Ebyte E180-ZG120A Product Specifications page 19

Efr32 2.4ghz zigbee multifunction soc wireless module
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EBYTE
Chengdu Ebyte Electronic Technology Co., Ltd.
E180-ZG120A/B Product Specification
6.3 Bit error rate too high
®
There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency and channel to
avoid interference;
If the power supply is not ideal, it may also cause garbled characters. Be sure to ensure the reliability of the power supply;
Poor quality or too long extension cables and feeders will also cause high bit error rates.
7. Welding work guide
7.1 reflow temperature
When reflow soldering, all temperatures refer to the package center temperature, measured on the package surface facing up
(leads are placed down, 1.e. the live insects are facing). If the temperature of the module is not measured in the direction of live insects
(the lead 1s placed upward, that is, the direction of dead insects) for reflow soldering, the measured Tp temperature is within £2°C of
the Tp temperature measured in the direction of the live insects, which still meets the requirements of Tc . Otherwise, the temperature
curve should be adjusted to meet the requirements of Tc. In order to accurately measure the actual peak temperature of the package
body, it 1s recommended to use the method recommended by JEP140 for furnace temperature testing.
In order to obtain a better welding effect, the production workshop recommends a constant temperature of 25°C.
'When soldered components need to be re-profiled, they should be reflowed with a carrier fixture of the same construction, or
verified to have an equivalent thermal load.
The reflow profiles in this document are some suggestions for soldering only Ebyte modules, and cannot be used to confirm the
actual assembly profile of the user. The actual production process of the user should be based on the specific production process, needs
and circuit board design to develop the actual production assembly curve, and should not exceed the parameters in the table below.
Reflow Profile Characteristics
Leaded process assembly
Lead-free process assembly
Preheat/Keep Warm
Minimum temperature (Tsmin)
100°C
150°C
Maximum temperature (Tsmax)
150°C
200°C
Time (Tsmin~Tsmin)
60-120 seconds
60-120 seconds
Heating slope (TL~Tp)
3°C/sec, max
3°C/sec, max
Liquidus Temperature (TL)
183°C
217°C
Hold time above TL
60~90 seconds
60~90 seconds
Package body peak temperature Tp
The user must not exceed the temperature | The user must not exceed the temperature
indicated
on
the
product's
"Moisture | indicated
on
the
product's
"Moisture
Sensitivity" label.
Sensitivity" label.
The time (Tp) within 5°C of the specified
)
)
20 seconds
30 seconds
grading temperature (Tc), see Figure 6-3-2
Cooling slope (Tp~TL)
6°C/sec, max
6°C/sec, max
Time
from
room
temperature
to
peak
6 minutes, maximum
8 minutes, maximum
temperature
The peak temperature (Tp) tolerance definition of the temperature curve is the upper limit of the user
Copyright ©2012-2020,
Chengdu Ebyte Electronic Technology Co, Ltd.

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