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Fuji IGBT Module
Application Manual
March, 2023
REH984f

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Summary of Contents for FujiFilm IGBT

  • Page 1 Fuji IGBT Module Application Manual March, 2023 REH984f...
  • Page 2 Cautions This manual contains the product specifications, characteristics, data, materials, and structures as of March 2023. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this manual, be sure to obtain the latest specifications. Fuji Electric Co., Ltd.
  • Page 3: Table Of Contents

    Chapter 3 IGBT Module Selection and Application Notes 1. Selection of IGBT Module Ratings 2. Static Electricity Countermeasures 3. Protection Circuits Design 4. Cooling Design 5. Gate Drive Circuits Design 6. Parallel Connection 7. Mounting Notes 8. Storage and Transportation Notes 9.
  • Page 4: Selection Of Igbt Module Ratings

    1.1 Voltage rating The IGBT must have voltage rating that is suitable with the input voltage of the system in which it will be installed. Table 3-1 shows the IGBT voltage ratings and applicable input voltages. Use this table as a reference when selecting modules for a particular voltage application.
  • Page 5 1.4 RBSOA Make sure that the IGBT turn-off voltage and current operating trajectories are within the RBSOA specifications. Using the IGBT beyond the RBSOA region may destroy the product. 1.5 Diode inrush current When using the rectifier diode or FWD for rectifier application, a large inrush current will flow to charge the DC smoothing capacitor when the power is turned on.
  • Page 6: Static Electricity Countermeasures

    V If voltage is applied between C-E of IGBT while G-E is open as shown in Fig. 3-1, the IGBT may be destroyed. This is because the current i flows from the collector to the gate due to changes in the collector voltage, causing the gate voltage to rise and turn-on the IGBT.
  • Page 7: Protection Circuits Design

    IGBT module has to be fully considered. First, calculate the loss of the IGBT module. Based on that loss, select a heat sink that will keep T below the limit. If the heat sink design is insufficient, the temperature may exceed T...
  • Page 8: Parallel Connection

    On the other hand, excessive concave warpage or distortion will create gaps between the IGBT module and the heat sink, which will result in poor heat dissipation and may lead to thermal failure.
  • Page 9 If reflow soldering method is used, the solder inside the IGBT module may remelt and affect its reliability. In this case, Fuji Electric Co., Ltd. is not responsible for the product performance and appearance.
  • Page 10: Storage And Transportation Notes

    8. Storage and Transportation Notes 8.1 Storage (1) The products should be stored at an ambient temperature of 5 to 35 C and humidity of 45 to 75%. If the storage area is very dry, a humidifier may be required. In such case, use only deionized water or boiled water, since the chlorine in tap water may corrode the product terminals.
  • Page 11: Reliability Notes (Lifetime Design)

    IGBT module to be exposed to thermal stress, which may shorten its lifetime depending on the operating conditions. Therefore, it is necessary to design the lifetime of the IGBT module to be longer than that of the power converters.
  • Page 12: Other Precautions

    10. Other Precautions Be sure to install an adequate fuse or circuit breaker between the power supply and the product in case the product is destroyed by an unexpected accident to prevent secondary destruction such as fire, explosion, and spread of fire. In environments containing acids, alkalis, organic substances, corrosive gases (hydrogen sulfide, sulfurous acid gas, etc.), and corrosive liquids (cutting fluid, etc.), the product may oxidize or corrode, resulting in poor contact, disconnection, short circuit, ground fault, etc.

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