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RAYTAC MDBT53V Manual

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產品名稱
(Product)
產品型號
(Model No.)
Approval Sheet
(產品承認書)
Bluetooth Low Energy Module
MDBT53V (Chip Antenna)
MDBT53V – P (PCB Antenna)
Version: A
Issued Date: 2021/09/13

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Summary of Contents for RAYTAC MDBT53V

  • Page 1 Version: A Issued Date: 2021/09/13 Approval Sheet (產品承認書) 產品名稱 (Product) Bluetooth Low Energy Module 產品型號 (Model No.) MDBT53V (Chip Antenna) MDBT53V – P (PCB Antenna)

  • Page 2: Table Of Contents

    Index Overall Introduction ...................... 3 1.1. Application ......................3 1.2. Features ....................... 4 Product Dimension ....................... 6 2.1. PCB Dimensions & Pin Indication ................. 6 2.2. Recommended Layout of Solder Pad ..............8 2.3. RF Layout Suggestion (aka Keep-Out Area) ............12 2.4.

  • Page 3: Overall Introduction

    1. Overall Introduction Raytac’s MDBT53V & MDBT53V-P is a BT 5.2 stack (Bluetooth low energy or BLE) module designed based on Nordic nRF5340 SoC solution, which incorporates: GPIO, SPI, UART, TWI, I2S, PDM, PWM, ADC, NFC and USB interfaces for connecting peripherals and sensors.

  • Page 4: Features

    1.2. Features ‧Supply voltage range 1.7V to 5.5V ‧1.8 V to 3.3 V regulated supply for external components ‧Single 32 MHz crystal operation ‧25 general purpose I/O pins ‧Operating temperature from -40 to +105°C Network Core ‧ARM® Cortex® -M33 with TrustZone® technology ‧64 MHz operation ‧256 kB flash ‧64 kB low leakage RAM...
  • Page 5 ‧ARM TrustZone CryptoCell™-312 security subsystem ‧USB 2.0 full speed (12Mbps) controller ‧QSPI peripheral for communicating with an external flash memory device ‧Near field communication (NFC-A) tag with wake-on field ‧Up to 5x SPI master/slave with EasyDMA ‧Up to 4x I2C compatible two-wire master/slave with EasyDMA ‧Up to 4x UART (CTS/RTS) with EasyDMA ‧Audio peripherals: I2S, digital microphone interface (PDM) ‧Up to 4x pulse width modulator (PWM) units with EasyDMA...

  • Page 6: Product Dimension

    2. Product Dimension 2.1. PCB Dimensions & Pin Indication ‧MDBT53V PCB Size (in mm) Min. Norm MAX. 12.4 - 0.15 + 0.2 1.85...
  • Page 7 ‧MDBT53V-P PCB Size (in mm) Min. Norm MAX. 12.4 - 0.15 + 0.2...

  • Page 8: Recommended Layout Of Solder Pad

    2.2. Recommended Layout of Solder Pad Graphs are all in Top View, Unit in mm.

  • Page 12: Rf Layout Suggestion (Aka Keep-Out Area)

    Place the module towards the edge of PCB to have better performance than placing it on the center. Welcome to send us your layout in PDF for review at service@raytac.com or your contact at Raytac with title “Layout reviewing – Raytac Model No. – YOUR company’s name”.
  • Page 14 Examples of “NOT RECOMMENDED” layout...

  • Page 15: Footprint & Design Guide

    If there is limited space for layout, the module can be put on the upper right corner to minimize the layout space. 2.4. Footprint & Design Guide Please visit “Support” page of our website to download. The package includes footprint, 2D/3D drawing, reflow graph/solder profile and recommended spec for external 32.768khz.

  • Page 16: Pin Assignment

    2.5. Pin Assignment Pin No. Name Pin Function Description Power Ground SWDIO Debug Serial wire debug I/O for debug and programming SWCLK Debug Serial wire debug I/O for debug and programming nRESET Reset Pin RESET with internal pull-up resistor P0.26 Digital I/O General-purpose I/O AIN5...
  • Page 17 Pin No. Name Pin Function Description P0.08 Digital I/O General-purpose I/O (17) SCK for SPIM4 Dedicated pin for high-speed SPI (18) Power Ground P1.03 Digital I/O General-purpose I/O (19) TWI 1 Mbps High-speed pin for 1 Mbps TWI P1.02 Digital I/O General-purpose I/O (20) TWI 1 Mbps...

  • Page 18: Main Chip Solution

    Pin No. Name Pin Function Description (37) DECR Power Regulator supply decoupling (38) P0.31 Digital I/O General-purpose I/O (39) Power Ground 3. Main Chip Solution RF IC Crystal Frequency Nordic NRF5340 32MHZ / CL = 8pF / 20ppm 32MHz crystal is already inside the module. The module does NOT include external capacitor of 32MHZ.

  • Page 19: Specification

    4. Specification Any technical spec shall refer to Nordic’s official documents as final reference. Contents below are from “nRF5340 Objective Production Specification v1.1”, please click to download full spec. 4.1. Absolute Maximum Ratings 4.2. Operating Conditions...

  • Page 20: Electrical Specifications

    4.3. Electrical Specifications 4.3.1. General Radio Characteristics 4.3.2. Radio Current Consumption (Transmitter)
  • Page 21 4.3.3. Radio Current Consumption (Receiver) 4.3.4. Transmitter Specification 4.3.5. RSSI Specifications...

  • Page 22: Application Cpu Performance

    4.3.6. Receiver Operation 4.4. Application CPU Performance...

  • Page 23: Network Cpu Performance

    4.5. Network CPU Performance 4.6. Power Management 4.6.1. Sleep...
  • Page 24 4.6.2. Application CPU Running...
  • Page 25 4.6.3. Network CPU Running 4.6.4. I2S Active...
  • Page 26 4.6.5. NFCT Active 4.6.6. PDM Active...
  • Page 27 4.6.7. PWM Active 4.6.8. QDEC Active 4.6.9. QSPI Active...
  • Page 28 4.6.10. SAADC Active 4.6.11. Timer Running...
  • Page 29 4.6.12. SPIM Active 4.6.13. SPIS Active 4.6.14. TWIM Active...
  • Page 30 4.6.15. TWIS Active 4.6.16. UARTE Active...

  • Page 31: Fcc Compliance

    5. FCC Compliance This equipment has been tested and found to comply with the limits for a Class digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to the radio communications.
  • Page 32 The following external antenna type have been approved for use with this module. Max. Peak Freq. Radio Model Antenna Type Antenna (MHz) Gain (dBi) MDBT53V Chip 2402-2480 -1.35 MDBT53V-P 2402-2480 -2.26 In the end product, the antenna(s) used with this transmitter must be installed and must not...
  • Page 33 be co-located or operation in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 5mm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: SH6MDBT53V Manual Information to the End User...

  • Page 34: Ic Caution

    Any device incorporating this module must include an external, visible, permanent marking or label which states: “Contains IC : 8017A-MDBT53V” Obligation d'étiquetage du produit final: Tout dispositif intégrant ce module doit comporter un externe, visible, marquage permanent ou une étiquette qui dit: "Contient IC : 8017A-MDBT53V”...
  • Page 35 , ayant un gain supérieur au gain maximum indiqué pour ce type , sont strictement interdits pour une utilisation avec cet appareil. Max. Peak Radio ISED HVIN Antenna Type Freq. (MHz) Antenna Gain (dBi) MDBT53V Chip 2402-2480 -1.35 MDBT53V-P 2402-2480 -2.26...

  • Page 36: Ncc 警語

    7. NCC 警語 根據 NCC 低功率電波輻射性電機管理辦法規定 LP0002 低功率射頻器材技術規範_章節 3.8.2 取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大 功率或變更原設計之特性及功能。 低功率射頻器材之使用不得影響飛航安全及干擾合法通信 ； 經發現有干擾現象時 ， 應立即停用， 並改善至無干擾時方得繼續使用。 前述合法通信，指依電信管理法規定作業之無線電通信。 低功率射頻器材須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。 此模組於取得認證後將依規定於模組本體標示審驗合格標籤，並要求平台廠商於平台上標示。 「本產品內含射頻模組：ID 編號 XXXXX」字樣...

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