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Murata GCM188R71H562JA37 Series Reference Sheet

Chip monolithic ceramic capacitor for automotive
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Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution
of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business
relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components
to meet their specific needs.
With the principle of "Quality Parts,Customers Priority,Honest Operation,and Considerate Service",our business
mainly focus on the distribution of electronic components. Line cards we deal with include
Microchip,ALPS,ROHM,Xilinx,Pulse,ON,Everlight and Freescale. Main products comprise
IC,Modules,Potentiometer,IC Socket,Relay,Connector.Our parts cover such applications as commercial,industrial,
and automotives areas.
We are looking forward to setting up business relationship with you and hope to provide you with the best service
and solution. Let us make a better world for our industry!
Contact us
Tel: +86-755-8981 8866 Fax: +86-755-8427 6832
Email & Skype: info@chipsmall.com Web: www.chipsmall.com
Address: A1208, Overseas Decoration Building, #122 Zhenhua RD., Futian, Shenzhen, China
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Summary of Contents for Murata GCM188R71H562JA37 Series

  • Page 1 Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components to meet their specific needs.

  • Page 2: Reference Sheet

    CHIP MONOLITHIC CERAMIC CAPACITOR FOR AUTOMOTIVE GCM188R71H562JA37_ (0603, X7R, 5600pF, 50Vdc) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) (7)Murata’s (2)T (8)Packaging (3)Temperature (4)DC Rated...
  • Page 3 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type Pre-and Post-Stress Electrical Test 2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at 150±3℃. Set for Exposure (Storage) specifications in the following table.
  • Page 4 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type The measured and observed characteristics should satisfy the 7 Operational Life Apply 200% of the rated voltage for 1000±12 hours at 125±3℃(for Δ...
  • Page 5 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type 14 Thermal Shock The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under specifications in the following table.
  • Page 6 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type 18 Board Flex Appearance No marking defects Solder the capacitor on the test jig (glass epoxy board) shown in Fig1 using a eutectic solder. Then apply a force in the direction shown in Fig 2 for 5±1sec.
  • Page 7 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type R7 : Within ±15% 21 Capacitance Capacitance Within the specified tolerance. The capacitance change should be measured after 5 min. at each specified temperature stage.
  • Page 8 Package GC□ Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Paper Tape Type Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GC□03 15000(W8P2) 30000(W8P1) 50000(W8P2) GC□15 10000(W8P2) 20000(W8P1) 50000(W8P2) GC□18 4000 10000 4000 10000 GC□21...
  • Page 9 Package GC□ Type 　(3)GC□18/21/31/32 T:0.85 rank max. (in:mm) 4.0±0.1 4.0±0.1 2.0±0.1 +0.1 φ1.5 Ａ 1.1 max. Code GC□18 GC□21 GC□31 GC□32 1.05±0.1 1.55±0.15 2.0±0.2 2.8±0.2 1.85±0.1 2.3±0.15 3.6±0.2 3.6±0.2 　(4)GC□21/31/32 　T:1.15 rank min. (in:mm) 4.0±0.1 4.0±0.1 0.25±0.1(T≦2.0mm) 2.0±0.1 0.3±0.1(T：2.5mm) +0.1 φ1.5 Ａ...
  • Page 10 め状態 単位： Package GC□ Type Fig.1 Package Chips (in:mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GC□32 max. 16.5 max. 10±1.5 20.5 max. GC□43/55 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
  • Page 11 Package GC□ Type ﾁｯﾌﾟ詰め状態 単位： 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. (in:mm) Tail vacant Section Chip-mounting Unit...

  • Page 12: Limitation Of Use

    Caution ■ Limitation of use Please contact our sales representatives or product engineers before using our products for the applications listed below which require of our products for other applications than specified in this product. 　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment 　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment 　　　⑧Disaster prevention / crime prevention equipment...
  • Page 13 Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to insure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range.
  • Page 14 Caution 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
  • Page 15 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit. 1-1.

  • Page 16: Vibration And Shock

    Caution 7.Vibration and Shock 1. The capacitors mechanical actress (vibration and shock) shall be specified for the use environment. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
  • Page 17 Caution 2.Information before mounting 1. Do Not re-use capacitors that were removed from the equipment. 2. Confirm capacitance characteristics under actual applied voltage. 3. Confirm the mechanical stress under actual process and equipment use. 4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5.
  • Page 18 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Infrared Reflow deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering...
  • Page 19 Caution 4-2.Flow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Flow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) Soldering Soldering Peak mechanical damage in the components, preheating should...
  • Page 20 Caution 4-3.Correction with a Soldering Iron 1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board.

  • Page 21: Not Recommended

    Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
  • Page 22 Caution 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is caused by bending or twisting the board. 1-1. In cropping the board, the stress as shown right may cause the capacitor to crack. Try not to apply this type of stress to a capacitor.
  • Page 23 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of a electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

  • Page 24: Operating Temperature

    Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1.Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature which will cover the operating temperature range.

  • Page 25: Pcb Design

    Notice ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
  • Page 26 Notice 2. Land Dimensions Chip Capacitor Land 2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.

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