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4-1.
PRINTED
WIRING
BOARDS
@
See page 25 for Semiconductor Lead Layouts.
Note
e
: parts extracted from the component
side.
: Through
hole.
=
1 Pattern on the side which
is seen.
: Pattern of the rear side.
: Chip components
extracted from the rear side.
® Semiconductor Location
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(DISPLAY BOA
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RD] (COMPONENT SIDE)
Chip parts only.
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XR- 7202, 2804
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coe
XR-7201
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BUZZI
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"(MAIN BOARD)ICONDUCTOR SIDE)
THT
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