TUYA BK3431Q Manual
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TUYA BK3431Q Manual

TUYA BK3431Q Manual

Onboard application development
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Onboard BK3431Q Application
Development
Version: 20240613
Online Version

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Summary of Contents for TUYA BK3431Q

  • Page 1 Onboard BK3431Q Application Development Version: 20240613 Online Version...

  • Page 2: Table Of Contents

    Contents Contents 1 RF schematic diagram 1.1 Reference schematic diagram of a 40-pin chip: ... . . 1.2 Reference schematic diagram of a 32-pin chip: ... . . 2 PCB design 2.1 Things to note .
  • Page 3 Contents The BK3431Q chip is a highly integrated Bluetooth 4.2 low energy (LE) single-mode device. Its data rate can be set to up to 2 Mbit/s. It integrates a high-performance radio frequency (RF) transceiver, baseband, ARM9E core, feature-rich peripheral units, programmable protocol, and profile to support Bluetooth LE applications. The built-in Flash memory makes it suitable for customized applications.

  • Page 4: Rf Schematic Diagram

    This schematic diagram is provided based on a reference module package of Tuya. Test points must be reserved for all pins on the onboard module package. If extra pins are used in addition to the above pins, reserve test points for the extra pins too.

  • Page 5: Reference Schematic Diagram Of A 40-Pin Chip

    1 RF schematic diagram 1.1 Reference schematic diagram of a 40-pin chip: 3 / 24...

  • Page 6: Reference Schematic Diagram Of A 32-Pin Chip

    1 RF schematic diagram 1.2 Reference schematic diagram of a 32-pin chip: 4 / 24...

  • Page 7: Pcb Design

    2 PCB design 2 PCB design During PCB design, place the chip, crystal, and RF trace on the top layer. At the bottom layer, ensure that the GND terminals at the bottom of the chip, crystal, and RF trace are connected to form a completed GND. Therefore, make the return circuit shortest and reduce interference.
  • Page 8 2 PCB design • The RF pad is placed between the chip matching position and the antenna matching position. The via should not be placed on the center of the pad but close to the edge of the center pad. •...
  • Page 9 2 PCB design • Pay attention to the selection of power inductors. A complete bill of materials (BOM) will be attached. • The distance between the antenna and the board edge is more than 12 mil, and the height of the antenna protruding from the lighting board is more than 7 mm.

  • Page 10: Onboard Antenna Design

    3 Onboard antenna design 3 Onboard antenna design Different types of antennas are supported, such as the monopole, helical antenna, PCB antenna, FPC antenna, and ceramic antenna. A certain clearance must be guaranteed around the antenna. You can choose a suitable antenna based on the shape and space of the product.
  • Page 11 3 Onboard antenna design Figure 2: • PCB antenna C Figure 3: For A60 light bulbs and similar products, the PCB antenna is usually used. Under acceptable shadow conditions, try to extend the PCB antenna out of the light board to ensure the antenna efficiency.

  • Page 12: Bill Of Materials

    Manufacturer model Manufacturer Description Position BK3431QQN40A BEKEN Bluetooth chip, BEKEN, BK3431Q, -40°C to 125°C, QFN40 5 mm × 5 mm V104K0201X5R6R3NAT Guangdong VIIYONG SMT capacitor, 0201, X5R, 0.1 µF, ±10%, 6.3V C1, C6, C8, C10, C12, and C13 CC0201MRX5R5BB105 Yageo SMT capacitor, 0201, X5R, 1 µF, ±10%, 6.3V...
  • Page 13 4 Bill of materials Murata General inductor, 3.9 nH, ±0.1 nH, 0.3R, 400 mA, 0201, SMT 0201WMF0000*** UniOhm SMT resistor, 0201, 0R, ±1%, 1/20W MPH160809S2R2MT Sunlord Power inductor, 2.2 µH, ±20%, L0603, Current carrying capacity >350 mA SX32Y016000B91T TKD Science and Technology Crystal, 16 MHz, 9 pF, 10 ppm (-20 to 85°C), SMD3225 ETST003279600E Hosonic...
  • Page 14 4 Bill of materials Position BK3431QQN40A BEKEN Bluetooth chip, BEKEN, BK3431Q, -40°C to 125°C, QFN40 5 mm × 5 mm V104K0201X5R6R3NAT Guangdong VIIYONG SMT capacitor, 0201, X5R, 0.1 µF, ±10%, 6.3V C1, C6, C8, C10, C12, and C13 CC0201MRX5R5BB105 Yageo SMT capacitor, 0201, X5R, 1 µF, ±10%, 6.3V...
  • Page 15 4 Bill of materials MPH160809S2R2MT Sunlord Power inductor, 2.2 µH, ±20%, L0603, Current carrying capacity >350 mA SX32Y016000B91T TKD Science and Technology Crystal, 16 MHz, 9 pF, 10 ppm (-20 to 85°C), SMD3225 ETST003279600E Hosonic Crystal, 32.768 kHz, 20 ppm, 12.5 pF, SMD3215 0201WMF0000*** UniOhm SMT resistor, 0201, 0R, ±1%, 1/20W...

  • Page 16: Test Jig Preparation

    5 Test jig preparation 5 Test jig preparation • Break out the test points for all pins in use. • If there are strip lights and infrared requirements, the test jig documents must indicate that the test points need to be connected to the strip lights and infrared devices with jumper wires, which can be led out by an ejector pin.

  • Page 17: Spi Flashing

    6 SPI flashing 6 SPI flashing 6.1 Backplane SPI flashing Prepare a USB to SPI adapter board that has a writer and USB cable. The writer pro- vides two SPI interfaces, SW SPI and HW SPI, corresponding to two flashing methods. We use the SW SPI interface.
  • Page 18 6 SPI flashing For the wiring of SW SPI, the wire sequence is shown as follows: Procedure 1. Open the flashing software and select the desired firmware to be downloaded. For more information about the firmware location, see the subsequent things to note.

  • Page 19: Spi Flashing For Backplane With Test Jig

    6 SPI flashing 4. After the flashing is successful, remove the writer, and power on again to search for Bluetooth broadcasts. Things to note • The location and name of the firmware in the folder are shown as follows. Figure 4: File •...
  • Page 20 6 SPI flashing 1. Insert the USB-SPI board into the backplane in the correct direction, as shown below. Make sure the correct SPI interface is inserted. 2. Open the MXCHIP tool and repeat the above module SPI flashing method. 18 / 24...

  • Page 21: Production Test

    7 Production test 7 Production test 7.1 Flash boot firmware 1. Flash the boot firmware on the backplane to the module by grounding the I/O0 lead on the backplane. The figure below shows the wiring method of connecting the I/O0 lead on the backplane to the ground.

  • Page 22: Firmware Flashing And Authorization

    7 Production test to the test jig. 7.2 Firmware flashing and authorization Connect the test jig in the same manner as boot flashing but disconnect the I/O0 from GND of the backplane. Then, you can start flashing and authorization. 1. Open the software Cloud Module Burning Authorization Platform. Click File >...
  • Page 23 7 Production test 2. Click Enter Token on the main interface. In the Firmware Update > Enter Token field, enter the token of BK3431Q. In the Select work station field, select Burning Authorization from the dropdown list and click OK.
  • Page 24 7 Production test 22 / 24...

  • Page 25: Fixed Frequency Test

    8 Fixed frequency test 8 Fixed frequency test Firmware and host: • Host test wiring: 3V3, GND, UART1 TX, and UART1 RX • How to use the host: Figure 5: Host 1. Select the correct COMM port. The COMM port must be below COM10. 23 / 24...
  • Page 26 8 Fixed frequency test Otherwise, the software might not recognize it. 2. Click Open. 3. In the HW TEST section, click Enter DUT. At this time, test mode enable will be displayed in the command window. 4. In the DateType field, select the SINWAVE or NORMAL mode. 5.

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