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InvenSense ADMP404 Instruction Manual

Omnidirectional microphone with bottom port and analog output
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Omnidirectional Microphone with Bottom Port and Analog Output

GENERAL DESCRIPTION

*
The ADMP404
is a high-quality, high-performance, low-
power, analog-output bottom-ported omnidirectional MEMS
microphone. The ADMP404 consists of a MEMS microphone
element, an impedance converter, and an output amplifier.
The ADMP404 sensitivity specification makes it an excellent
choice for near-field applications. The ADMP404 has a
wideband frequency response, resulting in natural sound with
high intelligibility. Its low current consumption enables long
battery life for portable applications.
The ADMP404 complies with the TIA-920
Telecommunications Telephone Terminal Equipment
Transmission Requirements for Wideband Digital Wireline
Telephones standard.
The ADMP404 is available in a miniature 3.35 ×
2.50 × 0.88 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation. The ADMP404 is
halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.

FUNCTIONAL BLOCK DIAGRAM

ADMP404
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
OUTPUT
OUTPUT
AMPLIFIER
POWER
VDD GND
1745 Technology Drive, San Jose, CA 95110 U.S.A

APPLICATIONS

•
Mobile Devices
•
Teleconferencing Systems
•
Headsets
•
Security Panels
•
Intercom Devices

FEATURES

•
3.35 × 2.50 × 0.88 mm Surface-Mount Package
•
SNR of 62 dBA
•
Sensitivity of −38 dBV
•
Flat Frequency Response from 100 Hz to 15 kHz
•
Low Current Consumption: <250 µA
•
Single-Ended Analog Output
•
High PSR of 70 dB
•
Compatible with Sn/Pb and Pb-free Solder Processes
•
RoHS/WEEE Compliant

ORDERING INFORMATION

PART
ADMP404ACEZ-RL
ADMP404ACEZ-RL7
EVAL-ADMP404Z-FLEX
* – 13" Tape and Reel
InvenSense Inc.
+1(408) 988–7339
www.invensense.com
ADMP404
TEMP RANGE
−40°C to +85°C*
−40°C to +85°C†
—
† – 7" Tape and Reel
Document Number: DS-ADMP404-00
Revision: 1.0.
Release Date: Preliminary 11/20/2013
PACKAGE
CE-3-2
CE-3-2
—

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Summary of Contents for InvenSense ADMP404

  • Page 1: General Description

    • High PSR of 70 dB • Compatible with Sn/Pb and Pb-free Solder Processes The ADMP404 is available in a miniature 3.35 × • RoHS/WEEE Compliant 2.50 × 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP404 is halide free.

  • Page 2: Table Of Contents

    Pick And Place Equipment ..........................11 Reflow Solder ..............................11 Board Wash................................ 11 Outline Dimensions ............................... 12 Ordering Guide ..............................12 Revision History ..............................12 Compliance Declaration Disclaimer: ........................13 Environmental Declaration Disclaimer: ........................ 13 Page 2 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 3: Specifications

    SPL POWER SUPPLY Supply Voltage (V Supply Current (I µA OUTPUT CHARACTERISTICS Output Impedance (Z Ω Output DC Offset Output Current Limit µA Note 1: See Figures 3 and 5. Page 3 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 4: Absolute Maximum Ratings

    ESD. Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Page 4 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 5: Soldering Profile

    20 sec to 30 sec 20 sec to 30 sec Temperature (t 3°C/sec max Ramp-Down Rate 3°C/sec max 5 min max Time +25°C (t ) to Peak Temperature 5 min max 25°C Page 5 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 6: Pin Configurations And Function Descriptions

    PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS OUTPUT ADMP404 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 2. Pin Configuration TABLE 4. PIN FUNCTION DESCRIPTIONS NAME FUNCTION Analog Output Signal OUTPUT Ground Power Supply Page 6 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 7: Typical Performance Characteristics

    FREQUENCY (Hz) Figure 3. Frequency Response Mask Figure 4. Typical Frequency Response (Measured) –10 –20 –30 –40 –50 –60 –70 –80 FREQUENCY (Hz) Figure 5. Typical Power Supply Rejection Ratio vs. Frequency Page 7 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 8: Application Information

    The ADMP404 output can be connected to a dedicated codec microphone input (see Figure 6) or to a high input impedance gain stage (see Figure 7.) A 0.1 µF ceramic capacitor placed close to the ADMP404 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply.

  • Page 9: Supporting Documents

    Recommendations for Mounting and Connecting the Invensense Bottom-Ported MEMS Microphones AN-1068 Reflow Soldering of the MEMS Microphone AN-1112 Microphone Specifications Explained AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140 Microphone Array Beamforming AN-1165 Op Amps for MEMS Microphone Preamp Circuits AN-1181...

  • Page 10: Pcb Design And Land Pattern Layout

    PCB DESIGN AND LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP404 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 9.

  • Page 11: Handling Instructions

    Figure 1 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Page 11 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 12: Outline Dimensions

    * – 13” Tape and Reel † – 7” Tape and Reel Z = RoHS-Compliant Part This package option is halide free. REVISION HISTORY REVISION DATE REVISION DESCRIPTION 11/18/2013 Initial Release Page 12 of 13 Document Number: DS-ADMP404-00 Revision: 1.0.

  • Page 13: Compliance Declaration Disclaimer

    This information furnished by InvenSense, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice.

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Admp404acez-rlAdmp404acez-rl7Eval-admp404z-flex

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