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TDK High-speed Series Manual
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TDK High-speed Series Manual

TDK High-speed Series Manual

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CeraDiodes
High-speed series
Series/Type:
Date:
April 2016
© EPCOS AG 2016. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.

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Summary of Contents for TDK High-speed Series

  • Page 1 CeraDiodes High-speed series Series/Type: Date: April 2016 © EPCOS AG 2016. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company.
  • Page 2 CeraDiodes High-speed series EPCOS type designation CeraDiode Device Single device Array device Case sizes of single devices Code Case size (inch/mm) 0201/0603 0402/1005 0603/1608 1003/2508 Case sizes of array devices Code Case size (inch/mm) 0506/1216 0508/1220 0612/1632 1012/2532 Rated voltage Code 5.5/ 5.6...
  • Page 3 CeraDiodes High-speed series Ordering code system B72590 0050 Type, case sizes and device Chip size Device Ordering code (inch/mm) 0201/0603 Single B72440... 0402/1005 Single B72590... 0603/1608 Single B72500... 1003/2508 Single B72570... 0506/1216 Array B72755... 0508/1220 Array B72714... 0612/1632 Array B72724...
  • Page 4 CeraDiodes High-speed series Features Single chip Very low capacitance values 0.6 up to 10 pF ESD protection to IEC 61000-4-2, level 4 Bidirectional ESD protection in one component No change in ESD protection performance at temperatures up to 85 °C (temperature derating)
  • Page 5 CeraDiodes High-speed series Electrical specifications and ordering codes = 85 °C) and characteristics (T = 25 °C) Maximum ratings (T op,max Type Ordering code DC,max BR,min clamp,max (1 mA) (1 A) (1 MHz, 1 V) (1 MHz, 1 V) Array, 2/4 data + 1 supply, 0506, SOT-666...
  • Page 6 CeraDiodes High-speed series Dimensional drawings Single device Dimensions in mm Case (inch) 0201 0402 0603 1003 size (mm) 0603 1005 1608 2508 Min. Max. Min. Max. Min. Max. Min. Max. 0.57 0.63 0.85 1.15 1.45 1.75 2.34 2.74 0.27 0.33 0.4 0.27 0.33 0.4...
  • Page 7 CeraDiodes High-speed series Recommended solder pads Single device Dimensions in mm Case size (inch) 0201 0402 0603 1003 (mm) 0603 1005 1608 2508 0.25 1.45 Array devices 4-fold array 2/4 data + 1 supply Dimensions in mm Case size (inch)
  • Page 8 CeraDiodes High-speed series Pin configurations Single device Description I/O line Array devices 4-fold array Description I/O line 1 I/O line 2 I/O line 3 I/O line 4 2/4 data + 1 supply Description I/O line 1 I/O line 2 I/O line 3...
  • Page 9 CeraDiodes High-speed series Termination Single device Array device Please read Cautions and warnings and Page 9 of 25 Important notes at the end of this document.
  • Page 10 CeraDiodes High-speed series Delivery mode EIA case size Taping Reel size Packing unit Type Ordering code pcs. 0201 Cardboard 15000 CDS1C05GTH1 B72440C0050H160 0201 Cardboard 15000 CDS1C05GTH2 B72440C0050H260 0402 Cardboard 10000 CDS2C05HDMI1 B72590D0050H160 0402 Cardboard 10000 CDS2C05HDMI2 B72590D0050H260 0402 Cardboard 10000...
  • Page 11 CeraDiodes High-speed series Taping and packing for chip and array CeraDiodes Cardboard tape (taping to IEC 60286-3) Dimensions in mm 0402 0603 1003 0508 Tolerance Case size (inch) 0201 0603 1005 1608 2508 1220 (mm) 0.38 ±0.05 0.6 ±0.2 Compartment width 0.95...
  • Page 12 CeraDiodes High-speed series Blister tape (taping to IEC 60286-3) Dimensions in mm 0506 0612 1012 Tolerance Case size (inch) 1216 1632 2532 (mm) ±0.2 Compartment width ±0.2 Compartment length Compartment height max. Sprocket hole diameter +0.1/ Compartment hole diameter min.
  • Page 13 CeraDiodes High-speed series Reel packing Dimensions in mm Dimensions Tolerance Dimensions Tolerance Reel diameter +0/ –3 +0/ –2 Reel width (inside) +1.5/ –0 +1.5/ –0 Reel width (outside) 14.4 max. 14.4 max. Package: 8-mm tape Reel material: Plastic Packing units ∅...
  • Page 14 CeraDiodes High-speed series Soldering directions Reflow soldering temperature profile Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Sn-Pb eutectic assembly Pb-free assembly Preheat and soak 100 °C 150 °C - Temperature min smin 150 °C 200 °C...
  • Page 15 CeraDiodes High-speed series Soldering guidelines The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. The components are suitable for reflow soldering to JEDEC J-STD-020D. Solder joint profiles / solder quantity Cement quantity The component is fixed onto the circuit board with cement prior to soldering.
  • Page 16 CeraDiodes High-speed series 3.3.1 Solder joint profiles for nickel barrier termination Good and poor solder joints caused by amount of solder in infrared reflow soldering Please read Cautions and warnings and Page 16 of 25 Important notes at the end of this document.
  • Page 17 CeraDiodes High-speed series Solderability tests Test Standard Test conditions / Test conditions / Criteria / test results Sn-Pb soldering Pb-free soldering Wettability Immersion in Immersion in Covering of 95% 60068-2-58 60/40 SnPb solder Sn96.5Ag3.0Cu0.5 of end termination, using non-activated solder using non- or checked by visual flux at 215 ±3 °C for...
  • Page 18 CeraDiodes High-speed series Notes for proper soldering Preheating and cooling The average ramp-up rate must not exceed 3 °C/s. The cooling rate must not exceed 8 °C/s. Repair / rework Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for making repairs.
  • Page 19 CeraDiodes High-speed series Placement of components on circuit board It is of advantage to place the components on the board before soldering so that their two termi- nals do not enter the solder oven at different times. Ideally, both terminals should be wetted si- multaneously.
  • Page 20 CeraDiodes High-speed series Symbols and terms CeraDiode Semiconductor diode Maximum capacitance Typical capacitance (Reverse) current @ breakdown voltage (Reverse) leakage current leak Current @ clamping voltage, peak pulse current Peak pulse power Operating temperature Storage temperature (Reverse) breakdown voltage Minimum breakdown voltage...
  • Page 21 CeraDiodes High-speed series Cautions and warnings General Some parts of this publication contain statements about the suitability of our CeraDiodes for cer- tain areas of application, including recommendations about incorporation/design-in of these prod- ucts into customer applications. The statements are based on our knowledge of typical require- ments often made of our CeraDiodes in the particular areas.
  • Page 22 CeraDiodes High-speed series Storage Only store CeraDiodes in their original packaging. Do not open the package before storage. Storage conditions in original packaging: temperature -25 to +45°C, relative humidity ≤75% an- nual average, maximum 95%, dew precipitation is inadmissible. Do not store CeraDiodes where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CeraDiodes may stick together, causing problems dur- ing mounting.
  • Page 23 CeraDiodes High-speed series Operation Use CeraDiodes only within the specified operating temperature range. Use CeraDiodes only within specified voltage and current ranges. Environmental conditions must not harm a CeraDiode. Only use them in normal atmospheric conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.
  • Page 24 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned.
  • Page 25 Important notes 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and other countries.

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