When laser products (such as CD-ROMs, DVD-ROM drives, fiber optic devices, or transmitters) are installed, note the following: • Do not remove the covers. Removing the covers of the laser product could result in exposure to hazardous laser radiation. There are no serviceable parts inside the device. •...
  • Page 13 Chapter 1 Important safety information...
  • Page 14 ≥18 kg (37 lb) ≥32 kg (70.5 lb) ≥55 kg (121.2 lb) M75s Gen 2 Hardware Maintenance Manual...
  • Page 15 PERIGO A corrente elétrica proveniente de cabos de alimentação, de telefone e de comunicações é perigosa. Para evitar risco de choque elétrico: • Não conecte nem desconecte nenhum cabo ou execute instalação, manutenção ou reconfiguração deste produto durante uma tempestade com raios. •...
  • Page 16 PRECAUCIÓN: Quando produtos a laser (como unidades de CD-ROMs, unidades de DVD-ROM, dispositivos de fibra ótica ou transmissores) estiverem instalados, observe o seguinte: • Não remova as tampas. A remoção das tampas de um produto a laser pode resultar em exposição prejudicial à...
  • Page 17 Chapter 1 Important safety information...
  • Page 18 M75s Gen 2 Hardware Maintenance Manual...
  • Page 19 Chapter 1 Important safety information...
  • Page 20 DANGER Le courant électrique provenant de l'alimentation, du téléphone et des câbles de transmission peut présenter un danger. Pour éviter tout risque de choc électrique : • Ne manipulez aucun câble et n'effectuez aucune opération d'installation, d'entretien ou de reconfiguration de ce produit au cours d'un orage.
  • Page 21 Connexion Déconnexion 1. Mettez les unités HORS TENSION. 1. Mettez les unités HORS TENSION. 2. Commencez par brancher tous les cordons sur les 2. Débranchez les cordons d'alimentation des prises. unités. 3. Débranchez les câbles d'interface des connecteurs. 3. Branchez les câbles d'interface sur des 4.
  • Page 22 ≥18 kg (37 lb) ≥32 kg (70.5 lb) ≥55 kg (121.2 lb) ATTENTION: Soulevez la machine avec précaution. ATTENTION: L'interrupteur de contrôle d'alimentation de l'unité et l'interrupteur dubloc d'alimentation ne coupent pas le courant électrique alimentantl'unité. En outre, le système peut être équipé de plusieurs cordonsd'alimentation.
  • Page 23 • Geräte niemals einschalten, wenn Hinweise auf Feuer, Wasser oder Gebäudeschäden vorliegen. • Die Verbindung zu den angeschlossenen Netzkabeln, Telekommunikationssystemen, Netzwerken und Modems ist vor dem Öffnen des Gehäuses zu unterbrechen, sofern in den Installations- und Konfigurationsprozeduren keine anders lautenden Anweisungen enthalten sind. •...
  • Page 24 Einige Lasergeräte enthalten eine Laserdiode der Klasse 3A oder 3B. Beachten Sie Folgendes: Laserstrahlung bei geöffneter Verkleidung. Nicht in den Strahl blicken. Keine Lupen oder Spiegel verwenden. Strahlungsbereich meiden. ≥18 kg ≥32 kg ≥55 kg ACHTUNG: Arbeitsschutzrichtlinien beim Anheben der Maschine beachten. ACHTUNG: Mit dem Netzschalter an der Einheit und am Netzteil wird die Stromversorgung für die Einheit nicht unterbrochen.
  • Page 25 Chapter 1 Important safety information...
  • Page 26 PERICOLO La corrente elettrica proveniente dai cavi di alimentazione, del telefono e di comunicazione può essere pericolosa. M75s Gen 2 Hardware Maintenance Manual...
  • Page 27 Per evitare il rischio di scosse elettriche: • Non collegare o scollegare qualsiasi cavo oppure effettuare l'installazione, la manutenzione o la riconfigurazione del prodotto durante un temporale. • Collegare tutti i fili elettrici a una presa di alimentazione correttamente cablata e dotata di messa a terra.
  • Page 28 Quando vengono installati prodotti laser (quali CD-ROM, unità DVD-ROM, unità a fibre ottiche o trasmittenti), tener presente quanto segue: • Non rimuovere gli sportelli. L'apertura di un'unità laser può determinare l'esposizione a radiazioni laser pericolose. All'interno dell'unità non vi sono parti su cui effettuare l'assistenza tecnica. •...
  • Page 29 Chapter 1 Important safety information...
  • Page 30 PELIGRO La corriente eléctrica procedente de cables de alimentación, teléfonos y cables de comunicación puede ser peligrosa. Para evitar el riesgo de descarga eléctrica: • No conecte ni desconecte los cables ni realice ninguna tarea de instalación, mantenimiento o reconfiguración de este producto durante una tormenta eléctrica. •...
  • Page 31 • Cualquier equipo que se conecte a este producto también debe conectarse a tomas de corriente debidamente cableadas. • Siempre que sea posible, utilice una sola mano para conectar o desconectar los cables de señal. • No encienda nunca un equipo cuando hay señales de fuego, agua o daños estructurales. •...
  • Page 32 PELIGRO Algunos productos láser tienen incorporado un diodo láser de clase 3A o clase 3B. Tenga en cuenta lo siguiente: Cuando se abre, queda expuesto a radiación láser. No mire directamente al rayo láser, ni siquiera con instrumentos ópticos, y evite exponerse directamente al rayo láser. ≥18 kg ≥32 kg ≥55 kg...

  • Page 33: Chapter 2. Important Service Information

    • Do not drop a system board or apply any excessive force to it. • Avoid rough handling of any kind. • Avoid bending a system board and hard pushing to prevent cracking at each Ball Grid Array (BGA) chipset. © Copyright Lenovo 2022, 2024...

  • Page 34: How To Use Error Codes

    Dynamic Configure To Order (CTO) model This model provides the ability for a customer to configure a Lenovo solution from a Web site, and have this configuration sent to fulfillment, where it is built and shipped directly to the customer. The machine label and eSupport will load these products as the 4-character MT, 4-character model, and 2-character country code.

  • Page 35: Chapter 3. Product Overview

    5. Storage drive activity indicator 6. ThinkCentre 7. Microphone connector 8. Headset connector ™ 9. USB-C (3.2 Gen 1) connector 10. USB 3.2 connectors Gen 1 11. USB 3.2 connectors Gen 2 12. Internal speaker * for selected models © Copyright Lenovo 2022, 2024...

  • Page 36: Rear

    Rear ® 1. Audio line-out connector 2. DisplayPort out connectors ™ 3. HDMI out connector 4. USB 2.0 connectors 5. USB 2.0 connector (with smart power-on) 6. Security-lock slot 7. Serial connector 8. Ethernet connector 9. Padlock loop 10. E-lock slots 11.

  • Page 37: Chapter 4. Service Checkout And Symptom-To-Fru Index

    • Processor or hard disk drive upgrades • Failure symptom – Do diagnostics indicate a failure? – What, when, where, single, or multiple systems? – Is the failure repeatable? – Has this configuration ever worked? © Copyright Lenovo 2022, 2024...

  • Page 38: Symptom-To-Fru Index

    – If it has been working, what changes were made prior to its failing? – Is this the original reported failure? • Diagnostics version – Type and version level • Hardware configuration – Print (print screen) configuration currently in use –...

  • Page 39: Power Supply Problems

    Error FRU/Action The boot sector on the startup drive is corrupted. The drive must be formatted. Do the following: 1. Attempt to back up the data on the failing hard disk drive. 2. Using the operating system programs, format the hard disk drive.

  • Page 40: Post Error Codes

    POST error codes Each time you turn on the system, it performs a series of tests that check the operation of the system and some options. This series of tests are called the Power-On Self-Test, or POST. POST checks the following operations: •...

  • Page 41: Miscellaneous Error Conditions

    Miscellaneous error conditions Message/Symptom FRU/Action Changing display colors Display/Monitor Computer will not power-off. See “Hard disk drive boot 1. Power Switch error” on page 32. 2. System Board 3. Riser card, if installed. Computer will not RPL from server 1. Ensure that the network is in startup sequence as the first device or the first device after diskette.

  • Page 42: Undetermined Problems

    Message/Symptom FRU/Action Non-system disk or disk error-type message with a 1. Diskette Drive known-good diagnostic diskette. 2. System Board 3. Diskette Drive Cable Other display symptoms not listed above (including blank 1. Display or illegible display) 2. System Board Power-on indicator or hard disk drive in-use light not on, 1.
  • Page 43 2. Remove or disconnect the following components (if installed) one at a time. a. External devices (modem, printer, or mouse) b. Any adapters c. Memory modules d. Extended video memory e. External Cache f. External Cache RAM g. Hard disk drive h.
  • Page 44 M75s Gen 2 Hardware Maintenance Manual...

  • Page 45: Chapter 5. Diagnostics

    4. Run the diagnostic program. 5. Recover your operating system. See “” on page . 6. If the problem persists, contact Lenovo. UEFI diagnostic program A UEFI diagnostic program is preinstalled on the computer. It enables you to test memory modules and internal storage devices, view system information, and check and recover bad sectors on internal storage devices.

  • Page 46: Lenovo Diagnostic Tools

    Note: The options on the main screen might vary, depending on the hardware configuration and the UEFI diagnostic program version preinstalled on the computer. Lenovo diagnostic tools For information about Lenovo diagnostic tools, go to: https://pcsupport.lenovo.com/lenovodiagnosticsolutions Self-help resources Use the following self-help resources to learn more about the computer and troubleshoot problems.
  • Page 47 • Setup Guide want. • This User Guide • Regulatory Notice Lenovo Support Web site with the latest support information of the following: • Drivers and software • Diagnostic solutions https://pcsupport.lenovo.com • Product and service warranty •...
  • Page 48 M75s Gen 2 Hardware Maintenance Manual...

  • Page 49: Chapter 6. Hardware Removal And Installation

    Screw driver: Philips Head 01 1, Shank length greater than 6 ThinkSation/DT Common tool inches Screw driver: Philips Head 02 2, Shank length greater than 6 ThinkSation/SC/DT Common tool inches Screw driver: Torx Head T5 IdeaPad Common tool © Copyright Lenovo 2022, 2024...
  • Page 50 Tool name Specific Product scope Tool type Screw driver: Torx Head T15 T15, for Chassis outside ThinkSation Common tool Screw driver: Torx Head T20 T20, Shank length greater than ThinkSation Common tool 6 inches, for heatsink and CPU Screw driver: Torx Head T30 T30, Shank length greater than ThinkSation Common tool...

  • Page 51: Major Frus And Crus

    Tool name Specific Product scope Tool type Heat gun Special tool Brown brush 25 mm to 35 mm wide Special tool Note: The silicone grease can be applied to the surfaces of the microprocessor and heat sink to eliminate air gaps.
  • Page 52 Number Description Self-service CRU Optional-service CRU VR heat sink Heat sink and fan assembly Memory module Microprocessor System board Wi-Fi card* Wi-Fi card shield* M75s Gen 2 Hardware Maintenance Manual...
  • Page 53 Number Description Self-service CRU Optional-service CRU M.2 solid-state drive* M.2 solid-state drive bracket* Heat sink and thermal pad (type 2)* Heat sink and thermal pad (type 1)* Cover presence switch Card reader* Card reader bracket* Illuminated red dot cable and clip Power button Front I/O bracket Thermal sensor...

  • Page 54: System Board

    For detailed FRU and CRU information, such as the FRU part numbers and supported computer models, go http://www.lenovo.com/serviceparts-lookup System board 4-pin power connector Microprocessor socket Microprocessor fan connector Memory slot (DIMM1) Memory slot (DIMM2) Memory slot (DIMM3) Memory slot (DIMM4)

  • Page 55: Removing And Installing Hardware

    System fan connector E-lock connector Cover presence switch connector Removing and installing hardware This section provides instructions on how to remove and install hardware for your computer. Attention: Do not open your computer or attempt any repair before reading and understanding the Chapter 1 “Important safety information”...

  • Page 56: Front Bezel

    Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool. For access, do the following: 1. Remove any media from the drives and turn off all connected devices and the computer. 2.

  • Page 57: Optical Drive

    Replacement procedure Optical drive Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the computer cover. See “Computer cover” on page 49. 2. Disconnect the signal and power cable from the optical drive. Chapter 6 Hardware removal and installation...
  • Page 58 Replacement procedure M75s Gen 2 Hardware Maintenance Manual...

  • Page 59: Drive Bay Assembly

    Drive bay assembly Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, remove the following parts in order: • “Computer cover” on page 49 • “Front bezel” on page 50 Replacement procedure Chapter 6 Hardware removal and installation...

  • Page 60: Hard Disk Drive

    Hard disk drive Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Attention: The internal storage drive is sensitive. Inappropriate handling might cause damage and permanent loss of data. When handling the internal storage drive, observe the following guidelines: •...
  • Page 61 Removal steps for 2.5-inch primary hard disk drive Remove the storage converter with the 2.5-inch primary storage drive. See “3.5-inch primary hard disk drive” on page 54. Chapter 6 Hardware removal and installation...
  • Page 62 Removal steps for 2.5-inch secondary hard disk drive For access, do the following: 1. Remove the following parts in order, if any: • “Computer cover” on page 49 • “Front bezel” on page 50 • “Optical drive” on page 51 •...

  • Page 63: M.2 Solid-State Drive And Heat Sink

    M.2 solid-state drive and heat sink Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. The heat sink might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool.
  • Page 64 • For computers with the heat sink for the M.2 solid-state drive, do one of the following depending on the computer model: – Type 1 Note: Remove the film that covers the thermal pad (if any) when installing the M.2 solid-state drive and the heat sink.
  • Page 65 Note: Remove the film that covers the thermal pad (if any) when installing the M.2 solid-state drive and the heat sink. – Type 3 Note: Remove the film that covers the thermal pad (if any) when installing the M.2 solid-state drive and the heat sink.

  • Page 66: M.2 Solid-State Drive Bracket

    M.2 solid-state drive bracket Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, remove the following parts in order, if any: • “Computer cover” on page 49 • “Front bezel” on page 50 •...

  • Page 67: Front Wi-Fi Antenna

    Removal steps Note: During installation, ensure that you connect the gray cable to the connector labeled AUX on the card, and the black cable to the connector labeled MAIN. Front Wi-Fi antenna Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions.

  • Page 68: Memory Module

    Replacement procedure Memory module Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Ensure that you follow the installation order for memory modules shown in the following illustration. For access, remove the following parts in order, if any: M75s Gen 2 Hardware Maintenance Manual...

  • Page 69: Pci-Express Card

    • “Computer cover” on page 49 • “Front bezel” on page 50 • “Drive bay assembly” on page 53 Replacement procedure Note: During the installation, ensure that you align the memory module to the slot and press down on both ends until the latches are fully engaged with a click.

  • Page 70: Power Supply Assembly

    Note: Remove any PCI-Express connector cables that impede the installation of PCI-Express cards. Power supply assembly Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Although there are no moving parts in the computer after the power cord has been disconnected, the following warnings are required for your safety.

  • Page 71: E-Lock

    E-lock Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the following parts in order, if any: • “Computer cover” on page 49 • “PCI-Express card” on page 63 2.

  • Page 72: Illuminated Red Dot Cable

    Removal steps Illuminated red dot cable Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the following parts in order, if any: • “Computer cover” on page 49 •...

  • Page 73: Front I/O Bracket And Power Button

    • “Computer cover” on page 49 • “Front bezel” on page 50 • “Drive bay assembly” on page 53 2. Disconnect the thermal sensor cable from the system board. Removal steps Front I/O bracket and power button Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions.

  • Page 74: Card Reader And Card Reader Bracket

    Card reader and card reader bracket Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the following parts in order, if any: • “Computer cover” on page 49 •...

  • Page 75: Heat Sink And Fan Assembly

    • “Front I/O bracket and power button” on page 67 2. Disconnect the card reader cable from the system board. Removal steps Heat sink and fan assembly Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions.

  • Page 76: Microprocessor

    Replacement procedure Microprocessor Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. CAUTION: The heat sink and microprocessor might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool.

  • Page 77: Cover Presence Switch

    Notes: • Touch only the edges of the microprocessor. Do not touch the gold contacts on the bottom. • Do not drop anything onto the microprocessor socket while it is exposed. The socket pins must be kept as clean as possible. Removal steps Cover presence switch Prerequisite...
  • Page 78 For access, do the following: 1. Remove the following parts in order, if any: • “Computer cover” on page 49 • “Front bezel” on page 50 • “Drive bay assembly” on page 53 • “M.2 solid-state drive and heat sink” on page 57 •...

  • Page 79: Vr Heatsink

    • The failing system board must be returned with a microprocessor socket cover to protect the pins during shipping and handling. VR heatsink Prerequisite Before you start, read Generic Safety and Compliance Notices, and print the following instructions. CAUTION: The heat sink and microprocessor might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool.
  • Page 80 Note: Remove the films that cover the thermal pads when installing the VR heat sink. M75s Gen 2 Hardware Maintenance Manual...

  • Page 81: Chapter 7. Notices And Trademarks

    Lenovo representative for information on the products and services currently available in your area. Any reference to a Lenovo product, program, or service is not intended to state or imply that only that Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any Lenovo intellectual property right may be used instead.
  • Page 82 Actual results may vary. Users of this document should verify the applicable data for their specific environment. This document is copyrighted by Lenovo and is not covered by any open source license, including any Linux agreement(s) which may accompany software included with this product. Lenovo may update this document at any time without notice.

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