Summary of Contents for BILIAN ELECTRONIC LB-Link BL-R8189RM2
- Page 1 BL-R8189RM2 802.11n 150Mbps WLAN SDIO Module Specification SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.cn...
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Page 2: Revision History
（Top View） （Bottom View） Module Name: BL-R8189RM2 Module Type: 802.11b/g/n 150Mbps 1T1R SDIO WLAN Module Revision: V1.4 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revised By Summary Revision Release Date 2020-07-18 Initial release Content optimization 2023-04-15 http://www.b-link.net.cn... -
Page 3: Block Diagram
1. Introduction BL- R8 1 8 9 RM2 product Accord with FCC CE and is 15 0 wireless SDIO adapter which has lower power consumption, high linearity output power, accords with IEEE802. 11b/g/n, and supports IEEE802. 11i safety protocol, along with IEEE 802. 11e standard service quality. It connects with other wireless device which accorded with these standards together, supports the new data encryption on 64/ 128 bit WEP and safety mechanism on WPA- PSK/WPA2 - PSK, WPA/WPA2. -
Page 4: General Specifications
1.3 General Specifications BL-R8189RM2 Module Name Chipset RTL8189ETV-CG IEEE802.11 b/g/n WLAN Standards Host Interface SDIO 3.0 for WLAN Antenna Connect to the external antenna through half hole 14*12.5*1.5mm (L*W*H) Dimension DC 3.3V±0.2V @ 350 mA (Max) Power Supply DC 3.3V±0.2V or 1.8V±0.1V I/O power supply Operation Temperature -20℃... -
Page 5: Electrical And Thermal Specifications
2.1 Pin Definition Description Type I/O Level Pin Name VDIO SDIO command/GSPI data input SDIO_CMD VDIO SDIO data 3 /GSPI chip select SDIO_D3 VDIO SDIO_D2 SDIO data 2 VDIO SDIO_D1 SDIO data 1 /GSPI data out VDIO SDIO data 0 /GSPI data output SDIO_D0 VDIO SDIO clock /GSPI clock... -
Page 6: Current Consumption
Input High Voltage Input Low Voltage Output High Voltage 2.97 Output Low Voltage 0.33 3.3 Digital 1.8V I/O DC Specifications Symbol Parameter Units Input High Voltage Input Low Voltage Output High Voltage 1.62 Output Low Voltage 0.18 3.4 Current Consumption Conditions : VDD33 =3.3V ;... - Page 7 4. WLAN RF Specifications 4.1 2.4G WLAN RF Specification Conditions : VDD33 =3.3V ; Ta:25℃ Features Description IEEE 802.11b/g/n WLAN Standard Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Ch1~Ch13 (For 20MHz Channels) Channels 802.11b (DSSS): CCK, DQPSK, DBPSK; 802.11g (OFDM): BPSK, QPSK, QAM16, QAM64; Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;...
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Page 8: Mechanical Specifications
802.11b@1Mbps < 8% 802.11b@11Mbps < 8% 802.11g@6Mbps < 10% 802.11g@54Mbps < 10% 802.11n@HT20_MCS0 < 10% 802.11n@HT20_MCS7 < 10% 802.11n@HT40_MCS0 < 10% 802.11n@HT40_MCS7 < 10% 5. Mechanical Specifications 5.1 Module Outline Drawing （Top View） （ Side View） （ Bottom View） Module dimension: 14.0*12.5*1.5mm (L*W*H; Tolerance: ±0.15mm) Module Bow and Twist：... -
Page 9: Application Information
5.2 Mechanical Dimensions (Top View) (Side View) (Bottom View） 6. Application Information 6.1 Typical Application Circuit http://www.b-link.net.cn... - Page 10 6.2 Recommend PCB Layout Footprint ( Design size: mm ) 6.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250 ℃ . http://www.b-link.net.cn...
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Page 11: Package Dimensions
7. Key Components Of Module Specification Parts Note Manufacturer Chipset Realtek Semiconductor Corp RTL8189ETV-CG Shenzhen Tie Fa Technology Limited BL-R8189RM2 Guangdong KINGSHINE ELECTRONICS CO,.LTD Quzhou Sunlord Electronics Co.,Ltd HUBEI TKD CRYSTAL ELECTRONIC SCIENCE AND TECHNOLOGY CO.,LTD Crystal 40MHz-3225 LUCKI CM ELECTRONICS CO.,LTD 8. -
Page 12: Storage Conditions
Package specification: 2000 modules per roll and 10,000 modules per box. Outer box size: 37.5*36*29cm. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt). Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. Each carton is packed with 5 boxes. - Page 13 Integration installation instruction 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer.
- Page 14 This module is limited used antenna as below: 2.4 GHz FPCB antenna Product Name 2400~2500MHz Frequency WLAN/BT/ZIGBEE Modulation support VSWR <=2 Return loss <=-8dB Omni-directional Radiation Gain（peak） 2.0dBi Polarization Linear Admitted Power Connector IPEX1 Efficiency 40%~70% RF Φ1.13 cable and length is 183 mm Cable...
- Page 15 2.4 Limited module procedures In accordance with 47CFR 15.212 Modular Transmitters and KDB 996369 D01 ‘ Module Equip Auth Guide v02’ . FCC ID:2AL6KBL-R8189RM2 cannot meet the integrated antenna and do not contain power supply regulation on the module. If a modular transmitter is approved as a “limited module,” then the module manufacturer isresponsible for approving the host environment that the limited module is used with.
- Page 16 The WFCO smart power control system gives the user control of devices throughout the RV, ranging from lights, to the water pump, to the awnings and slide outs. Whether using the APP through a smart device or using voice commands, the end user has complete control of their RV. The device is installed in the RV entrance, as shown in the drawing location 1.
- Page 17 2.5 Trace antenna designs If trace antenna designs are applicable, full-detail design specifications are required per D02 Module Q&A Question 11. For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces.
- Page 18 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable –...
- Page 19 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part ofthe information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc.
- Page 20 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product.
- Page 21 as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. the grantee is responsible for compliance to any other FCC rules and Explanation: notice that the final host should be required part 15 subpart B testing when the...
- Page 22 warning This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful Interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio...
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