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GAOTek IDK-150 Manual

Wifi development motherboard
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P a g e | 1
Product Name
GAOTek Wifi Development Motherboard
Product SKU
GAOTek-IDK-150
https://gaotek.com/product/gaotek-wifi-
Product URL
development-motherboard/
Contact us:
sales@gaotek.com
Based in New York City & Toronto, GAO Tek Inc. is ranked as one of the top 10 global B2B technology suppliers.
GAO ships overnight within the U.S. & Canada & provides top-notch support thanks to its 4 decades of
experience.

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Summary of Contents for GAOTek IDK-150

  • Page 1 P a g e | 1 Product Name GAOTek Wifi Development Motherboard Product SKU GAOTek-IDK-150 https://gaotek.com/product/gaotek-wifi- Product URL development-motherboard/ Contact us: sales@gaotek.com Based in New York City & Toronto, GAO Tek Inc. is ranked as one of the top 10 global B2B technology suppliers.

  • Page 2: Table Of Contents

    P a g e | 2 CONTENTS PRODUCT BRIEF......................4 PRODUCT OVERVIEW....................5 PRODUCT SPECIFIATION LIST................. 7 INTERFACE DEFINITION ................... 9 4.1. Micro-SIM Card Socket....................9 4.2. POE PD Header ......................9 4.3. DC-12V Input Header ....................10 4.4. I2C Bus Header ......................10 4.5.
  • Page 3 P a g e | 3 4.26. 4-Pole HP/Mic Jack....................19 4.27. Audio Input Header....................20 4.28. Audio Line Output ....................20 4.29. Backlight Control Header 2 ..................20 4.30. VLCDB LVDS-2/EDP-1 Voltage Header ..............21 4.31. Keypad and Switch Header..................21 4.32.

  • Page 4: Product Brief

    P a g e | 4 GAOTek Wifi Development Motherboard 1. PRODUCT BRIEF The chip has the characteristics of high performance and high expansion application. At present, it is the most cost-effective chip, and its hardware specifications are in the leading position in the industry.

  • Page 5: Product Overview

    P a g e | 5 PRODUCT OVERVIEW Mainboard is based on high-performance application processor platform. Is a low power, high performance processor for computing, personal mobile internet devices and other smart device applications. It integrates dual-core Cortex-A55 clocked at up to 2.0GHz, with superior computing performance, 2D/3D graphics processing capabilities and Full HD video codec capabilities.
  • Page 6 P a g e | 6 Based in New York City & Toronto, GAO Tek Inc. is ranked as one of the top 10 global B2B technology suppliers. GAO ships overnight within the U.S. & Canada & provides top-notch support thanks to its 4 decades of experience.

  • Page 7: Product Specifiation List

    P a g e | 7 PRODUCT SPECIFIATION LIST System functions and interface features are shown in the following table. Function &Interface Detailed Description Cortex-A55 dual-core, up to 2.0GHz LPDDR4 2GB (4GB|8GB optional) Storage The default comes with an 16GB EMMC NAND chip that can scale up to 128GB LVDS-1 30-pin industry-standard dual LVDS supporting VESA/JEITA format up to...
  • Page 8 P a g e | 8 SPI Bus SPI pin header for SPI UART and etc. Real Time Clock Ultra-low-power RTC circuit (CR1220 battery) with timer and alarm functionalities LED Indicator Red LED indicator for standby and green LED indicator for running Buttons Recovery mode button and power switch button DC Input...

  • Page 9: Interface Definition

    P a g e | 9 INTERFACE DEFINITION 4.1. Micro-SIM Card Socket Note: The position and direction of the notch of the SIM card is as shown in the figure; the silk screen of the V2.0 version is wrongly marked as EDP-2 Screen 2 Header. 4.2.

  • Page 10: Dc-12V Input Header

    P a g e | 10 4.3. DC-12V Input Header SIP 2.54mm-Square pad is pin 1. Pin#n1 Definition Note DC Power Input (9 to 15V) DC Power Input (9 to 15V) Power Ground 4.4. I2C Bus Header Power Ground 2.0mm- Square pad is pin 1.

  • Page 11: Serial Port 5

    P a g e | 11 4.5. DB-9 Serial Port 5 The output level is RS-232 (Default) or TTL. The interface port on the software corresponds to /dev/ttyS5. Pin# Definition Note Not Connected Data receive (RS-232 or TTL) Data transmit (RS-232 or TTL) Not Connected Digital Ground Not Connected...

  • Page 12: Speaker Header

    P a g e | 12 4.9. Speaker Header SIP 2.0mm - Square pad is pin 1. Pin# Definition Note Speaker right channel + 4.10. USB 2.0 DIP Header Speaker right channel - 2.54mm - Square Speaker left channel - pad is pin Speaker left channel + Pin#...

  • Page 13: Data Serial Port 2

    P a g e | 13 4.11. Data Serial Port 2 SIP 2.0mm - Square pad is pin 1. The output level is RS-232 by default and TTL option. The related software device node name is ttyS2. Pin# Definition Note Digital Ground data reception data transmission...

  • Page 14: Usb 2.0 Dip Header

    P a g e | 14 4.13. USB 2.0 DIP Header DIP 2.54mm - Square pad is pin 1. Pin# Definition Pin# - 1 Definition - 2 Note: Both USB ports of this interface are connected to the 1x7 Hub group of Host2. The motherboard is connected to the USB binocular camera. It is strongly recommended to connect to the ports of Host2 1x7 Hub group and Host3 1x4 Hub group respectively.

  • Page 15: Battery Supply Header

    P a g e | 15 4.16. Battery Supply Header 3-cell battery header (SIP 2.0mm-Square pad is pin 1). Pin# Definition Note Power Ground Power Ground 3-cell lithium battery supply 3-cell lithium battery supply Note: Please do not use the 12V backlight LCD screen under battery power supply, otherwise it will not start or work normally.

  • Page 16: Lvds-2 Screen 2 Header

    P a g e | 16 4.18. LVDS-2 Screen 2 Header Dual LVDS screen 2 header [DIP 2.0mm-Square pad is pin 1]. Pin# Definition Pin# - 1 Definition - 2 VLCD VLCD VLCD RXO0- RXO0+ RXO1- RXO1+ RXO2- RXO2+ RXOC- RXOC+ RXO3- RXO3+...

  • Page 17: Backlight Control Header 1

    P a g e | 17 4.20. Backlight Control Header 1 Default Main Port (SIP 2.0mm-Square pad is pin 1). Pin# Definition Note If the current exceeds 1A, external 12V is recommended If the current exceeds 1A, it is recommended to connect an external 12V power supply The default output is 3.3V 3.3V square wave (40KHz Freq.)

  • Page 18: Vlcda Lvds-1/Edp-2 Voltage Header

    P a g e | 18 Digital Ground USB Differential Data+ USB Differential Data- 5V power supply from PC Note: This port is the direct port of the main chip USB OTG port. The signal and the lower layer of Dual USB 2.0 Type A are in the same group, and the two cannot be connected at the same time.

  • Page 19: Edp-1 Screen 1 Header

    P a g e | 19 4.25. EDP-1 Screen 1 Header DIP 2.0mm-Square pad is pin 1. Pin# Definition Pin# - 1 Definition - 2 VLCD VLCD TX0- TX0+ TX1- TX1+ TX2- TX2+ TX3- TX3+ AUX- AUX+ 3.3V Note: The logic of the EDP main screen must correspond to the VLCDB LVDS-2/EDP-1 Voltage Header VLCDB socket voltage jumper.

  • Page 20: Audio Input Header

    P a g e | 20 4.27. Audio Input Header SIP 2.0mm-Square pad is pin 1. Pin# Definition Note Audio Ground Mono microphone input Line input right channel Audio Ground Line input left channel 4.28. Audio Line Output SIP 2.0mm-Square pad is pin 1. Pin# Definition Note...

  • Page 21: Vlcdb Lvds-2/Edp-1 Voltage Header

    P a g e | 21 4.30. VLCDB LVDS-2/EDP-1 Voltage Header LCD Voltage Header (DIM 2.54mm - Square pad is pin 1). If pin 1 and 2 are jumper shorted, the VLCD of LVDS-2 Screen 2 Header and EDP-1 Screen 1 Header is 12V.

  • Page 22: Power Switch/Reset Header

    P a g e | 22 4.32. Power Switch/Reset Header As shown in the figure below: pins 1 and 2 are externally connected to a tact switch, short press the switch screen, and long press to switch on and off (software support is required);...

  • Page 23: Data Serial Port 3

    P a g e | 23 4.35. Data Serial Port 3 Built-in Serial Port 3 (SIP 2.0mm - Square pad is pin 1). The output level is TTL by default and it could be setup to RS-232 if required (RS-232 if U33 mounted). The related software device node name is ttyS3.

  • Page 24: Dual Usb 2.0 Type A

    P a g e | 24 4.38. Dual USB 2.0 Type A Note: Both USB ports of this interface are connected to the 1x7 Hub group of Host2. The motherboard is connected to the USB binocular camera. It is strongly recommended to connect to the ports of Host2 1x7 Hub group and Host3 1x4 Hub group respectively.

  • Page 25: Edp-2 Screen 2 Header

    P a g e | 25 4.41. EDP-2 Screen 2 Header DIP 2.0mm - Square pad is pin 1. Pin# Definition Pin# Definition VLCD VLCD TX0- TX0+ TX1- TX1+ TX2- TX2+ TX3- TX3+ AUX- AUX+ 3.3V Note: The logic of the EDP secondary screen must correspond to the J26 VLCDA socket voltage jumper.

  • Page 26: Precautions

    P a g e | 26 The PCB size is 170mm x 105mm and the fixing hole diameter is 3.0mm. The corresponding physical size parameters are shown in the figure below. For detailed size information, please consult the manufacturer for DXF file. 6.

  • Page 27: Software Guide

    P a g e | 27 1. Relative humidity of this product: 10% to 90%, no condensation. 2. The working temperature of this product: 0° to 70°. 3. This storage temperature of this product: -40 ° to 70 °. 4. Anti-static treatment is required during assembly and transportation of this product. 5.
  • Page 28 P a g e | 28 The port numbers of the internal serial port on the motherboard and the extended serial port software are as follows: Port Software Device Node /dev/ttyS5 /dev/ttyS2 /dev/ttyS4 /dev/ttyS3 /dev/ttyS7 Based in New York City & Toronto, GAO Tek Inc. is ranked as one of the top 10 global B2B technology suppliers. GAO ships overnight within the U.S.

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