Analog Technologies TEC14MEV1.0 Manual

Analog Technologies
Figure 1. The Physical Photo of TEC14MEV1.0
INTRODUCTION
This evaluation board TEC14MEV1.0 can only work with
our micro TEC controller TEC14M5V3R5AS. Purchase
them together.
The TEC14M5V3R5AS (there is no internal compensation
network inside) is an electronic module designed for driving
TEC with high stability and low noise. This evaluation board,
TEC14MEV1.0, is designed for evaluating the controller
TEC14M5V3R5AS conveniently. The size of the evaluation
board is 140mm130mm. It is recommended to read this
application note with the controller datasheet which provides
more detail information about the specifications and
application guidance for the controller.
The main purpose of using the evaluation board is to tune the
compensation network on the board for matching the
characteristics of users' thermal load. The objectives of the
tuning are to minimize the response time of the thermal
control loop and the dynamic temperature tracking errors,
while keeping the control loop stable.
The user will be able to set the maximum output voltage, set
the set-point temperature, monitor the output voltage and the
actual thermal load temperature, tune the compensation
network for matching the thermal load, etc.
BOARD DESCRIPTION
The TEC controller evaluation board TEC14MEV1.0 is
consisted of a complete tuning and application circuit for
driving a TEC. It can set the output voltage limit, tune the
compensation network, set internal operating temperature
point, and has an LED for indicating the temperature status of
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Evaluation Board for TEC Controllers
the controller, and has numerous connection pads for making
connections with external components and instruments. Its
photo is shown in Figure 1. The TEC control module is
located on the lower right of the TEC14MEV1.0 evaluation
board. The voltages of all its pins can be measured directly by
probing the vias on the left and right side of the module
sockets which are connected directly with pins of the
electronic module. Some of the pins are also connected to the
soldering pads with two vias on the edges of the board. The
names of all these nodes are marked on the board.
The silkscreen layer of the evaluation board is shown in Figure
2 with other top layers, including top silkscreen, top copper,
top solder mask, and multilayer (vias). Figure 3 only shows
the image of top silkscreen layer. There is no component in the
bottom side of the board, so that there is no bottom silkscreen
layer image.
Figure 2. Top Silkscreen Layer with Other Top Layers
There are solder pads on the left and right edges of the board.
These pads can be used for connecting the external
instruments or components with and the connections can be
made by soldering wires, clipping by alligator clips or probing
by probes. See Figure 1, 2 and 3. There are solder pads also on
the top and the lower side center of the board. These pads can
be used for connecting the external instruments or components
and the connections can be made by probing with probes or
soldering wires.
On the top of the board, there is a switch bank. A
potentiometer is located on the lower side the switch bank. On
the bottom of the board, there are 5 switch banks. When the
set-point temperature and the actual target temperature are less
than 0.1° C in difference, the LED on the top lower location
will be lit up.
On the board, the compensation network has been initialized
before the ship. The initial values of these parameters are
shown in table 1.
Email: staff@analogti.com/sales@analogti.com
TEC14MEV1.0
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