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Murata GRM1555C1H9R0CA01 Series Reference Sheet

Chip monolithic ceramic capacitor for general
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Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution
of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business
relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components
to meet their specific needs.
With the principle of "Quality Parts,Customers Priority,Honest Operation,and Considerate Service",our business
mainly focus on the distribution of electronic components. Line cards we deal with include
Microchip,ALPS,ROHM,Xilinx,Pulse,ON,Everlight and Freescale. Main products comprise
IC,Modules,Potentiometer,IC Socket,Relay,Connector.Our parts cover such applications as commercial,industrial,
and automotives areas.
We are looking forward to setting up business relationship with you and hope to provide you with the best service
and solution. Let us make a better world for our industry!
Contact us
Tel: +86-755-8981 8866 Fax: +86-755-8427 6832
Email & Skype: info@chipsmall.com Web: www.chipsmall.com
Address: A1208, Overseas Decoration Building, #122 Zhenhua RD., Futian, Shenzhen, China
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Summary of Contents for Murata GRM1555C1H9R0CA01 Series

  • Page 1 Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components to meet their specific needs.

  • Page 2: Reference Sheet

    CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL GRM1555C1H9R0CA01_ (0402, C0G, 9pF, 50Vdc) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) (7)Murata’s (2)T (8)Packaging (3)Temperature (4)DC Rated...
  • Page 3 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Compensating Type Constant Type －55℃ to 125℃ 1 Operating R6：－55℃ to 85℃ Reference Temperature : 25℃ Temperature Range R7：－55℃ to 125℃ C8：－55℃ to 105℃ E4：10℃ to 85℃ F5：－30℃ to 85℃ L8/R9：－55℃...
  • Page 4 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Compensating Type Constant Type 11 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) in the same Resistance manner and under the same conditions as (10). Capacitance Within the specified tolerance.
  • Page 5 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Compensating Type Constant Type 16 Humidity The measured and observed characteristics should satisfy Set the capacitor at 40±2℃ and in 90 to 95% humiduty Steady the specifications in the following table. for 500±12 hours.
  • Page 6 ■SPECIFICATIONS AND TEST METHODS Adhesive Strength of Termination,Vibration Resistance,Temperature Cycle, Test method : Deflection Humidity Steady State,Humidity Load,High Temperature Load ・Test substrate ・Test substrate Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs 　　　　　　 　　 (Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin) Thickness : 1.6mm(GRM02/03/GR□15: t:0.8mm) Thickness : 1.6mm(GRM02/03/GR□15: t:0.8mm)
  • Page 7 Package GRM/F Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GR□02 40000 (W4P1) GR□03 15000(W8P2) 30000(W8P1) 50000(W8P2) 20000 50000 10000 50000 GR□15 (Dimensions Tolerance:±0.05) 10000(W8P2)
  • Page 8 Package GRM/F Type (in:mm) 　(2)GR□03/15(W8P2 CODE:D/E/J/F) *1,2：2.0±0.05 4.0±0.1 ： +0.1 φ1.5 Ａ Ａ 0.05 max. GR□03 GR□03 GR□15 GR□15 GR□15 GR□15 （ （ （ （ （ （ Dimensions Dimensions Dimensions Dimensions Dimensions Dimensions Code Tolerance Tolerance Tolerance Tolerance Tolerance Tolerance ）...
  • Page 9 Package GRM/F Type 　(4)GR□18/21/31/32 　T:0.85 rank max. (in:mm) 4.0±0.1 4.0±0.1 2.0±0.1 +0.1 φ1.5 Ａ 0.8 max.(T=0.5mm) 1.15 max.(T≦0.85mm) GR□18 GR□18 GR□18 （ （ Code GR□21 GR□31 GR□32 Dimensions Tolerance Dimensions Tolerance (Dimensions Tolerance ） ） ±0.15within ±0.2 L:±0.2/ W,T:±0.1） 2.0±0.2 2.8±0.2 1.05±0.1 1.10±0.1...
  • Page 10 Package GRM/F Type (in:mm) (6)GR□43/55 8.0±0.1 4.0±0.1 0.3±0.1 +0.1 φ1.5 *：2.0±0.1 Ａ +0.2 φ1.5 2.5 max.(T≦1.8mm) 3.7 max.(T=2.0/2.5mm) 4.7 max.(T≧2.8mm) Code GR□43 GR□55 A *2 *2 Nominal value B *2 JEMCGP-01796...
  • Page 11 め状態 単位： Package GRM/F Type Fig.1 Package Chips (in:mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GR□02 8.0 max. 5±1.5 GR□32 max. 16.5 max. 10±1.5 20.5 max. GR□43/55 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
  • Page 12 Package ﾁｯﾌﾟ詰め状態 単位： GRM/F Type 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. Tail vacant Section Chip-mounting Unit Leader vacant Section...
  • Page 13 Caution ■ Limitation of use Please contact our sales representatives or product engineers before using our products for the applications listed below which require of our products for other applications than specified in this product. 　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment 　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment 　　　⑧Disaster prevention / crime prevention equipment...
  • Page 14 Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to insure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range.
  • Page 15 Caution 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
  • Page 16 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit. 1-1.

  • Page 17: Vibration And Shock

    Caution 7.Vibration and Shock 1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. 2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor. Do not use a fallen capacitor because the quality and reliability may be deteriorated.
  • Page 18 Caution 2.Information before mounting 1. Do Not re-use capacitors that were removed from the equipment. 2. Confirm capacitance characteristics under actual applied voltage. 3. Confirm the mechanical stress under actual process and equipment use. 4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5.
  • Page 19 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Infrared Reflow deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering...
  • Page 20 Caution 4-2.Flow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Flow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Temperature(℃) deformation inside the components. In order to prevent Soldering Soldering mechanical damage in the components, preheating should...
  • Page 21 Caution 4-3.Correction with a Soldering Iron 1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board.

  • Page 22: Not Recommended

    Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
  • Page 23 Caution 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is caused by bending or twisting the board. 1-1. In cropping the board, the stress as shown right may cause the capacitor to crack. Try not to apply this type of stress to a capacitor.
  • Page 24 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of a electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

  • Page 25: Operating Temperature

    Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1.Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature which will cover the operating temperature range.

  • Page 26: Pcb Design

    Notice ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.

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