Murata GRT21BR61C475MA02 Series Reference Sheet

Chip monolithic ceramic capacitor meet aec-q200 for infotainment

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Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment

GRT21BR61C475MA02_ (0805, X5R, 4.7uF, DC16V)

_: packaging code

1.Scope

This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic

equipment.

Please contact us when using this product for any other applications than described in the above.

Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).

2.MURATA Part NO. System

(Ex.)

GRT

(1)L/W

Dimensions

3. Type & Dimensions

(1)-1 L

(1)-2 W

2.0±0.1

1.25±0.1

4.Rated value

(3) Temperature Characteristics

(Public STD Code):X5R(EIA)

Temp. coeff

or　Cap. Change

-15 to 15 %

5.Package

mark

(8) Packaging

f180mm Reel

EMBOSSED W8P4

f330mm Reel

EMBOSSED W8P4

Product specifications in this catalog are as of Apr.17,2015,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

GRT21BR61C475MA02-01

(2)T

(3)Temperature

Dimensions

Characteristics

(2) T

1.25±0.1

0.2 to 0.7

(4)

Rated

Temp. Range

Voltage

(Ref.Temp.)

-55 to 85 °C

DC 16 V

(25 °C)

Packaging Unit

3000 pcs./Reel

10000 pcs./Reel

475

(6)Capacitance

(4)Rated

(5)Nominal

Tolerance

Voltage

Capacitance

(Unit:mm)

0.7 min.

Specifications and Test

(6)

(5) Nominal

Capacitance

Tolerance

4.7 uF

±20 %

Reference Sheet

A02

(7)Murata's

(8)Packaging

Control Code

Code

Methods

(Operating

Temp. Range)

-55 to 85 °C

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Summary of Contents for Murata GRT21BR61C475MA02 Series

Page 1 Please contact us when using this product for any other applications than described in the above. 　　 Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.). 2.MURATA Part NO. System (Ex.) (7)Murata’s...
Page 2 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specifications. AEC-Q200 Test Method Pre-and Post-Stress Electrical Test 2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at maximum operating Exposure (Storage) specifications in the following table.
Page 3 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specifications. AEC-Q200 Test Method 6 Operational Life The measured and observed characteristics should satisfy the Apply 100% of the rated voltage for 1000±12 hours at maximum operating specifications in the following table.
Page 4 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specifications. AEC-Q200 Test Method 13 Thermal Shock The measured and observed characteristics shall satisfy the Fix the capacitor to the supporting jig in the same manner and under specifications in the following table.
Page 5 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Method AEC-Q200 Test Item Specifications. 17 Board Flex Appearance No marking defects Solder the capacitor on the test jig (glass epoxy board) shown in Fig1 using a eutectic solder. Then apply a force in the direction shown in Fig 2 for 5±1sec.
Page 6 ■AEC-Q200 Murata Standard Specification and Test Methods AEC-Q200 Test Item Specifications. AEC-Q200 Test Method 20 Capacitance Capacitance R6 : Within ±15% The capacitance change should be measured after 5 min. at 　　　(-55℃ to +85℃) Temperature Change each specified temperature stage.
Page 7 Package GRT Type 1.Tape Carrier Packaging(Packaging Code:D/E/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:L Code:J/ F Code:K GRT03 15000 50000 10000 50000 (Dimensions Tolerance:±0.05) GRT15 10000 40000 (Dimensions Tolerance:±0.1min.) GRT18 4000 10000...
Page 8 Package GRT Type 　(2)GRT18/21/31/32(Paper Tape) (in mm) 4.0±0.1 4.0±0.1 2.0±0.1 +0.1 φ1.5 Ａ Dimensions Dimensions Type Tolerance(Chip) (Chip) 0.8±0.1 ±0.15 within 1.05±0.10 1.85±0.10 0.8±0.15 GRT18 ±0.2 0.8±0.2 1.10±0.10 2.00±0.10 0.6±0.1 ±0.1 0.6+0/-0.15 1.1 max. GRT21 1.55±0.15 2.30±0.15 0.85±0.1 ±0.15 within 0.85+0/-0.2 ±0.15 0.6±0.1...
Page 9 め状態 ( 単位： mm) Package GRT Type Fig.1 Package Chips (in mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GRT32 max. 16.5 max. 10±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 2.2. Hole for Chip : As specified in 2.2. Bottom Tape :Thickness 0.05 (Only a bottom tape existence ) Base Tape : As specified in 2.2.
Page 10 Package GRT Type 1 ﾁｯﾌﾟ詰め状態 ( 単位： mm) 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. (in mm) Tail vacant Section Chip-mounting Unit...
Page 11 Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability 　 for the prevention of defects which might directly cause damage to the third party's life, body or property. 　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment...
Page 12 Caution 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2.
Page 13 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type [Example of DC Voltage Characteristics] capacitor changes depending on the DC voltage applied. Sample: R7 Characteristics 0.1μF, Rated Voltage 50VDC Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
Page 14 Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. 　...
Page 15 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to prevent them from any bending damage or cracking.
Page 16 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Reflow deformation inside the components. In order to prevent Temperature(℃) Soldering mechanical damage to the components, preheating is...
Page 17 Caution 4-2.Flow Soldering 　　　　　[Standard Conditions for Flow Soldering] 1. Do not apply flow soldering to chips not listed in Table 2. Table 2 Temperature(℃) Soldering Soldering Part Number Temperature Differential Peak Gradual Temperature ΔT Cooling ΔT≦150℃ GRT18/21/31 Preheating Peak Temperature Preheating 2.
Page 18 Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Page 19 Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
Page 20 Caution (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
Page 21 Caution (3) Example of Router Type Separator [ Outline Drawing ] Router The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation.
Page 22 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
Page 23 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor.
Page 24 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
Page 25 Notice 2. Land Dimensions Chip Capacitor 2-1. Chip capacitors can be cracked due to the stress Land of PCB bending , etc. if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
Page 26 Notice 3. Board Design When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size and material of the board. Relationship with amount of strain to the board thickness, length, width, etc.] ε= Relationship between load and strain 2Ewh...
Page 27 Notice 5.Flow Soldering ［As a Single Chip］ Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as Outer Electrode mounted on substrate.
Page 28 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.

Murata GRT21BR61C475MA02 Series Reference Sheet

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