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Summary of Contents for RAKwireless WisDuo-LoRa Series
- Page 1 Specifications for RAK4200(H) LoRa Module WisDuo-LoRa Series Version V1.1 | October 2019 www.RAKwireless.com Visit our website for more document. 10 PAGES...
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Page 2: Table Of Contents
Table of Contents 1. Overview..............................3 1.1 Introduction ..........................3 1.2 Main Features ..........................3 2. RAK4200(H) LoRa Module ......................4 2.1 Overview............................4 2.2 Pin Definition & Pin Out ......................4 2.3 Mechanical Dimensions......................6 2.4 Recommended Footprint......................7 2.5 Recommended Reflow Profile .................... -
Page 3: Overview
1. Overview 1.1 Introduction RAK4200(H) LoRa Module includes an STM32L071 MCU and an SX1276 LoRa chip. It has Ultra-Low Power Consumption of 1.5uA in sleep mode and high LoRa output power up to 13.92dBm max in work mode. The module complies with LoRaWAN 1.0.2 protocols. It also supports Lora Point to Point communications. -
Page 4: Rak4200(H) Lora Module
2. RAK4200(H) LoRa Module 2.1 Overview The figure below shows the top view of the RAK4200(H) LoRa Module. The dimensions of the Module are 15 x 15.5 x 2.5 mm. Figure 1 | RAK4200(H) LoRa Module 2.2 Pin Definition & Pin Out The figure below shows the pinout of the RAK4200(H) LoRa Module. - Page 5 Figure 2 | Pinout The table below shows the pin definition of the RAK4200(H) LoRa Module. Name Description UART2_RX Main UART (STM32L071K8 PA10) UART2_TX Main UART (STM32L071K8 PA9) UART2_DE GPIO (STM32L071K8 PA12) General GPIO or UART(Reserved) UART1_TX (STM32L051K8 PA2) General GPIO or UART(Reserved) UART1_RX (STM32L051K8 PA3) General GPIO or UART(Reserved)
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Page 6: Mechanical Dimensions
2.3 Mechanical Dimensions The figure below shows the mechanical dimension of the RAK4200(H) LoRa Module. Figure 3 | Mechanical Dimensions... -
Page 7: Recommended Footprint
2.4 Recommended Footprint Figure 5 | Recommended Footprint 2.5 Recommended Reflow Profile Figure 6 | Recommended Reflow Profile Standard conditions for reflow soldering: Pre-heating Ramp (A) (Initial temperature: 150℃): 1~2.5℃/sec;... - Page 8 Peak Temperature (G): 230~250℃; Reflow Time (T3) (>220℃): 30~60 sec; Ramp-up Rate (B): 0~2.5℃/ sec; Ramp-down Rate (C): 1~3℃/ sec. Please contact us if you need technical support or need more information. Support center: https://forum.rakwireless.com/ Email us: info@rakwireless.com...
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Page 9: Warning
If not, a second label must be placed on the outside of the final device that contains the following text: ―Contains FCC ID: 2AF6B-RAK4200H. 5. The Shenzhen Rakwireless Technology Co., Ltd. uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact Shenzhen Rakwireless Technology Co., Ltd. -
Page 10: Revision History
Hairui Penn & Vladislav About RAKwireless: RAKwireless is the pioneer in providing innovative and diverse cellular and LoRa connectivity solutions for IoT edge devices. It's easy and modular design can be used in different IoT applications and accelerate time-to-market. For more information, please visit RAKwireless website at www.rakwireless.com.
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