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3-3.
PRINTED
WIRING
BOARDS
@
See page 20 for Semiconductor Lead Layouts.
Note on Printed Wiring Boards:
®
O-——
: parts extracted from the component
side.
e
{
=: parts mounted on the conductor side.
® Semiconductor Location
Location
.
N o . | Location
D-21
B-13
G-13
D-19
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Note on Schematic Diagram:
@
All capacitors are in wF unless otherwise noted.
pF: uur
5OWV
or
less are
not
indicated
except
for electrolytics
and tantalums.,
@
All resistors are in 2 and '/,W or less unless otherwise
specified.
@
{#U+: fusible resistor.
CJ
: adjustment for repair.
Power
voltage
is fed
with
supply
from
external
power
voltage jack.
@
Voltage
and waveforms
are dc with
respect
to ground
under no-signal conditions.
no mark: REC
(
-): PB
@
Voltages are taken with
a VOM
(50 kQ/V).,
Voltage
variations
may
be noted
due to normal
produc-
tion tolerances.
@
Signal path.
()
: PB (DECK B)
(>>
: REC (DECK B)
Note: The components
identified by mark A or dotted
line with mark
are critical for safety.
Replace only with part number specified.
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