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1
Replaceable Components
EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN 'COMMENTS' BELOW
COMPONENT LOCATION
P = Primary side
S = Secondary side
REPAIR METHOD
HA = Hot Air (removal & mounting)
ST = Soldering Tool (removal & mounting)
HA/ST = Hot Air for removal - Soldering Tool for mounting
BGA = BGA Station
BH = Bottom Heater
ADDITIONAL INFORMATION
1 (2,3,4, etc.) = Proceed to 'Additional Repair Info' for further instructions in the indicated section(s).
1287-4315 Rev 3
Sony Mobile Communications AB – Company Internal
3(10)
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