TUYA T3-U Datasheet
  1. Manuals
  2. Brands
  3. TUYA Manuals
  4. Wireless Router
  5. T3-U
  6. Datasheet
TUYA T3-U Datasheet

TUYA T3-U Datasheet

Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
T3-U Module Datasheet
Version: 20240307
Online Version

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the T3-U and is the answer not in the manual?

Questions and answers

Related Manuals for TUYA T3-U

Summary of Contents for TUYA T3-U

  • Page 1 T3-U Module Datasheet Version: 20240307 Online Version...

  • Page 2: Table Of Contents

    Contents Contents 1 Overview 1.1 Features ....... . . 1.2 Scope of applications .
  • Page 3 Contents T3-U module is a Wi-Fi 6 and Bluetooth Low Energy (LE) combo module developed by Tuya Smart. It is composed of a highly integrated radio-frequency identification (RFID) chip T3 and a few peripheral components. It can run in the station (STA) mode and access point (AP) mode.

  • Page 4: Overview

    1 Overview 1 Overview T3-U has a built-in 32-bit MCU with a maximum running speed of 320 MHz, built-in 2 MB flash memory, and 640 KB SRAM. The module supports cloud connectivity, and the MCU ’ s extended instructions for signal processing enable it to efficiently implement audio encoding and decoding.
  • Page 5 1 Overview • Smart home and electrical appliance • Smart socket and light • Industrial wireless control • Baby monitor • IP camera • Smart bus 3 / 30...

  • Page 6: Module Interfaces

    2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint The T3-U dimensions are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 2.7±0.15 mm (H). The following figure shows the dimensions and packaging design of the T3-U module. 2.2 Pin definition...
  • Page 7 2 Module interfaces Pin No. Symbol I/O type Description A normal GPIO pin, corresponding to Pin 33 on the IC. It can be reused as SPI_SCK A normal GPIO pin, corresponding to Pin 35 on the IC. It can be reused as SPI_MOSI UART_RX2...
  • Page 8 2 Module interfaces Pin No. Symbol I/O type Description Support hardware PWM, corresponding to Pin 11 on the IC. Support hardware PWM, corresponding to Pin 14 on the IC. Support hardware PWM, corresponding to Pin 15 on the IC. Support hardware PWM, corresponding to Pin 16 on the IC.
  • Page 9 2 Module interfaces Pin No. Symbol I/O type Description A normal GPIO pin, corresponding to Pin 21 on the IC. The reset pin, active low, and pulled up internally. Corresponding to Pin 26 on the IC. A normal GPIO pin, corresponding to Pin 22 on the IC.

  • Page 10: Electrical Parameters

    3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum Maximum Parameter Description value value Unit Storage °C temperature VBAT Supply -0.3 voltage Electrostatic TAMB -25°C discharge voltage (human body model) Electrostatic TAMB -25°C -200 discharge voltage (machine model) 3.2 Normal operating conditions Minimum Typical...

  • Page 11: Radio Frequency (Rf) Power

    3 Electrical parameters Minimum Typical Maximum Parameter Description value value value Unit VBAT − 0.3 VBAT high-level output Imax I/O drive current 3.3 Radio frequency (RF) power Peak Operating Transmit/Receive Average (Typical) status Mode Rate power value value Unit Transmit 802.11b 11 Mbit/s +17 dBm...
  • Page 12 3 Electrical parameters Operating Status (Ta = Max (Typical) mode 25°C) Average value value Unit Quick pairing The module is (Bluetooth) in EZ mode. The network status indicator blinks quickly. Quick pairing The module is (AP) in AP mode. The network status indicator blinks slowly.
  • Page 13 3 Electrical parameters Operating Status (Ta = Max (Typical) mode 25°C) Average value value Unit Weakly connected connection between the module and the hotspot is intermittent. The network status indicator is steady on. Disconnected The module is disconnected from the cloud.

  • Page 14: Rf Parameters

    4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Operating frequency 2.412 to 2.484 GHz IEEE 802.11b/g/n/ax (channels 1 – 14) Wi-Fi standard Data transmission rate IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s IEEE 802.11n: HT20 MCS0-7 IEEE 802.11ax: HE20 MCS0-7...

  • Page 15: Wi-Fi Receiver (Rx) Performance

    4 RF parameters Minimum Maximum Parameter value Typical value value Unit RF average output power, 802.11n OFDM mode, MCS7 (HT20) RF average output power, 802.11ax OFDMA mode, MCS7 (HE20) Frequency error 4.3 Wi-Fi receiver (RX) performance Minimum Maximum Parameter value Typical value value Unit...

  • Page 16: Bluetooth Transmitter (Tx) Performance

    4 RF parameters Minimum Maximum Parameter value Typical value value Unit PER < 10%, RX sensitivity, Bluetooth, 1 Mbit/s 4.4 Bluetooth transmitter (TX) performance Minimum Maximum Parameter value Typical value value Unit Operating 2402 2480 frequency Transmission Mbit/s rate over the Transmission power Frequency...
  • Page 17 4 RF parameters Minimum Maximum Parameter value Typical value value Unit Adjacent- channel rejection ratio 15 / 30...

  • Page 18: Antenna Information

    5 Antenna information 5 Antenna information 5.1 Antenna type The T3-U module uses an onboard PCB antenna. 5.2 Antenna interference reduction When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.

  • Page 19: Packing And Production Instructions

    6 Packing and production instructions 6 Packing and production instructions 6.1 Mechanical dimensions Dimensions of the T3-U PCB are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 1.0±0.1 mm (H). 17 / 30...
  • Page 20 6 Packing and production instructions 18 / 30...
  • Page 21 6 Packing and production instructions The following figure shows the recommended footprint of the T3-U module. 19 / 30...

  • Page 22: Production Instructions

    6 Packing and production instructions 6.2 Production instructions 1. For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, pack- age the module with the SMT.
  • Page 23 6 Packing and production instructions • Instruments or devices required for the SMT process: – Surface mount system – SPI – Reflow soldering machine – Thermal profiler – AOI • Instruments or devices required for the wave soldering process: – Wave soldering equipment –...
  • Page 24 6 Packing and production instructions Figure 1: 3. The module needs to be baked in the following cases: • The vacuum packaging bag is damaged before unpacking. • After unpacking, no HIC is found in the packaging bag. • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.

  • Page 25: Recommended Oven Temperature Curve

    6 Packing and production instructions do not use reflow soldering or wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.
  • Page 26 6 Packing and production instructions • A: temperature axis • B: time axis • C: alloy liquidus temperature from 217°C to 220°C • D: ramp-up slope from 1°C/s to 3°C/s • E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s •...
  • Page 27 6 Packing and production instructions ified solder paste specifications. Technique 2: Wave soldering process (oven temperature curve of wave soldering) Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C. Suggestions on Suggestions on manual repair wave soldering...

  • Page 28: Storage Conditions

    6 Packing and production instructions Suggestions on Suggestions on manual repair wave soldering soldering Solder tank 260°C ± 5°C temperature Ramp-up slope ≤ 2°C/s Ramp-down slope ≤ 6°C/s 6.4 Storage conditions 26 / 30...

  • Page 29: Moq And Packaging Information

    7 MOQ and packaging information 7 MOQ and packaging information Shipping Modules per Reels per Product model MOQ (pcs) packaging reel carton T3-U 4,400 Tape and reel 1,100 27 / 30...

  • Page 30: Appendix: Statement

    8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user ’ s authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules.
  • Page 31 This device has got an FCC ID: 2ANDL-T3-U. The end product must be labeled in a visible area with the following: “ Contains Transmitter Module FCC ID: 2ANDL-T3-U ”...
  • Page 32 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

Table of Contents