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Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution
of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business
relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components
to meet their specific needs.
With the principle of "Quality Parts,Customers Priority,Honest Operation,and Considerate Service",our business
mainly focus on the distribution of electronic components. Line cards we deal with include
Microchip,ALPS,ROHM,Xilinx,Pulse,ON,Everlight and Freescale. Main products comprise
IC,Modules,Potentiometer,IC Socket,Relay,Connector.Our parts cover such applications as commercial,industrial,
and automotives areas.
We are looking forward to setting up business relationship with you and hope to provide you with the best service
and solution. Let us make a better world for our industry!
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Tel: +86-755-8981 8866 Fax: +86-755-8427 6832
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Address: A1208, Overseas Decoration Building, #122 Zhenhua RD., Futian, Shenzhen, China
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Related Manuals for Murata GRM32EC80G227ME05 Series
Summary of Contents for Murata GRM32EC80G227ME05 Series
- Page 1 Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components to meet their specific needs.
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Page 2: 0.3 Min
Chip Monolithic Ceramic Capacitor for General GRM32EC80G227ME05_ (1210, X6S:EIA, 220uF, DC4V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s (4)Rated (5)Nominal (6)Capacitance (1)L/W... - Page 3 ■ Specifications and Test Methods Test Method Item Specification (Ref. Standard:JIS C 5101, IEC60384） Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, V or V whichever is larger, should be maintained within the rated voltage range.
- Page 4 Test Method Item Specification (Ref. Standard:JIS C 5101, IEC60384） 10 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion D.F.
- Page 5 Test Method Item Specification (Ref. Standard:JIS C 5101, IEC60384） 16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Test Temperature : Max. Operating Temp. +/-3℃ Capacitance Within +/-15% Test Time : 1000+/-12h Change Applied Voltage : 100% of the rated voltage...
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Page 6: Table Of Contents
Test method : Substrate Bending test ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm) Copper foil thickness : 0.035mm : Solder resist (Coat with heat resistant resin for solder) Dimension (mm) Type ：... -
Page 7: (In Mm)
Package GRM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Paper Tape Plastic Tape Paper Tape Plastic Tape Type Code:D/E Code:W Code:L Code:J/ F Code:K GRM01 50000(W4P1) GRM02 40000(W4P1) 15000(W8P2) 50000(W8P2) GRM03 15000(W8P2) 30000(W8P1) 50000(W8P2) 10000(W8P2) 50000(W8P2) 20000(W8P2) 50000(W8P2) -
Page 8: Grm03 3
Package GRM Type (2)GRM03/15(W8P2 CODE:D/E/J/F) *1,2：2.0±0.05 (in:mm) 4.0±0.1 +0.1 φ1.5 Ａ Ａ 0.05 max. Dimensions(Chip) Type A *3 B *3 0.2 +0.02/-0.04 0.6±0.03 0.3±0.03 0.37 0.67 0.3±0.03 0.5 max. GRM03 3 0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69 0.3±0.09 0.6 max. 0.6±0.09 0.3±0.09 0.44 0.74... -
Page 9: Grm18
Package GRM Type (4)GRM18/21/31/32 (in:mm) <Plastic Tape> <Paper Tape> 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 2.0±0.1 0.25±0.1(T≦2.0mm) +0.1 φ1.5 2.0±0.1 0.3±0.1(T：2.5mm) +0.1 φ1.5 Ａ Ａ Dimensions(Chip) Dimensions Type of Tape 1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10 0.5 +0/-0.1 0.8 max. 0.5±0.05 1.6±0.2 0.8±0.2 1.10±0.10 2.00±0.10 0.6 +0/-0.1 GRM18... - Page 10 Package GRM Type (5)GRM43/55 (in:mm) 8.0±0.1 4.0±0.1 0.3±0.1 +0.1 φ1.5 *：2.0±0.1 Ａ +0.2 φ1.5 Dimensions(Chip) Type A *1 B *1 1.15±0.1 2.5 max. 1.35±0.15 1.8±0.2 GRM43 4.5±0.4 3.2±0.3 2.0±0.2 3.7 max. 2.5±0.2 2.8±0.2 4.7 max. 1.15±0.1 1.35±0.15 2.5 max. 1.6±0.2 GRM55 5.7±0.4 5.0±0.4...
- Page 11 め状態 単位： Package GRM Type Fig.1 Package Chips (in:mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GRM01/02 8.0 max. 5±1.5 GRM03/15/18/21/31/32 16.5 max. 10±1.5 GRM43/55 20.5 max. 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
- Page 12 Package ﾁｯﾌﾟ詰め状態 単位： GRM Type 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. Tail vacant Section Chip-mounting Unit Leader vacant Section...
- Page 13 Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment...
- Page 14 Caution 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2.
- Page 15 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type [Example of DC Voltage Characteristics] capacitor changes depending on the DC voltage applied. 0.1μF, Rated Voltage 50VDC Sample: X7R(R7) Characteristics Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
- Page 16 Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. ...
- Page 17 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum to prevent them from any damage or cracking.
- Page 18 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering Peak Temperature...
- Page 19 Caution 4-2.Flow Soldering [Standard Conditions for Flow Soldering] 1. Do not apply flow soldering to chips not listed in Table 2. Table 2 Temperature(℃) Soldering Soldering Series Temperature Differential Chip Dimension(L/W) Code Peak Gradual Temperature ΔT Cooling ΔT≦150℃ 18/21/31 Preheating Peak Temperature 2.
- Page 20 Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
- Page 21 Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
- Page 22 Caution (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
- Page 23 Caution (3) Example of Router Type Separator [ Outline Drawing ] Router The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation.
- Page 24 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 25 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the maximum operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor.
- Page 26 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
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